Duties and Responsibilities:
1. Reporting to Plating Manager, Manufacturing Director and also Managing Director.
2. Continuously improving productivity including yield loss reduction, cost reduction, achieving Company’s KPI, managing of production progress on a daily, weekly and monthly basis by analysing output, identifying issues, troubleshoot and sharing the results internally and also with HQ Japan and other overseas’ affiliated companies.
3. Coordinate and sharing plating process, technical support and know-how with headquarter in Japan to realize the efficiency and effectiveness of the productivity as a whole.
4. Effectively plan and manage the die-set, machines, materials, manpower planning, and production schedules in order to optimize production quantity and produce high quality products, by making the right decision so as to maximize the results.
5. Responsible for obtaining and executing new technology / machinery investment materials, data, information and plans, including department annual budgeting, long-term budgeting, and investment planning, analysis, justifying and sourcing.
6. Identify problematic equipment / processes / products for investigation, analysis, and discussion with relevant departments.
7. Create and explain presentation materials for daily meetings and monthly management reviews. Coordinate, incorporate and optimize comments and opinions from other Departments on related issues.
8. Participate in HQ Japan and oversea affiliated company’s technical meetings to exchange and sharing technical information, disseminating it to subordinates and executing improvement activities.
9. Optimizing production line scheduling and manpower planning in line with production planning schedules to achieve quality output.
10. All other ad-hoc duties assigned by management including but not limited to ISO related issues and plating process.
Requirements:
1. A bachelor's degree in any field with over 2 years of working experience in electronic components and in integrated circuit leadframes in the semiconductor industry of which with at least 2 years of working experience are related to etching or plating process.
2. Able to read and write Japanese at the business level as require to liaise with Japanese-speaking HQ personnel and overseas affiliated companies (please specify the JLPT level when applying).
3. Extensive knowledge of manufacturing processes, including integrated circuit leadframes, equipment and plating machine.
4. Confident in analysing and solving production-related problems and collaborating with other departments.
5. Able to travel for business engagement.
