Salary negotiable if candidate with excellent conditions
Work location in China
Job Responsibilities
1. Responsible for the development of advanced node dry etching process, formulate development plan and implement it.
2. Responsible for the stability of dry etching process and CPK improvement.
3. Troubleshooting of abnormal conditions of dry etching process equipment and uptime improvement.
Qualifications
1. Master degree or above, major in microelectronics, physics, chemistry, materials, electrical engineering and other science and engineering related majors, with relevant knowledge reserves of semiconductor physics, device physics, integrated circuit manufacturing, etc.
2. More than 5 years of dry etching process R&D and mass production experience in 12-inch integrated circuit foundry, familiar with the basic knowledge of semiconductor manufacturing and etching related processes.
3. Familiar with the mainstream ICP/CCP/RIE equipment and its performance in the industry, deeply understand the correlation between equipment parameters and processes, and successfully complete the development of at least one new product and new process.
4. Have strong ability to discover and solve problems, and have the hands-on ability to actively solve process and equipment problems at work.
5. Good conduct, rigorous work, good organization, communication and coordination skills, strong pressure resistance, strong professionalism and sense of responsibility.
