As Sr/Engineer for PDE Technology Development Process Integration, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for NAND, mNAND and DRAM, Controller in Micron. To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip/package interaction, equipment capability and process technology in the industry and the ability to enable best technology for New Technode & Product Introduction with assembly packaging requirements. You will also be required to drive & collaborate with multi-functional teams to resolve assembly process related problems.
Key Responsibilities
Ensure smooth transition from new process development, 1st qualification success to small volume production launch
- Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode (NPI) requirements and schedule
- Perform process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
- Lead/partner with cross function team/site, to ensure successful transfer to CEM for LVM.
- Qualify new process/technology/equipment/materials
Implement PDE TD PMI (Product Maturity Index) methodology & provide proper Documentation for product transfer CEM & HVM
Identify path finding opportunities for continuous yield improvement and cost reduction activities
- To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
- Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.
Provide new solutions on time to meet company and customer needs
- Define, develop and establish process capabilities, strategy and roadmap
To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.
Job Requirements:
- PhD/Masters/Bachelor’s in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- At least 2 years' experience in semiconductor industry
- Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology
- Understanding of Micron’s silicon and how it interacts at backend process & package level through CPI is a plus
- Strong project management skills to ensure execution to timelines
- Strong communication and presentation skills
- Understanding of business needs and customers’ requirement
- Ability to integrate & partner with people from cross function teams
Keen on the role? Apply now!
