Key Job Accountabilities :
· Set-up wet etch and plating processes
· Write process specifications and operator instructions
· Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time
· To provide interim and long-term corrective actions for any discrepancies
· Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities
Required Experience and Qualifications :
· Requires Degree in Physics, Chemical, Material Science, Electrical/Electronics Engineering or equivalent
· Minimum 2 years of relevant experience in wafer bumping or wafer fabrication technology in wet etching chemistry, and/or Plating technology
· Ability to work on 12-hour rotating shifts or swing shift if required
