Micron Packaging R&D group is looking for highly talented individual for Wire Bond Process to develop innovative solutions for the Multi Chip Memory IC Packages.
Job Responsibilities
- Provide leadership in wire bond technology, problem analysis and resolution
- Develop and Transfer wire bond process for IC Package process technology (Wire Bond) for multichip memory packages
- Process Development & Characterization, Qualification, and production pilot run
- Work with multi-functional team to characterize new Silicon technode and develop assembly packaging/recipe solution for products requirements
- Define, plan and implement technology roadmap to meet wire bond packaging roadmaps
- Qualify and transfer packaging technology to production site
- Collaborate with other functional groups both locally and globally to develop wire bond solutions to meet the packaging business needs
- Showcase and build organization reputation by publishing technical papers and submit invention disclosures.
Job Requirements
- PhD/Masters’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering
- At least 5 years of experience in semiconductor wire bond engineering
- Good analytical and problem-solving skills, such as using Design Of Experiment and structured problem solving tools
- Self-motivated, able to work independently and self-initiative personality
- Possesses good communication skills, interpersonal skills and ability to work with global multi-functional teams
Keen on the role? Apply with us now!
Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.
