As a Quality & Reliability Assurance Engineer in Global Quality, we are encouraged to conduct electrical failure analysis and data analysis of next-generation 3D NAND memory devices. To sustain and improve Micron's memory quality, and developing outgoing monitor strategies together with risk assessment and product disposition in deviation management in HVM (high volume manufacturing( environment.
Responsibilities and Tasks
- Develop outgoing quality and reliability monitor strategies of NAND products in production phase.
- Perform product failure analysis on rejects to identify the failure mode and mechanisms that will lead to successful corrective actions and/or preventive actions.
- Assist and consult on post qualification quality and reliability issues and assist in the analysis and disposition of these materials.
- Coordinate with Research and Development and Product Engineering teams to comprehend new reliability issues and how to test for and assess their impact to customer risk and reliability.
Requirements
- Excellent problem-solving and analytical skills with strong attention to details.
- Ability to communicate clearly and concisely both verbally and in writing is essential in this role.
- Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
- Ability to work optimally in cross-functional teams and handle pressure situations in a professional manner.
- Candidates with at least 2 years of experience in the semiconductor industry as QRA or Product Engineer are preferred but fresh graduates are welcomed to apply. Experience in flash memory debugging and failure analysis is a plus.
- Bachelor's or Master's degree Electrical Engineering, Electronics Engineering, or a related discipline.
