Responsibilities:
- Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross-functional teams and customer
- Maintains documentation of customer projects starting from Kick-off, Engineering build, Qualification and Off-load to full production
- Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification
- Initiates team discussion/ review on customer document gaps/ discrepancies and recommend proposals to customer
- Plan and generate detailed customer project activity timeline, track progress and anticipate potential issues and resolve it with internal stakeholders
- Ensures that customer indices are monitored and reviewed by having regular meet-up and review of team performance
- Develop and grow people project management skills, adopting on dynamic changes and crisis management
- Drive for productivity improvement and cost reduction in process integration
- Work with TPM/ Sales/ customer for new design win and handle NPI engineering activities- reliability / Yield and Quality issue
Requirements:
- Degree/Diploma in Electrical/Electronics, Engineering or equivalent
- Minimum 3 years of Engineering experience in Semiconductor manufacturing industry
- Preferably with Project Management Certification
- Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred
- Knowledge on WLCSP bumping process of 2P2M; DOE/SPC / FMEA /JMP/ APQP standard
- Bumping process knowledge on (Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred
