Responsibilities
- Process module ownership involving Bonding process characterization and advanced process development for 3D NAND and beyond.
- Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3-D NAND nodes.
- Transfer Bonding processes to high volume manufacturing (Fab10N), and work on continuous improvements to manufacturability.
- Address process issues working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
- Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.
- Advanced 3D NAND Bonding process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
- Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions.
- Identify process simplification opportunities and drive cross functional teams in implementation.
- Incorporate best known manufacturing methods into early development phase of upcoming nodes.
- Design and implement advanced process monitoring and control methodologies.
- Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment.
- Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
- Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
- Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
- This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
- Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.
Requirements
- PhD in Materials Science, Chemical Engineering or Physics with minimum 5 years hands-on experience in leading edge bonding equipment and hybrid bonding process development experience.
- Familiarity with Bonding equipment operation, optical metrology and profilometry
- In-depth understanding of Bonding process mechanisms
- Understanding of various integration and structural impacts and constraints related to bonding process.
- An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
- Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
- Working knowledge of Design of Experiments (DoE)
- Proven ability to collaborate with local and overseas teams on projects.
- Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
- Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
- Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously.
- Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.
- Suitable candidates may be considered for Expat posting to Singapore from overseas locations.
