Responsibilities
- Responsible for daily operational equipment issues and strategize recovery actions to support production requirement.
- Perform equipment buy-off and qualification for machine installation, modification, upgrade and maintenance.
- Involve in WLCSP process (Taping & Detaping, Wafer Mount, Backgrinding, Laser Grooving, Laser Mark, Dicing, AOI, Die Sort etc)
- Monitor and analyse equipment performance and reliability.
Requirements
- Diploma / Higher NITEC / NITEC in Electronic / Electrical / Mechanical / Mechatronics Engineering or equivalent.
- Tape and Reel experience in wafer level and knowledge on vision system is preferred.
- Possess strong analysis and good teamwork.
- Good communication and interpersonal skills.
- Able to commit to either 12-hr permanent day / night shift.
