This role is within Package and Development Engineering (PDE) group of Micron. This is a global department with teams located in USA, Singapore, Malaysia, Taiwan, and India. As a PDPE (Package Device Product Engineer) in PDE, you will be responsible to prepare for new DRAM, NAND or MNAND products and coordinate resources, testing, and analysis over the lifecycle of the product. You will run data analysis and modelling, create, and maintain root cause analysis documentation, analyze parametric, probe level (Front End) and electrical test (Back End) data and respond to failures. In this role, you will work with various Technology Development (TD) & New Product Introduction (NPI) Engineering (Electrical Failure Analysis (EFA), Physical Failure Analysis (PFA), Assembly) and Manufacturing groups to find the root causes of the failed units.
Responsibilities and Tasks
- Enable new test signals in BE which would capture assembly related failures.
- Work with Test Solution Engineering (TSE) & Product Engineering (PE) to ensure standardize test coverages & chars. Define Char limits, and approval of any test related changes.
- Development of new out-of-control-action-plan (OCAP) and its sustenance
- Provide Lot disposition based on parametric data observation in case of out-of-control (OOC) trigger.
- Ensure that Silicon & assembly process meets Product expectations by extracting and analyzing Probe and BE test data.
- Participate in Phase Gate review meetings, presenting the data analysis and deciding on Phase Gate exits related to electrical Test data.
- Analyze test failures, coordinating EFA & PFA to identify the root cause. Implement fixes for fails (Fab process or Design or Assembly Process)
- Finding out the correlation of test failures to assembly process and updating the database with the signatures observed
- Support Global and Local material review board (MRB) in case of excursions and RMA related to package intrinsic design. This includes analyzing electrical test data for root cause analysis (RCA) and assessing the health of the contained material.
Requirements
- Bachelors/ Masters in Electronics, Device Physics, Applied Physics, Electrical
- Sound knowledge of device physics
- Knowledge in Engineering Statistics
- Experience in data (electrical) analysis and modelling (JMP, Spotfire is a plus)
- Experience in programming (Python or Perl)
- Effective communication skills in written and spoken English
- Good multitasking and organizational skills, able to make decisions in complex situations
- Excellent problem solving and analytical skills
- Experience in NAND / DRAM memory or related field
- Knowledge in semiconductor packaging assembly processes
- Experience in fabrication processes, electrical characterization techniques, metrology techniques
