Position title : Power Packages Designer x 2 (Junior / Senior level)
Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : Up to 10k (Depends on market and candidate's last drawn)
Interested applicants can also send your resume to WA:+65 8839 3566 (Ms Angel) and allow our Consultant to match you with our Clients.
No Charges will be incurred by Candidates for any service rendered.
LIEW ONN KEE REG NO : R22108518
THE SUPREME HR ADVISORY EA NO:14C7279
Responsibilities:
- Design with Customer support innovative package based on technologies for Semiconductor Power Applications using IGBT, GaN, SiC and Si Mosfet devices with device driver integration where reasonable
- Perform design rule checks (DRC) and edit data to comply with manufacturing guidelines. (DFM)
- Identify limitations of the design and suggest improvements to meet DFM for new products. Provide feedback on process critical dimensions and product features.
- Itemize and correspond to design Issues with customers.
- Perform Package layout, identifying stackup specifications as appropriate and prepare designs for production
- Identify and lead any prototype work required in early design stage to verify use of new technology or concepts in product or process design to reduce risk and improve profitability.
- Recommend new design concepts and validate the concept feasibility using thermal/electrical modelling
- Perform package reliability test according to the Semi standard specifications to ensure and improve the package robustness according to the mission profile defined by the customer or by application.
- Follow the customer characterization and qualification of the power package
- Provide technical support to process engineers to evaluate and provide strategy for advanced processing / implementation of product packaging
Requirements:
- Degree / Diploma in Electronic Engineering or equivalent
- Good engineering foundation and technical knowledge
- PCB / Substrate manufacturing knowledge
- 2D and 3D design know-how ( AutoDesk preferred )
- Background on semiconductor packaging and assembly processes
- Knowledge with semiconductor power packaging assembly (interconnection, epoxy encapsulation, thermal dissipation, electrical impedance)
- Must be willing to travel both international and domestic as required to remote plants, facilities, customers or suppliers.
- Senior and Staff level with at least 5 years experience in related field.
