As a Package Development Engineering Key Equipment Group (PDE KEG) engineer, you will be primarily responsible for identifying, selecting, evaluating new equipment (highly automated and computerized) / new technology to support current and future requirement for advantage packaging technology. You will also be responsible for installation and qualification of new equipment platform and handover to production group (Equipment Maturity Index, EMI). In addition, tasks include maintaining a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new equipment platform, collaborating with production group on upgrades of existing production equipment through continuous improvement projects
JOB RESPONSIBILITIES:
Identify, select, and evaluate new equipment/ new technology to support current and future requirements
- Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
- Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
- Work with equipment suppliers to develop new capability
- Engage in active participation in Package Development Engineering activities
- Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
- Create decision matrix for equipment and material selection
Evaluate and qualify new equipment platform and handover to production group
- Plan/submit capital request to acquire new Equipment
- Create and owner of purchasing specification (Doc2) document
- Establish the new equipment qualification criteria and activities roadmap with respective functional teams
- Establish project handover requirements and procedures upon machine qualification
- Prepare documentation for handing over with respective site owner
- Conduct data gathering for low volume production
- Conduct training for Site representatives
- Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects
Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform
- Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
- Maintain and regularly update the TOR, with inputs from local or other assembly site
- Maintain general knowledge of process and material characteristics and translate to equipment design requirement
- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need
Equipment System Readiness, Enablement & Enhancement
- Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
- Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
- Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support
Supplier Management & Engagement Program
- Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
- Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
- Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies
Job Requirements/ Qualifications:
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
- Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
- Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
- Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication (verbal & written) and presentation skills
- Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
- Strong project management skills to ensure execution to timelines
