Research Engineer
As part of National Semiconductor Translation and Innovation Center (NSTIC), the candidate will be involved in the development of heterogeneous integration process for realizing multi-functional photonic devices. The candidate will work closely with multidisciplinary team with diverse expertise.
Responsibilities
- Develop, design, and optimize die-to-wafer bonding process employing III-V semiconductor material, Lithium Niobate on Insulator (LNOI), and Si-based material platforms.
- Design of experiments (DOE) for various Die-to-Wafer (D2W) bonding methodologies.
- Liaise between design, fabrication, and testing teams to ensure smooth process integration and device fabrication.
- Metrology, data analysis, and documentation
- Present and discuss experimental data to the team
Qualifications
- Degree in Electronics Engineering, Microelectronics, Physics, or equivalent.
- Experience in semiconductor industry is preferred. Those with strong familiarity with wafer-to-wafer and die-to-wafer bonding process may be considered for a senior position.
- Good critical thinking and problem-solving ability.
- Able to work with cross-functional team, with good communication/presentation skill.
- Able to work in a fast-paced and collaborative environment
