Total 3 job vacancies by Black Sesame Technologies (singapore) Pte. Ltd.

Position Overview:

Black Sesame Technologies is seeking a talented and innovative Machine Learning Research Scientist with expertise in software/hardware co-design to drive advancements in autonomous driving technologies. This role offers a unique opportunity to bridge the gap between machine learning algorithms and hardware design, contributing to high-performance, efficient, and scalable solutions for AI-driven systems.

Responsibilities:

• Conduct in-depth research and analysis of cutting-edge machine learning algorithms, with a primary focus on applications in autonomous driving.
• Monitor and forecast industry trends in AI technologies to identify opportunities for innovation and improvement.
• Evaluate the computational and memory requirements of various AI models and operators, identifying optimization opportunities.
• Collaborate closely with chip architects and engineers to design and implement software/hardware co-designed solutions that enhance chip performance, efficiency, and scalability.
• Develop comprehensive technical documentation and presentations to effectively communicate complex concepts to both technical and non-technical audiences.
• Stay connected with academic and industry research communities to remain at the forefront of AI and machine learning advancements.

Qualification/ Requirements:

• Education: Master’s or PhD in Computer Science, Electrical Engineering, or a related technical field with a strong focus on machine learning.
• Experience: Proven experience in developing and analyzing machine learning algorithms.
• Programming Skills: Proficiency in programming languages such as Python and C++.
• ML Frameworks:Hands-on experience with machine learning frameworks like TensorFlow and PyTorch, and deploying them on hardware accelerators.
• Collaboration: Demonstrated ability to work effectively in a team-oriented, cross-disciplinary environment.
• Co-Design Expertise: Strong understanding of software/hardware co-design principles and their impact on system performance is highly preferred.

Position Overview:

We are seeking a skilled Physical Design Engineer to join our team. As a Physical Design Engineer, you will be responsible for the entire process from RTL to GDS, ensuring the successful implementation of complex semiconductor chips. You will focus on block-level timing closure, formal checks, low power checks, power analysis, and signoff for block-level physical implementation. Your expertise in advanced process nodes, low-power design, and automotive chip physical design will contribute to the development of cutting-edge semiconductor products.

Responsibilities:

• Assist in the physical design process, overseeing RTL to GDS implementation for semiconductor chips.
• Achieve block-level timing closure by optimizing design constraints, performing timing analysis, and applying optimization techniques.
• Conduct formal checks to ensure designs meet functional and timing requirements.
• Perform low-power checks and analyze power consumption to optimize power efficiency.
• Collaborate with the design team to develop and implement UPF (Unified Power Format) for power management and control.
• Execute block-level Place and Route (APR), Static Timing Analysis (STA), Power Integrity (PI), Physical Verification (PV), and Formal Verification (FM) signoff processes.
• Utilize Synopsys and Cadence APR (Automated Routing and Place) tools for high-quality physical design.
• Develop and employ scripts in Tcl, Perl, or Python to automate design tasks and improve the design flow.

Qualification/ Requirements:

• Bachelor's/master’s degree in electrical engineering, Computer Engineering, or a related field.
• 2-4 years of experience in physical design for semiconductor chips.
• Proficiency in RTL-to-GDS flow, timing closure, low-power design, and power analysis.
• Strong understanding of UPF for power management and control.
• Experience with block-level Place and Route (APR), Static Timing Analysis (STA), Power Integrity (PI), Physical Verification (PV), and Formal Verification (FM) signoff.
• Familiarity with Synopsys and Cadence APR/Sign-off tools.
• Proficiency in scripting languages such as Tcl, Perl, or Python for automation.
• Excellent problem-solving skills and ability to work effectively in a team environment.

Position Overview:

We are seeking a skilled Senior Physical Design Engineer to join our team. As a Senior Physical Design Engineer, you will be responsible for the entire process from RTL to GDS, ensuring the successful implementation of complex semiconductor chips. You will focus on block-level timing closure, formal checks, low power checks, power analysis, and signoff for block-level physical implementation. Your expertise in advanced process nodes, low-power design, and automotive chip physical design will contribute to the development of cutting-edge semiconductor products.

Responsibilities:

• Lead the physical design process, overseeing RTL to GDS implementation for semiconductor chips.
• Achieve block-level timing closure by optimizing design constraints, performing timing analysis, and applying optimization techniques.
• Conduct formal checks to ensure designs meet functional and timing requirements.
• Perform low-power checks and analyze power consumption to optimize power efficiency.
• Collaborate with the design team to develop and implement UPF (Unified Power Format) for power management and control.
• Execute block-level Place and Route (APR), Static Timing Analysis (STA), Power Integrity (PI), Physical Verification (PV), and Formal Verification (FM) signoff processes.
• Utilize Synopsys and Cadence APR (Automated Routing and Place) tools for high-quality physical design.
• Develop and employ scripts in Tcl, Perl, or Python to automate design tasks and improve the design flow.
• Mentor junior engineers and provide technical guidance and support as needed.

Qualification/ Requirements:

• Bachelor's/master’s degree in electrical engineering, Computer Engineering, or a related field.
• 3-5 years of experience in physical design for semiconductor chips.
• Proficiency in RTL-to-GDS flow, timing closure, low-power design, and power analysis.
• Strong understanding of UPF for power management and control.
• Experience with block-level Place and Route (APR), Static Timing Analysis (STA), Power Integrity (PI), Physical Verification (PV), and Formal Verification (FM) signoff.
• Familiarity with Synopsys and Cadence APR/Sign-off tools.
• Proficiency in scripting languages such as Tcl, Perl, or Python for automation.
• Able to guide junior colleague when needed.
• Excellent problem-solving skills and ability to work effectively in a team environment.