Total 30 qc engineer job vacancies in Art / Design / Entertainment category in Toa Payoh

Job Responsibilities:

• Advanced low-power physical design/integration flow development.
• Full-chip floor planning and place & route.
• Power network design and analysis.
• Support signoff timing closure, power integrity, and signal integrity.
• Physical Verification using DRC, LVS.

Requirements:

• Bachelor's degree or above in Electronics, Computer Science, or related fields.
• Experience on high performance and low-power physical design.
• Experience on deep sub-micron process technology (12nm and below) taped outs.
• Excellent interpersonal and communication skills.

• Knowledge of submicron semiconductor technology
• Familiar with digital ASIC/SOC design flow from RTL to silicon characterization
• Familiar with Synopsys and Cadence EDA tools for Simulation, Synthesis, Timing (STA), Formal and Assertion based verification, etc.
• Familiar with design and programming languages: Verilog, System Verilog, Python, Perl, C, C++, etc.
• Familiar with code base management method including subversion, git, GitHub, etc.
• Ability to apply analytical and problem-solving skills
• Strong written and verbal communication skills, ability to negotiate design features and options
• Knowledge of embedded system design, verification, and product development lifecycle
• Deep knowledge and domain know-hows in one or more areas below is a big plus.

We are seeking an Engineer with Silicon photonics experience to work on photonics integrated chips design and engineering. The scientist will work on device design, photonic circuit and layout with commercial Si photonics fabrication and optical to electronic testing and measurements. In addition, engineer work on advanced packaging knowledge for chip integration.

Responsibilities

• Conduct research and development for Silicon photonics chips
• Design photonics integrated circuit
• Perform optical and photonics simulations and optimization
• Work with Si photonics foundry for fabrication
• Perform optical and electronic measurements

Qualifications

• PhD or Masters Degree in Science and Engineering, Physics or Applied Physics or related discipline to Optics and Photonics
• At least 2 years working experience
• Candidate is expected to be familiar with optical, thermal, multi-physics, and system simulation software (such as Ansys Lumerical, RSOFT, Zemax, and COMSOL) photonic layout software and understanding of Si Photonics fabrication
• Experience with optical and electronic test and measurements
• Commercial Si Photonics product design and product engineering is preferred

Job description

• Experience in UVM verification methodology
• Experience in developing and deploying state-of-the-art verification methodologies in ever-increasing design complexities, from UVM, C/C++ co-simulation, system emulation to mixed-mode simulation & formal verification
• Disciplined, quality-minded, and highly driven for excellence,
• Excellent team player and good communication skills
• MSEE/BSEE in Electrical Engineering or Computer Engineering, with 3 years of relevant experience, but are open to fresh graduates with outstanding results
• Candidates with relevant experiences would be offered as Senior or Staff, taking on higher responsibilities

Job Responsibilities:

• Schematic capture, optimization and simulation.
• Develop efficient circuit designs and digital STD cell library meeting performance, power and area target.
• Study and invent new digital STD cell circuit architecture.
• Work with a layout designer to implement the layout of circuit.

Requirements:

• Bachelor's degree or above in Electronics, Computer Science, or related fields.
• Experience on high performance and low-power analog design.
• Experience on deep sub-micron process technology (12nm and below) taped outs.
• Excellent interpersonal and communication skills.

Job Responsibilities:

• Advanced low-power physical design/integration flow development.
• Full-chip floor planning and place & route.
• Power network design and analysis.
• Support signoff timing closure, power integrity, and signal integrity.
• Physical Verification using DRC, LVS.

Requirements:

• Bachelor's degree or above in Electronics, Computer Science, or related fields.
• Experience on high performance and low-power physical design.
• Experience on deep sub-micron process technology (12nm and below) taped outs.
• Excellent interpersonal and communication skills.

• Planning, Developing, initiating and managing all phases of projects
• Preparing documentation of critical analysis and providing suggestions for correcting errors
• Collaborating with Project Managers for proper allocation and tracking of resources
• Guiding the workers to do the work properly
• Maintaing the safety in the worksite

Job Responsibilities:

• Schematic capture, optimization and simulation.
• Develop efficient circuit designs and digital STD cell library meeting performance, power and area target.
• Study and invent new digital STD cell circuit architecture.
• Work with a layout designer to implement the layout of circuit.

Requirements:

• Bachelor's degree or above in Electronics, Computer Science, or related fields.
• Experience on high performance and low-power analog design.
• Experience on deep sub-micron process technology (12nm and below) taped outs.
• Excellent interpersonal and communication skills.

In Schneider Electric, everything we do is geared towards advancing progress and sustainability for all—our colleagues, customers, partners, and the communities and societies we serve.

Whether it's through our products, software, and services that propel the digital transformation of energy management and automation, or through our corporate citizenship and volunteer activities, we make a meaningful impact by empowering people and organizations to become more resilient, electric, and digital.

Which is where you come in. Working at Schneider Electric means working toward a cleaner, better world. You're part of a global team built on inclusion, mastery, purpose, action, curiosity, and teamwork, turning sustainability ambitions into actions.

The Role: Electromechanical Design Engineer

What will you do?

• Fulfill technical missions, with autonomy to propose/develop solutions in a technical domain. Work is given through general guidelines.
• In electromechanical & electro technical fields, create, modify, and validate bills of materials and drawings of parts and sub-assemblies, in accordance with technical specifications, customer expectations and supply chain constraints.
• Execute assigned product design - drawings and BOMs (bill of materials) according to the given technical specifications using dedicated tools (Software, database, 2D and 3D CAD system...) in autonomy.
• Apply drawing rules, tolerance analysis, standards (internal and international), project specifications, industrialization internal rules, internal processes.
• Propose improvements (method, tools, product...).
• Support the execution of verification & validation in laboratories and the analysis of results & share reports to internal customers (with possible support).
• Manage the mechanical design evolution of existing products triggered by quality improvement, customization, obsolescence, and adaptation etc.
• Provide product technical support to the plants, industrialization, customer complaints investigation etc.

What qualifications will make you successful for this role?

• Position is available to fresh graduates or 2 to 5 years relevant experience: In design and integration of electronic and mechanical components and their interfacing during the development of electro-mechanical systems.
  - Participate in cross-functional teams to define requirements, analyze feasibility, and propose solutions that meet customer needs.
  - Conduct system analysis to resolve tradeoffs and drive integration of system engineering tools and processes across platforms to optimize performance.
  - Manage resolution of system compatibility and performance issues.
  
• Design background in plastic product design, metal stamping design and die-casting design
• Highly proficient in Computer Aided Design and Engineering (High Creo proficiency required, Solid Works, Unigraphics and Auto-CAD are good for supplemental experience), to model into 2D/3D/Assembly as mandatory requirement in the mechanical design process
• Open-minded and willing to experiment within acceptable boundaries; has a creative mind to bring novel solutions into design and problem-solving
• Experience in one or more of the following fields is an added advantage: Mechanical product design experience for industrial grade products, electromechanical products, optical/lighting products, plastics material selection
  - Proven experience in 3D printing
  - Enclosure design with IP protection
  - ECAD and MCAD integration
  - Familiar with molding, stamping, die-casting fabrication process
  
• Familiar with advanced analytical tool like tolerance analysis, mold-flow analysis, creepage & clearance analysis etc.
• Able to operate various tools/equipment for development like force gauge, high precision measurement equipment, microscope etc.

What's in it for you?

• Global Family Leave
• Comprehensive medical coverage for employee and dependents
• Worldwide Employee Stock Ownership

…and more!

Let us learn about you! Apply today.

Responsibility

Formulate concepts, develop, design and debug for semiconductor front end automated equipment

Design to incorporate Semi-Standard documents in particular S2, S8, CE

Understand and review customers’ requirements

Propose alternatives for value engineering - design for manufacturing and cost

Prepare BOM, drawings and documentations for design release

Requirements:

Degree in Mechanical/Mechatronics/Aeronautical/Manufacturing Engineering or equivalent

5 to 10 years’ experience in mechanical/equipment design or related experience

Proficient with 3D CAD design software such as Autodesk Inventor, Solidworks, etc

Working knowledge of analysis tools such as FEA, FMEA, etc

Team player and able to work under pressure

Proficient in English. Mandarin will be an added advantage

• Location: Upper Paya Lebar
• 5days work
• Minimum 5 years of work experience as a Electrical design Consultant in an M&E consultancy firm
• Salary: Up to $4,200
• Interested applicants, kindly email me at: [email protected]

Responsibilities:

• Design and commissioning of building electrical systems
• Perform Lighting Power Budget calculations.
• Involve with project site meetings
• Participate in Testing & Commissioning phase of completed electrical installations.

Requirements:

Degree in Electrical Engineering

Understand and design Single Line Diagram

Job Responsibilities:-

• Utilize in-depth knowledge of Foundation IP to evaluate and qualify IP’s. Able to benchmark and optimize Std cells/IO’s/memory for optimum performance, area or power needs of a project
• Conduct Spice simulations to verify the performance and reliability of designs on RC extracted netlists
• Perform library characterization to ensure accurate timing, power, and area models. Stay up-to-date with industry trends and emerging technologies in library characterization and PPA analysis
• Help to develop and maintain EDA automation scripts to streamline CAD flow and design processes
• Modify and optimize IPQA scripts to improve efficiency and performance
• Analyze and understand both hard and soft IPs within SOC designs. Work with IP vendors to deliver custom specs needed for MXL project needs
• Review silicon reports and provide detailed analysis to identify and resolve issues
• Work closely with vendors and cross-functional teams to ensure successful project outcomes. Collaborate with design teams to ensure seamless integration of libraries and IP blocks
• Maintain comprehensive documentation of IP Vendor engagement. Troubleshoot and resolve issues related to IP, EDA tools and automation flows

Job Requirements:-

• Bachelor’s or Master’s Degree in Electrical Engineering, Computer Engineering, or a related field
• Minimum 10 years of experience in design engineering or a related field. Good understanding of the IC design flow, including front-end and back-end processes
• Proficiency in Foundation IP, Spice Simulation, Library Characterization, EDA automation scripts, and IP script modifications. Familiarity with library characterization tools such as Liberate, Cadence Genus, or Synopsys Library Compiler
• Strong ability to review and analyze silicon reports and provide detailed insights. Excellent analytical and problem-solving skills
• Excellent interpersonal and communication skills for effective collaboration with vendors and team members
• Experience with advanced node technologies (e.g., 8nm, 4nm, and below)
• Experience with SOC IP design and verification
• Knowledge of emerging technologies such as FinFET, FD-SOI, or III-V semiconductors
• Familiarity with industry-standard EDA tools and methodologies
• Experience with tools such as Synopsys PrimeTime, Cadence Genus, or Mentor Graphics Questa

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Responsibilities will include, but are not limited to:

• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Work closely with cross-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
• Interact with PDE assembly team and external assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Support package technology development, including material selection, process development, DOEs, and related activities
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program milestones to ensure timely development execution.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and contribute to the Global Design, Simulation and Substrate (GDSS) team on continuous improvement efforts such as:Global design alignment activities
  Continuous improvement efforts
  Package design rules
  Package roadmaps
  Competitive Analysis review
  

Requirements:

• Master (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in semiconductor packaging industry OR PhD graduates in Electrical Engineering
• Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures, die stack-up, packaging layout optimization.
• Excellent communication skills, both oral and written in English.
• Excellent problem solving and analytic skills.
• Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
• Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
• Ability to work independently, prioritize and manage numerous projects with minimum supervision.
• A global perspective and the ability to work in a multicultural environment.

Job Description：

1. Works with the front-end design team to complete the chip floorplan , clock

architecture, and powerplan .

2. Takes charge of the physical design tasks from the Netlist to the GDS2, including P&R,

formal verification, static timing analysis, physical verification, power analysis, design for

reliability (DFR) and tapeout.

3. Researches the physical design methodology of advanced process nodes, and builds an

automatic physical design platform.

Position Requirements:

1. Holds a bachelor degree or above in electronic engineering, microelectronics, or

computer science.

2. At least 0-2 years of work experience in the digital backend design field.

1. Hands-on project experience is required.

2. Tapeout experience at advanced technology is prefered.

3. TCL , Perl or Python script development and familiar with EDA tool design will be plus.

Job Responsibilities:

• Liaise with sales team, geotechnical team and customers to collect project information
• Preparation of Tunnel Boring Machine (TBM) technical offers (Design Calculations, Datasheet, Scope of supply, Method Statement, and other Supporting Documents)
• Clarification of technical requirements and technical solutions with various subsidiaries
• Order and review technical drawings with Drafting Department
• Participate in development of technical databases
• Provide technical support to sales team and project teams

Job Requirements:

• Bachelor's Degree in Mechanical Engineering
• Some knowledge of TBM technology will be advantageous
• Ideal candidate should be a fast learner and industrious
• Possess good interpersonal and effective communication skill
• Excellent team play who can also work well independently with minimum supervision and results-oriented in a fast-paced environment
• Good written and spoken English, additional language will be an added advantage
• Good computer literacy skills with software like Microsoft and/or windows applications

Job description:

• Coordinate with relevant parties to conduct site survey for the feasibility of Solar PV system installation or on-site technical support.
• Prepare Module arrangement layout, single line diagram, inverter arrangement layout using AUTOCAD. Able to interpret, review and work out design and construction drawings as well as construct 2D drawings in AutoCAD
• Perform PV syst simulation according to design drawings and specification to provide energy yield
• Perform shading analysis using stretch up tool
• Technical review on designs, specifications and operational matters on projects and related activities, through engineering and calculations such as voltage drop, fault current calculation and etc.
• Understand the basic design principles of a solar photovoltaic systems, with sufficient experience working in the industry
• Familiar with solar PV installations for distributed rooftop and utility scale PV projects
• Familiar with design software such as PVSyst, AutoCAD, Sketchup etc.

Requirements:

• Possesses Diploma in Electrical Engineering/Renewable energy related field or equivalent experience. Fresh graduates are welcome.
• Has understanding and knowledge of electrical designs and specifications of High Tension and Low Tension systems.
• Effective team player to ensure timely delivery of work
• Ability to take ownership and work independently under light supervision.
• Enthusiastic, adaptable, and goal-oriented
• Able to contribute and work efficiently as a team member and achieve objectives as a group rather than as an individual

SKILLS/COMPETENCIES & PREFERRED CHARACTERISTICS

• Can-do attitude, problem solver
• Ability to work in Fast Pace Environment
• Knowledge of Microsoft Office and Excel
• Flexible and Willing to learn
• Be a motivated individual who has acquired a good understanding of work ethics and driven to work objectively

• Responsible the package design integration activities by working with cross-functional team and partners for package technology development, including material development, process development, DOEs, and related activities.
• Work with a cross-functional team across several geographies to create package design databases such as package stack-up, wire-bond fanout, route-study, substrate layout, wire bond/Die placement diagrams, and other design documentation.
• Work with Business Unit Package Design Lead and cross-functional team to establish a Packaging Roadmap.
• Contribute to package design rules and system development.
• Participate in packaging IP development activates and industry benchmarking.
• Work with Substrate and PCB (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements with packaging solutions.

Requirements:

• Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 7 years of experience in semiconductor packaging industry.
• Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures and die stack-up.
• Excellent communication skills, both oral and written in English.
• Excellent problem solving and analytic skills.
• Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
• Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
• Ability to work independently, prioritize and manage numerous projects with minimum supervision.
• A global perspective and the ability to work in a multicultural environment.

Job Responsibilities:-

• Responsible for pre-silicon RTL coding of block, subsystem and top level SOC Integration
• Develop robust and reusable Code and ensure VHDL or Verilog implementation enables readiness for Verification, Synthesis, DfT and Low Power Insertion
• Develop reusable RTL Code, using Generic and Modular Coding Styl
• Contribute to verification plan from specification and in coordination with architects
• Collaborate on Timing constraints, Testability and Insertion of Low Power Structure such as Power gating, Isolation and Retention Sequential Elements
• Own Linting, CDC, RDC and collaborate with Verification Team and Physical Design
• Co-work with Architecture/ Design/Validation/SW teams. Own cross functional micro-architecture and implementation and drive issues to closure

Job Requirements:-

• Bachelor Degree or Master's in Electronics Engineering with 8 to 10 years and above of related working experience
• Expert in VHDL and Verilog Coding, Front End Design using best-in-class methodology and Micro-architecture
• Good experience in developing Multi-Million gates IP and integrated heterogenous complex SoC, including Analog and Mixed Signal IP
• Participated in Micro-architecture Specification
• Familiar with Hardware-Software Partitioning, Multi-CPU and Multi-Core Architecture
• Deep knowledge and understanding of NoC and multi-layer complex Interconnect Systems
• Solid verification skills in problem solving, constrained random testing and debugging
• Deep understanding of design architecture and possess meticulous attention to details
• Expertise with Code Linting tools and Static Code checker such as Spyglass, Real Intent, etc
• Expertise in IP-XACT, Connectivity Checks, Register Interfaces and RTL Assembly Tools
• Programming experience in C/C++/assembly/SVA
• Good experience in working with ARM and ARM Eco-system, AXI, AHB, SERDES systems, communication peripherals(UART, I2C, SPI) and power management
• Experience in WiFi/DOCSIS/Ethernet/DSP/DDR is a plus
• Setup Automated regressions environment and in general automate repetitive verification tasks to enhance productivity
• Strong team player and communicator

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Job Responsibilities:-

• Collaborate with concept team on frontloading activities to develop and review high level specification
• Develop micro-architecture of digital blocks/modules
• RTL design using VHDL/Verilog HDL coding
• Perform quality checks e.g. Linting, CDC, code coverage
• Collaborate with functional verification team on test plan and debug/fix failing test cases
• Provide synthesis constraints and involve in DFT insertion, timing closure and area optimizations
• Pre/post-silicon system validation debug and bring up support
• Prepare micro-architecture document for detailed design reviews with project team
• Prepare task list, effort estimate and commit to schedule

Job Requirements:-

• Degree or Master's in Electronics and Communication Engineering or equivalent with focus on Digital Design
• Minimum 8 years of ASIC or SoC/IP design experience
• Hands-on experience in micro architecture development, RTL coding, linting, CDC, constraining timing paths
• Basic understanding on verification and test cases development
• Pre/post-silicon system validation debug and bring up support
• Familiarity with Synopsys and Cadence EDA tools for simulation and quality checks
• Know-how of low power techniques and methodology
• System knowledge in communication domain and its interface protocols
• Knowledge of packet processing, Ethernet interface protocols and standard , clock and reset and CPU subsystem
• Strong ability to use analytical skills to solve complex problems
• Good communication and interpersonal skills
• Experience to work with cross functional and multi-site teams

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

Job Responsibilities:-

• Responsible for toplevel and blocks whose complexity is at the limit of current tool capacity
• Responsible for all aspects of physical implementation, include floor-planning, physical synthesis, clock-tree synthesis, parasitic extraction
• Responsible for IO ring design and bump implementation, meeting ESD, EMI and SSO requirements
• Implementation of Low power layout methodology (multiple switchable power domains, level shifter)
• Execution of static and dynamic drop, ramp up analysis using Redhawk
• Perform static timing analysis to handle complex timing closure
• Work with other design engineer in Synthesis, Design for Testability, STA/timing closure and Equivalent checks to resolve issues

Job Requirements:-

• Master’s/Bachelor’s Degree in Electrical/Electronics Engineering with an emphasis in IC design with minimum 5 years or more related experience
• Experience with complex Low Power SOC in 16nm/7nm, 5nm is a plus
• Good experience with Cadence or Synopsys implementation tool (Tempus, Innovus, DC, ICC2, Fusion Compiler), experience with Cadence implementation tool is a plus
• Experience in Mentor Verification tool, Calibre
• Experience in Redhawk
• Proficient in TCL code, python knowledge is a plus
• Able to work in a multi-cultural team with a strong drive to excel
• Good written and communication skills

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

As a NAND Silicon Design Validation Senior/Principal Product Engineer at Micron Technology, Inc., you will be responsible in developing, validating, characterizing, and qualifying new state-of-the-art NAND Flash memory products. In this role, you will be involved in pre-silicon conceptual design and preparation work, run simulations, create and maintain design and validation documentation, analyze bench and parametric data as well as to debug & resolve yield, quality and reliability failures due to design related issues. You will also refine and develop best known methods and automation for design validation of current and future products.

You will also be responsible to work with NAND R&D, Designers and other various Engineering functional groups to troubleshoot, develop and validate new designs to meet specific product requirements. Product Engineers are the key product-specific point of contact for critical issues and act as the main interface between Research and Development, Manufacturing, Business Units, and Quality Assurance departments.

Responsibilities:

• Responsible for new product startup to deliver product specifications and requirements
• Define and validate product configuration parameters
• Create validation flow for silicon design margin characterization and validation in volume.
• Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations
• Identify design marginalities and recommend design fix for circuit-related problems
• Perform electrical failure analysis to understand the root cause of device marginalities or failures
• Utilize engineering bench and testers to perform device characterization and electrical failure analysis

Qualifications/requirements:

• At least bachelor degree from electrical/electronicsor Computing engineering.

Job Responsibilities:

· Liaise with sales team, geotechnical team and customer to collect project information

· Preparation of TBM (tunnel Boring Machine) technical offers (Design Calculations, Datasheet, Scope of supply, Method Statement, and other Supporting Documents)

· Clarification of technical requirements and technical solutions with various subsidiaries

· Order and review technical drawings with Drafting Department

· To support Herrenknecht Asia Headquarters (HAQ) sales activities of Japanese construction companies within Asia region

· Support of project manager during the execution of projects; participate in design meetings and help to prepare required technical documents.

· Assist the field service activities in Japan with required technical documents and meetings.

Job Requirements:

· At least an associate degree in Mechanical or Civil Engineering

· With 1 to 3 years of relevant working experience in the tunnelling or relevant industry

· Some experience in steel structure manufacturing or machinery fabrication would be preferred

· Possess good interpersonal and effective communication skill. An excellent team play who can also work well independently with minimum supervision and results-oriented in a fast-paced environment

· Good written and spoken Japanese to liaise with Japanese-speaking clients

· Good computer literacy skills with software, eg. Microsoft and/or windows applications

• Examine Structural Drawings provided by consultants.
• Support the Design Manager in overseeing consultants during both the Tender stage and Site implementation phase.
• Conduct initial structural design analysis / conceptual design to aid in Tender costing. Aid the project and operation teams in resolving structural design challenges.
• Ensure adherence to design procedures in accordance with the OHSQ Management System.
• Plan and manage design tasks and schedules to ensure timely and accurate production and approval of shop drawings.
• Communicate with clients regarding design details of shop drawings and suggest alternatives when necessary.

Requirement:

• Minimum 5 years experiences in shop drawings preparation for large scale projects.
• Candidate must prossess Professional Engineers Board recognized Degree in Civil/Structure Engineering with relevant design working experience
• Familiar with Auto CAD software and knowledge in BIM software will be an added advantage

Reg no. R1659970

Electronics Design Engineer/Assistant;

• Degree/Diploma in Electronics/Electrical Engineering.
• Minimum 5 years if extensive PCB layout experience and familiar with Altium Design Software.
• PCB layout (gerber), provide BOM, testing instruction for PCBA.
• Ability to offer alternative parts for EOL components.
• Debugging, testing of PCBA failure and provide appropriate corrective actions in meeting customers specifications.
• 5-day work week (8:00am to 5:30pm)
• Close liaison with production team on manufacturing process.
• Liaison with sub-contractor on engineering issues where applicable.
• MS office proficiency.
• Salary S$4,000 to S$5,000/- pending experience in Design & Testing capability.
• Those with less experience will start as Assistant Design Engineer (S$3,300 to S$4,000)
• Only those with relevant PCBA design experience need to apply
• Bilingual
• 5-day work-week (8:00am to 5:30pm)
• Location; Toa Payoh

Job Responsibilities:

· Liaise with sales team, geotechnical team and customer to collect project information

· Preparation of TBM (tunnel Boring Machine) technical offers (Design Calculations, Datasheet, Scope of supply, Method Statement, and other Supporting Documents)

· Clarification of technical requirements and technical solutions with various subsidiaries

· Order and review technical drawings with Drafting Department

· To support Herrenknecht Asia Headquarters (HAQ) sales activities of Japanese construction companies within Asia region

· Support of project manager during the execution of projects; participate in design meetings and help to prepare required technical documents.

· Assist the field service activities in Japan with required technical documents and meetings.

Job Requirements:

· A degree in Mechanical or Civil Engineering

· With 1 to 3 years of relevant working experience in the tunnelling or relevant industry

· Some experience in steel structure manufacturing or machinery fabrication would be preferred

· Possess good interpersonal and effective communication skill. An excellent team play who can also work well independently with minimum supervision and results-oriented in a fast-paced environment

· Good written and spoken English and Japanese to liaise with Japanese-speaking clients

· Good computer literacy skills with software, eg. Microsoft and/or windows applications