Total 3 sales advisor job vacancies in Manufacturing / Production category in d27 yishun sembawang

Overview

Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our powerful, award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. Diversity, equity & inclusion are integral parts of our culture and drivers of innovation at Keysight. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

Keysight's customers encounter significant cybersecurity risks, which present both opportunities and challenges for our products and solutions. Our mission, "accelerating innovation to connect and secure the world," embodies our purpose and dedication to ensuring the security of our own products. To fulfill this mission, we must prioritize cybersecurity within Keysight and in the products and solutions we provide to our customers.

Job Description:

As a Product Security R&D Engineer at Keysight Technologies, your primary responsibility will involve close collaboration with the Product Security Applications team. Your task will be to integrate secure development methodologies into all our products and services. This includes working with embedded Windows and Linux platforms across various operating systems. The overarching goal of our Product Security Programs is to ensure that all Keysight products meet the necessary regulatory security standards and requirements before they are shipped out.

Team Overview: The Product Security Applications Team, established in Singapore in 2017, is an R&D team dedicated to enhancing the security standards of Keysight products. Their focus is on making sure our products are safe and secure for our end customers. As the sole R&D security team within Keysight, their primary objective is to continually elevate the security baseline of our products.

Responsibilities:

• Collaborate with product development teams throughout different stages of the development lifecycle to integrate product security requirements using Keysight’s Windows and Linux platforms.
• Provide technical support for product security assessments, utilizing tools such as composition analysis, vulnerability management, penetration testing, and fuzz testing. Additionally, assist development teams in devising strategies to address and mitigate identified vulnerabilities.
• Provide technical support for third party open-source license compliance.
• Support and/or recommend third-party tools to assess the security posture of our products in alignment with recognized industry standards.
• Understand and implement product security programs across all operating system (OS) platforms used by Keysight’s products.

Basic Qualifications:

• Bachelor’s degree in computer science/engineering or equivalent experience with security technologies.

Desired Qualifications:

• Experience in software development using C/C++, JavaScript, and Python programming languages.
• Good understanding of common application and network protocols, cryptographic technologies, and common security threats on OS designs (including Linux, Windows, and mobile platforms).
• Strong interest in software engineering, security application development, and security assessment.
• Ability to thrive in dynamic and highly technical organizations.
• 1-2 years of experience working with product development/engineering and security expertise.

Fresh graduates with security-related internship experiences and security knowledge may also be considered

• You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
• You will work closely with package design & technology, test & product engg, production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes.
• Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams.
• Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction.

Qualifications:

• PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes.
• Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc.
• Good team player, result oriented individual, experienced in project management, failure analysis tools, techniques and TQM. Good analytical, problem-solving skills. Flexible and agile.
• Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment.
• Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice.
• Experienced AutoCAD user. Knowledge of silicon & PCB fabrication, board assembly processes, are an added advantage

• You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
• You will work closely with package design & technology, test & product engg, production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes.
• Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams.
• Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction.

•Qualifications:

• PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes.
• Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc.
• Good team player, result oriented individual, experienced in project management, failure analysis tools, techniques and TQM. Good analytical, problem-solving skills. Flexible and agile.
• Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment.
• Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice.
• Experienced AutoCAD user. Knowledge of silicon & PCB fabrication, board assembly processes, are an added advantage