Total 5 manufacturing engineer job vacancies in Science / R&D / Research category in Singapore

Staff Bumping R&D Engineer

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Leadframe, Laminates, or Flipchip, Bumping, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 2-5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Staff Leadframe R&D Engineer

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Leadframe, Laminates, or Flipchip, Bumping, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 4-10 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Staff Power Module R&D Engineer

Support process and efficiency improvement activities

• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Staff Lithography R&D Engineer

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Lithography, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Power Module R&D Engineer

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 2-5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.