Total 15 ui designer job vacancies in Singapore

Position:

Our team is starting an exciting project to develop RF/mm-wave ICs for the future of communication for Beyond-5G to 6G applications. We are looking for an exceptional candidate with relevant expertise to join us. Our team focuses on developing communication modules for both terrestrial and non-terrestrial needs. You will work at the Institute of Microelectronics (IME) to create the most advanced semiconductor technologies. You will collaborate with world-leading industries and academic institutions on innovative designs and strategic intellectual properties.

Job Responsibility:

• Benchmarking with datasheets, prior arts, and latest academic work.
• In-depth design and analysis with electrical/electromagnetic simulations.
• In-depth analysis of design robustness, optimization, and testability.
• In-depth presentations and report recording of design, layout, test and measurement, and fault analysis.
• Working independently, as a team, and with collaborators from industry and academic backgrounds.

Pre-requisites:

• A Master’s / PhD Degree in Electronics or Electrical Engineering and proven academic and industry experience are pluses.
• Experienced in designing RF/mmWave such as LNA, mixer, PA, buffer, transmission line, baluns, PLL, VCO, etc.
• Experienced in designing base-band/mixed-signal circuits, such as amplifiers, bandgap, ADC, DAC, etc., is a plus.
• Knowledgeable in design trade-offs at the circuit-level specification.
• Experienced in designing in CMOS and SiGe technology or any other technologies like RF-SOI and compound-semiconductor is a plus.
• Proficient in using Cadence and EM tools like ADS for EM circuit simulation, IC layout, LVS, and DRC verification.
• Familiarity with IC measurement and debugging and hands-on experience with RF/mmWave equipment such as spectrum analyzer, network analyzer, oscilloscope, and probe station.
• Good publication record with a strong awareness of state-of-the-art.
• Good communication and teamwork.

Position:

Our team is starting an exciting project to develop RF/mm-wave ICs for the future of communication for Beyond-5G to 6G applications. We are looking for an exceptional candidate with relevant expertise to join us. Our team focuses on developing communication modules for both terrestrial and non-terrestrial needs. You will work at the Institute of Microelectronics (IME) to create the most advanced semiconductor technologies. You will collaborate with world-leading industries and academic institutions on innovative designs and strategic intellectual properties.

Job Responsibility:

• Benchmarking with datasheets, prior arts, and latest academic work.
• In-depth design and analysis with electrical/electromagnetic simulations.
• In-depth analysis of design robustness, optimization, and testability.
• In-depth presentations and report recording of design, layout, test and measurement, and fault analysis.
• Working independently, as a team, and with collaborators from industry and academic backgrounds.

Pre-requisites:

• A Master’s / PhD Degree in Electronics or Electrical Engineering and proven academic and industry experience are pluses.
• Experienced in designing RF/mmWave such as LNA, mixer, PA, buffer, transmission line, baluns, PLL, VCO, etc.
• Experienced in designing base-band/mixed-signal circuits, such as amplifiers, bandgap, ADC, DAC, etc., is a plus.
• Knowledgeable in design trade-offs at the circuit-level specification.
• Experienced in designing in CMOS and SiGe technology or any other technologies like RF-SOI and compound-semiconductor is a plus.
• Proficient in using Cadence and EM tools like ADS for EM circuit simulation, IC layout, LVS, and DRC verification.
• Familiarity with IC measurement and debugging and hands-on experience with RF/mmWave equipment such as spectrum analyzer, network analyzer, oscilloscope, and probe station.
• Good publication record with a strong awareness of state-of-the-art.
• Good communication and teamwork.

We are seeking a highly skilled High-Speed IO Modeling designer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (Masters/PhD) , with a focus on high speed circuit modeling, statistical analysis, jitter analysis, digital signal processing, and signal integrity. The successful candidate will play a crucial role in developing IO performance models for chiplet-based high-speed communication protocols and generating complete high-speed link performance matrices based on advanced packaging.

Key Responsibilities:

• Develop IO performance models (Tx, Rx) for chiplet-based high-speed communication protocols such as UCIe, AIB, and others.
• Create complete high-speed link models by integrating IO performance models with advanced packaging interconnects.
• Generate comprehensive high-speed link performance matrices, considering various parameters such as technology node, area, latency, power, number of channels, micro bump pitch, and frequency of data rates.
• Collaborate with cross-functional teams to ensure the successful integration of IO performance models into the overall system design.
• Develop parameterised PDN model and fluent in analysing SI and PI simulations
• Stay up-to-date with the latest advancements in high-speed IO modelling techniques and technologies, and apply this knowledge to improve existing models and develop new ones.

Required Qualifications:

• Master's degree in Electrical or Computer Engineering with 2+ years of relevant experience, or a PhD in Electrical or Computer Engineering with 1+ years of relevant experience.
• Strong understanding of package/interconnect/I-O modelling, statistical analysis, jitter analysis, digital signal processing, and signal integrity.
• Experience in mixed-signal circuit design for High-Speed IOs (e.g AIB, AXI, UCIe).
• Proficiency in IBIS-AMI specification and model creation using Keysight ADS.
• Programming and scripting skills in one or more of the following: Python, Perl, C/C++, TCL, or AEL.

Preferred Qualifications:

• Ability to develop and implementing high-speed IO performance models using industry-standard tools/methodologies.
• Experience with advanced packaging technologies and their impact on high-speed link performance.
• Strong problem-solving skills and the ability to think creatively to overcome technical challenges.
• Excellent communication and collaboration skills, with the ability to work effectively in a team environment.

Position:

Our team is starting an exciting project to develop RF/mm-wave ICs for the future of communication for Beyond-5G to 6G applications. We are looking for an exceptional candidate with relevant expertise to join us. Our team focuses on developing communication modules for both terrestrial and non-terrestrial needs. You will work at the Institute of Microelectronics (IME) to create the most advanced semiconductor technologies. You will collaborate with world-leading industries and academic institutions on innovative designs and strategic intellectual properties.

Job Responsibility:

• Benchmarking with datasheets, prior arts, and latest academic work.
• In-depth design and analysis with electrical/electromagnetic simulations.
• In-depth analysis of design robustness, optimization, and testability.
• In-depth presentations and report recording of design, layout, test and measurement, and fault analysis.
• Working independently, as a team, and with collaborators from industry and academic backgrounds.

Pre-requisites:

• A Master’s / PhD Degree in Electronics or Electrical Engineering and proven academic and industry experience are pluses.
• Experienced in designing RF/mmWave such as LNA, mixer, PA, buffer, transmission line, baluns, PLL, VCO, etc.
• Experienced in designing base-band/mixed-signal circuits, such as amplifiers, bandgap, ADC, DAC, etc., is a plus.
• Knowledgeable in design trade-offs at the circuit-level specification.
• Experienced in designing in CMOS and SiGe technology or any other technologies like RF-SOI and compound-semiconductor is a plus.
• Proficient in using Cadence and EM tools like ADS for EM circuit simulation, IC layout, LVS, and DRC verification.
• Familiarity with IC measurement and debugging and hands-on experience with RF/mmWave equipment such as spectrum analyzer, network analyzer, oscilloscope, and probe station.
• Good publication record with a strong awareness of state-of-the-art.
• Good communication and teamwork.

Position:

Our team is starting an exciting project to develop RF/mm-wave ICs for the future of communication for Beyond-5G to 6G applications. We are looking for an exceptional candidate with relevant expertise to join us. Our team focuses on developing communication modules for both terrestrial and non-terrestrial needs. You will work at the Institute of Microelectronics (IME) to create the most advanced semiconductor technologies. You will collaborate with world-leading industries and academic institutions on innovative designs and strategic intellectual properties.

Job Responsibility:

• Benchmarking with datasheets, prior arts, and latest academic work.
• In-depth design and analysis with electrical/electromagnetic simulations.
• In-depth analysis of design robustness, optimization, and testability.
• In-depth presentations and report recording of design, layout, test and measurement, and fault analysis.
• Working independently, as a team, and with collaborators from industry and academic backgrounds.

Pre-requisites:

• A Master’s / PhD Degree in Electronics or Electrical Engineering and proven academic and industry experience are pluses.
• Experienced in designing RF/mmWave such as LNA, mixer, PA, buffer, transmission line, baluns, PLL, VCO, etc.
• Experienced in designing base-band/mixed-signal circuits, such as amplifiers, bandgap, ADC, DAC, etc., is a plus.
• Knowledgeable in design trade-offs at the circuit-level specification.
• Experienced in designing in CMOS and SiGe technology or any other technologies like RF-SOI and compound-semiconductor is a plus.
• Proficient in using Cadence and EM tools like ADS for EM circuit simulation, IC layout, LVS, and DRC verification.
• Familiarity with IC measurement and debugging and hands-on experience with RF/mmWave equipment such as spectrum analyzer, network analyzer, oscilloscope, and probe station.
• Good publication record with a strong awareness of state-of-the-art.
• Good communication and teamwork.

We are seeking a highly skilled High-Speed IO Modeling designer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (Masters/PhD) , with a focus on high speed circuit modeling, statistical analysis, jitter analysis, digital signal processing, and signal integrity. The successful candidate will play a crucial role in developing IO performance models for chiplet-based high-speed communication protocols and generating complete high-speed link performance matrices based on advanced packaging.

Key Responsibilities:

• Develop IO performance models (Tx, Rx) for chiplet-based high-speed communication protocols such as UCIe, AIB, and others.
• Create complete high-speed link models by integrating IO performance models with advanced packaging interconnects.
• Generate comprehensive high-speed link performance matrices, considering various parameters such as technology node, area, latency, power, number of channels, micro bump pitch, and frequency of data rates.
• Collaborate with cross-functional teams to ensure the successful integration of IO performance models into the overall system design.
• Develop parameterised PDN model and fluent in analysing SI and PI simulations
• Stay up-to-date with the latest advancements in high-speed IO modelling techniques and technologies, and apply this knowledge to improve existing models and develop new ones.

Required Qualifications:

• Master's degree in Electrical or Computer Engineering with 2+ years of relevant experience, or a PhD in Electrical or Computer Engineering with 1+ years of relevant experience.
• Strong understanding of package/interconnect/I-O modelling, statistical analysis, jitter analysis, digital signal processing, and signal integrity.
• Experience in mixed-signal circuit design for High-Speed IOs (e.g AIB, AXI, UCIe).
• Proficiency in IBIS-AMI specification and model creation using Keysight ADS.
• Programming and scripting skills in one or more of the following: Python, Perl, C/C++, TCL, or AEL.

Preferred Qualifications:

• Ability to develop and implementing high-speed IO performance models using industry-standard tools/methodologies.
• Experience with advanced packaging technologies and their impact on high-speed link performance.
• Strong problem-solving skills and the ability to think creatively to overcome technical challenges.
• Excellent communication and collaboration skills, with the ability to work effectively in a team environment.

Position:

Our team is starting an exciting project to develop RF/mm-wave ICs for the future of communication for Beyond-5G to 6G applications. We are looking for an exceptional candidate with relevant expertise to join us. Our team focuses on developing communication modules for both terrestrial and non-terrestrial needs. You will work at the Institute of Microelectronics (IME) to create the most advanced semiconductor technologies. You will collaborate with world-leading industries and academic institutions on innovative designs and strategic intellectual properties.

Job Responsibility:

• Benchmarking with datasheets, prior arts, and latest academic work.
• In-depth design and analysis with electrical/electromagnetic simulations.
• In-depth analysis of design robustness, optimization, and testability.
• In-depth presentations and report recording of design, layout, test and measurement, and fault analysis.
• Working independently, as a team, and with collaborators from industry and academic backgrounds.

Pre-requisites:

• A Master’s / PhD Degree in Electronics or Electrical Engineering and proven academic and industry experience are pluses.
• Experienced in designing RF/mmWave such as LNA, mixer, PA, buffer, transmission line, baluns, PLL, VCO, etc.
• Experienced in designing base-band/mixed-signal circuits, such as amplifiers, bandgap, ADC, DAC, etc., is a plus.
• Knowledgeable in design trade-offs at the circuit-level specification.
• Experienced in designing in CMOS and SiGe technology or any other technologies like RF-SOI and compound-semiconductor is a plus.
• Proficient in using Cadence and EM tools like ADS for EM circuit simulation, IC layout, LVS, and DRC verification.
• Familiarity with IC measurement and debugging and hands-on experience with RF/mmWave equipment such as spectrum analyzer, network analyzer, oscilloscope, and probe station.
• Good publication record with a strong awareness of state-of-the-art.
• Good communication and teamwork.

Position:

Our team is starting an exciting project to develop RF/mm-wave ICs for the future of communication for Beyond-5G to 6G applications. We are looking for an exceptional candidate with relevant expertise to join us. Our team focuses on developing communication modules for both terrestrial and non-terrestrial needs. You will work at the Institute of Microelectronics (IME) to create the most advanced semiconductor technologies. You will collaborate with world-leading industries and academic institutions on innovative designs and strategic intellectual properties.

Job Responsibility:

• Benchmarking with datasheets, prior arts, and latest academic work.
• In-depth design and analysis with electrical/electromagnetic simulations.
• In-depth analysis of design robustness, optimization, and testability.
• In-depth presentations and report recording of design, layout, test and measurement, and fault analysis.
• Working independently, as a team, and with collaborators from industry and academic backgrounds.

Pre-requisites:

• A Master’s / PhD Degree in Electronics or Electrical Engineering and proven academic and industry experience are pluses.
• Experienced in designing RF/mmWave such as LNA, mixer, PA, buffer, transmission line, baluns, PLL, VCO, etc.
• Experienced in designing base-band/mixed-signal circuits, such as amplifiers, bandgap, ADC, DAC, etc., is a plus.
• Knowledgeable in design trade-offs at the circuit-level specification.
• Experienced in designing in CMOS and SiGe technology or any other technologies like RF-SOI and compound-semiconductor is a plus.
• Proficient in using Cadence and EM tools like ADS for EM circuit simulation, IC layout, LVS, and DRC verification.
• Familiarity with IC measurement and debugging and hands-on experience with RF/mmWave equipment such as spectrum analyzer, network analyzer, oscilloscope, and probe station.
• Good publication record with a strong awareness of state-of-the-art.
• Good communication and teamwork.

We are seeking a highly skilled High-Speed IO Modeling designer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (Masters/PhD) , with a focus on high speed circuit modeling, statistical analysis, jitter analysis, digital signal processing, and signal integrity. The successful candidate will play a crucial role in developing IO performance models for chiplet-based high-speed communication protocols and generating complete high-speed link performance matrices based on advanced packaging.

Key Responsibilities:

• Develop IO performance models (Tx, Rx) for chiplet-based high-speed communication protocols such as UCIe, AIB, and others.
• Create complete high-speed link models by integrating IO performance models with advanced packaging interconnects.
• Generate comprehensive high-speed link performance matrices, considering various parameters such as technology node, area, latency, power, number of channels, micro bump pitch, and frequency of data rates.
• Collaborate with cross-functional teams to ensure the successful integration of IO performance models into the overall system design.
• Develop parameterised PDN model and fluent in analysing SI and PI simulations
• Stay up-to-date with the latest advancements in high-speed IO modelling techniques and technologies, and apply this knowledge to improve existing models and develop new ones.

Required Qualifications:

• Master's degree in Electrical or Computer Engineering with 2+ years of relevant experience, or a PhD in Electrical or Computer Engineering with 1+ years of relevant experience.
• Strong understanding of package/interconnect/I-O modelling, statistical analysis, jitter analysis, digital signal processing, and signal integrity.
• Experience in mixed-signal circuit design for High-Speed IOs (e.g AIB, AXI, UCIe).
• Proficiency in IBIS-AMI specification and model creation using Keysight ADS.
• Programming and scripting skills in one or more of the following: Python, Perl, C/C++, TCL, or AEL.

Preferred Qualifications:

• Ability to develop and implementing high-speed IO performance models using industry-standard tools/methodologies.
• Experience with advanced packaging technologies and their impact on high-speed link performance.
• Strong problem-solving skills and the ability to think creatively to overcome technical challenges.
• Excellent communication and collaboration skills, with the ability to work effectively in a team environment.

We are seeking a highly skilled High-Speed IO Modeling designer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (Masters/PhD) , with a focus on high speed circuit modeling, statistical analysis, jitter analysis, digital signal processing, and signal integrity. The successful candidate will play a crucial role in developing IO performance models for chiplet-based high-speed communication protocols and generating complete high-speed link performance matrices based on advanced packaging.

Key Responsibilities:

• Develop IO performance models (Tx, Rx) for chiplet-based high-speed communication protocols such as UCIe, AIB, and others.
• Create complete high-speed link models by integrating IO performance models with advanced packaging interconnects.
• Generate comprehensive high-speed link performance matrices, considering various parameters such as technology node, area, latency, power, number of channels, micro bump pitch, and frequency of data rates.
• Collaborate with cross-functional teams to ensure the successful integration of IO performance models into the overall system design.
• Develop parameterised PDN model and fluent in analysing SI and PI simulations
• Stay up-to-date with the latest advancements in high-speed IO modelling techniques and technologies, and apply this knowledge to improve existing models and develop new ones.

Required Qualifications:

• Master's degree in Electrical or Computer Engineering with 2+ years of relevant experience, or a PhD in Electrical or Computer Engineering with 1+ years of relevant experience.
• Strong understanding of package/interconnect/I-O modelling, statistical analysis, jitter analysis, digital signal processing, and signal integrity.
• Experience in mixed-signal circuit design for High-Speed IOs (e.g AIB, AXI, UCIe).
• Proficiency in IBIS-AMI specification and model creation using Keysight ADS.
• Programming and scripting skills in one or more of the following: Python, Perl, C/C++, TCL, or AEL.

Preferred Qualifications:

• Ability to develop and implementing high-speed IO performance models using industry-standard tools/methodologies.
• Experience with advanced packaging technologies and their impact on high-speed link performance.
• Strong problem-solving skills and the ability to think creatively to overcome technical challenges.
• Excellent communication and collaboration skills, with the ability to work effectively in a team environment.

The Microelectromultiphysical system (MEMS) team at Institute of Microelectronics (IME), Singapore is looking for a reconfigurable metasurface research scientist. The scientist will work with a multidisciplinary team and contribute to the development of metasurface-based technologies for terahertz wireless communication devices.

The job responsibilities will include:

• Designing terahertz metasurface for dynamic beam control for application in reconfigurable intelligent metasurfaces (6G RIS)
• Developing comprehensive electromagnetic simulation models of metasurface
• Developing analytical and equivalent circuit models of terahertz metasurfaces
• Developing the process flow for fabrication of terahertz metasurface by working with process integration team to ensure successful fabrication of devices.
• Specifying integrated circuit and packaging requirements for metasurface devices and communicating the requirements to the respective teams
• Building terahertz test setups and PCB circuits for characterizing reconfigurable metasurface devices

Job Requirements:

• Ph.D. in Electrical Engineering / Mechanical Engineering / Applied Physics or equivalent
• Minimum 3 years of experience in metasurface design (PhD work can be counted)
• Good intuition and a deep understanding of fundamental electromagnetic principles of metasurface.
• Experience in terahertz domain and/or beam steering design is preferred.
• Knowledge of typical terahertz metasurface fabrication processes, with some experience in microfabrication.
• Experience with electromagnetic simulation software such as CST, COMSOL, Lumerical, or HFSS
• Hands on experience in terahertz characterization is a plus
• Experience in reconfigurable metasurface is a plus
• Experience in microelectromechanical systems as active element for metasurface reconfiguration is a plus.
• Experience with layout drawing software, such as Cadence, L-edit is a plus.
• Python programming skills for data analysis is a plus.
• Good communication and presentation skills
• Ability to work independently, as well as being an excellent team player.

The Microelectromultiphysical system (MEMS) team at Institute of Microelectronics (IME), Singapore is looking for a reconfigurable metasurface research scientist. The scientist will work with a multidisciplinary team and contribute to the development of metasurface-based technologies for terahertz wireless communication devices.

The job responsibilities will include:

• Designing terahertz metasurface for dynamic beam control for application in reconfigurable intelligent metasurfaces (6G RIS)
• Developing comprehensive electromagnetic simulation models of metasurface
• Developing analytical and equivalent circuit models of terahertz metasurfaces
• Developing the process flow for fabrication of terahertz metasurface by working with process integration team to ensure successful fabrication of devices.
• Specifying integrated circuit and packaging requirements for metasurface devices and communicating the requirements to the respective teams
• Building terahertz test setups and PCB circuits for characterizing reconfigurable metasurface devices

Job Requirements:

• Ph.D. in Electrical Engineering / Mechanical Engineering / Applied Physics or equivalent
• Minimum 3 years of experience in metasurface design (PhD work can be counted)
• Good intuition and a deep understanding of fundamental electromagnetic principles of metasurface.
• Experience in terahertz domain and/or beam steering design is preferred.
• Knowledge of typical terahertz metasurface fabrication processes, with some experience in microfabrication.
• Experience with electromagnetic simulation software such as CST, COMSOL, Lumerical, or HFSS
• Hands on experience in terahertz characterization is a plus
• Experience in reconfigurable metasurface is a plus
• Experience in microelectromechanical systems as active element for metasurface reconfiguration is a plus.
• Experience with layout drawing software, such as Cadence, L-edit is a plus.
• Python programming skills for data analysis is a plus.
• Good communication and presentation skills
• Ability to work independently, as well as being an excellent team player.

The Microelectromultiphysical system (MEMS) team at Institute of Microelectronics (IME), Singapore is looking for a reconfigurable metasurface research scientist. The scientist will work with a multidisciplinary team and contribute to the development of metasurface-based technologies for terahertz wireless communication devices.

The job responsibilities will include:

• Designing terahertz metasurface for dynamic beam control for application in reconfigurable intelligent metasurfaces (6G RIS)
• Developing comprehensive electromagnetic simulation models of metasurface
• Developing analytical and equivalent circuit models of terahertz metasurfaces
• Developing the process flow for fabrication of terahertz metasurface by working with process integration team to ensure successful fabrication of devices.
• Specifying integrated circuit and packaging requirements for metasurface devices and communicating the requirements to the respective teams
• Building terahertz test setups and PCB circuits for characterizing reconfigurable metasurface devices

Job Requirements:

• Ph.D. in Electrical Engineering / Mechanical Engineering / Applied Physics or equivalent
• Minimum 3 years of experience in metasurface design (PhD work can be counted)
• Good intuition and a deep understanding of fundamental electromagnetic principles of metasurface.
• Experience in terahertz domain and/or beam steering design is preferred.
• Knowledge of typical terahertz metasurface fabrication processes, with some experience in microfabrication.
• Experience with electromagnetic simulation software such as CST, COMSOL, Lumerical, or HFSS
• Hands on experience in terahertz characterization is a plus
• Experience in reconfigurable metasurface is a plus
• Experience in microelectromechanical systems as active element for metasurface reconfiguration is a plus.
• Experience with layout drawing software, such as Cadence, L-edit is a plus.
• Python programming skills for data analysis is a plus.
• Good communication and presentation skills
• Ability to work independently, as well as being an excellent team player.

The Microelectromultiphysical system (MEMS) team at Institute of Microelectronics (IME), Singapore is looking for a reconfigurable metasurface research scientist. The scientist will work with a multidisciplinary team and contribute to the development of metasurface-based technologies for terahertz wireless communication devices.

The job responsibilities will include:

• Designing terahertz metasurface for dynamic beam control for application in reconfigurable intelligent metasurfaces (6G RIS)
• Developing comprehensive electromagnetic simulation models of metasurface
• Developing analytical and equivalent circuit models of terahertz metasurfaces
• Developing the process flow for fabrication of terahertz metasurface by working with process integration team to ensure successful fabrication of devices.
• Specifying integrated circuit and packaging requirements for metasurface devices and communicating the requirements to the respective teams
• Building terahertz test setups and PCB circuits for characterizing reconfigurable metasurface devices

Job Requirements:

• Ph.D. in Electrical Engineering / Mechanical Engineering / Applied Physics or equivalent
• Minimum 3 years of experience in metasurface design (PhD work can be counted)
• Good intuition and a deep understanding of fundamental electromagnetic principles of metasurface.
• Experience in terahertz domain and/or beam steering design is preferred.
• Knowledge of typical terahertz metasurface fabrication processes, with some experience in microfabrication.
• Experience with electromagnetic simulation software such as CST, COMSOL, Lumerical, or HFSS
• Hands on experience in terahertz characterization is a plus
• Experience in reconfigurable metasurface is a plus
• Experience in microelectromechanical systems as active element for metasurface reconfiguration is a plus.
• Experience with layout drawing software, such as Cadence, L-edit is a plus.
• Python programming skills for data analysis is a plus.
• Good communication and presentation skills
• Ability to work independently, as well as being an excellent team player.

Multimedia Designer

You will be the key support for multimedia content initiatives in SIMTech and ARTC Marketing Communications team. You should have at least 3 years of experience in creating multimedia content to support marketing communications initiatives delivered on various digital platforms such as videos, presentation slides, websites and social media graphics. You will also be required to support in procurement process for the team. This is a shared function with another team member.

Key Responsibilities:

• Work with industry development, business development and marketing communications teams to understand their needs for creatives, design and develop audio-visual content for marketing communications purposes
• Ensure adherence to A*STAR brand guidelines in all marketing communications materials
• Create audio-visual content, animations and photos for presentations, social media platforms and websites
• Create PowerPoint templates and support pitch presentation development
• Develop and manage the timely production of content and creatives
• Brief and project manage outsource vendors
• Support procurement activities for Marcomms team
• Perform other ad hoc duties as and when assigned such as event support

Requirements:

• Diploma/Degree in visual communications or equivalent
• years of experience in creative content development
• Analytical with keen problem-solving skills
• Ability to work independently and as a team
• Experience with creating visual communications for social media platforms
• Proficient with Adobe Suite
• Equipped with photography, videography, and video editing skills