Total 300 quality control engineer job vacancies in Singapore

As Facilities Utilities Engineer of Global Construction team, you will be an integral member of the Global Facilities Line Planning Group responsible for overseeing and managing the analytical duties related to facility utilities planning program, assisting in the planning and design of facilities construction and expansion projects. You will be responsible for managing Micron Facility utilities consumption assessment process, analyzing facility future needs and resource utilization analysis.

In this role, you manage utilities related projects, programs and will help to plan and prioritize resources needed to achieve results and assure accurate tracking of projects and programs to predict results and outcomes critical to success.

Responsibilities

• Collect, classify, evaluate utilities data and information used in supporting the facilities utilities consumption management and capital program.
• Create reports, charts, graphs and eventual monitoring system for Facilities Services.
• Define, manage and improve on Micron Tools Utility Matrix (TUM) Business Process.
• Drive network alignment among Micron sites in tools utility matrix (TUM) database.
• Drive network alignment across sites in Tools’ process independent utilities database and eventually moving towards alignment for Tools’ process dependent utilities database.
• Work closely with Teams from Global and Site Facilities, Global Planning, Facilities Transfer Team, CPEE & IEs to coordinate and drive facility utilities estimates for new layout, technode scenarios.
• report program status, wins, issues, and actions to program sponsor for broadcasting to global leadership team and stakeholders
• Ensure Roles, Responsibilities and Accountabilities are fully understood by the participated teams

Skills / Qualifications

Minimum Qualifications:

• The candidate should possess a BSc or Beng in Engineering from a recognized institute of higher learning.
• Experience in wafer fab facilities systems is highly valued.
• Candidates with experience in facilities operation & construction.
• Minimum 3 years of Facility or Equipment tool Management experience in Semiconductor manufacturing environment
• Demonstrable experience in the Facility or Equipment tool utilities Management and/or other relevant industries is strongly preferred.

As a Process Control System Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

As a PDE Network Engineering Process Control System (PCS) Engineer/Senior Engineer, we will be responsible to develop smart manufacturing solutions towards the Industry 4.0 standard. We will gain exposure and knowledge in many cutting-edge areas including Machine Learning, Advanced Control Solutions and Deep Learning. As a PDE PCS Engineer, we will have the opportunity to develop a complete solution that starts from requirements gathering, data analysis and modeling with big data platform, followed by system development and integration; and then network wide implementation. The work we do directly affects the bottom line of the entire company by providing scrap/excursion control, Statistical Process Control (SPC), Advanced Process Control (APC or Run-to-Run), Fault Detection and Classification (FDC), and overall enhanced process capability. We will meet regularly and team with Process areas to understand their tools, processes, and challenges and work with them to create process control models, strategies, and other methods for ensuring quality output.

Responsibilities

• We develop, implement and improve smart control solutions for optimum manufacturing performances.
• We provide technical oversight, guidance and support for process control implementation
• We conduct intensive data analysis and modeling to identify sources of variation in the process and translate it into control solutions.
• We support PDE KEG team in Classification, Characterization and Categorization and define Data Collection Requirements, Perform Integration and Setup Data Collection in E3 Environment.
• We define Analysis and setup Requirements and Setup Limits and OCAP and engage in periodic review with PCS team and network on BKM practices.
• We develop and deliver training on control systems and related topics.

Requirement

• PhD, Masters/Bachelor’s Degree in Electrical and Electronics Engineering/Computer Science/Statistics/ Mathematics/Physics
• At least 4 years of experience in semiconductor manufacturing advanced process control.
• Experience and knowledge in Programming and Data Analysis. Preferred experience in Python/R/SQL/Hadoop eco-system and/or in the development of web-based applications
• Familiar with Machine Learning.
• Good communication and interpersonal social skills.
• Excellent problem solving and analytical skills.
• Excellent verbal and written communications skills. Good interpersonal skill and a good teammate.
• Excellent Project management skills.
• Ambitious and ability to multi-task and balance dynamic priorities.
• Ability to participate in a multi-functional team environment.
• Willing and capable of international travel, as needed, to accomplish your objectives.

Keen on the role? Apply now!

As a Non-Volatile Memory Quality & Reliability Assurance (NVM QRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analysis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., Product Engineering, Product Yield Enhancement) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode.
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

As a Test Engineer at MSB, you will be responsible for developing frameworks for monitoring and improving Engineering performance to plan, providing value-add engineering solutions, and driving continuous improvement projects in Test processes. You will also provide support in product test proliferation and excursion management activities.

Responsibilities and Tasks

Develop frameworks for monitoring and improve Engineering performance to plan

• Maintain knowledge of engineering plans, forecasts and targets
• Develop systems for tracking and monitoring actual performance
• Evaluate and resolve performance issues
• Drive projects to improve performance to plan

Provide value-add engineering solutions to meet cycle time improvement, cost reduction and quality performance goals

• Participate in Test cycle time, cost and quality improvement teams
• Review and evaluate variables that contribute to cycle time, cost and quality
• Develop and implement cycle time, cost and quality improvement projects

Drive continuous improvement projects in Test processes to improve operational efficiency and productivity

• Maintain Test process, equipment, systems and product knowledge
• Perform Test efficiency and productivity analysis
• Develop and implement improvement projects

Provide support in product test proliferation activities

• Activate manufacturing test readiness team
• Verify production readiness
• Perform production validation
• Ensure qualification effectiveness and efficiency

Support Quality team in excursion management activities

• Participate in Test containment and disposition activities
• Perform and verify Test disposition system set ups
• Execute and ensure timely disposition of deviation materials

Work closely with Test planning/manufacturing/engineering teams to ensure the smooth execution of Test manufacturing operations

• Participate in Test operations review discussions
• Provide tactical engineering support

Collaborate with multi-functional Central/Site teams to overcome Test operation issues and challenges

• Investigate and identify root cause of issues
• Implement corrective actions
• Design preventive measures

Job Requirements

• Bachelors /Masters in Electrical and Electronic Engineering, or related fields.
• Knowledge of semiconductor processing, device physics, and Silicon IP.
• Self-motivated, enthusiastic, and proactive.
• Proficiency in statistics, data analysis tools, problem-solving and analytical skills.
• Excellent communication and presentation skills both oral and written.
• Ability to work independently, prioritize tasks, and manage numerous projects with minimal supervision.
• Effective collaboration across departments and with external partners.
• Familiarity with Big Data Analytics, Process Automation and Generative AI Applications will be an added advantage.
• Leadership experience
• Keen and knowledge of the semiconductor Industry
• Experiences in the development, procurement, installation, and calibration of instruments, equipment, and control devices for both New Product Introduction (NPI) and High Volume Manufacturing (HVM). Experiences in managing the operational, functional, and performance testing of semiconductors and conducts Root Cause Analysis for low yield issues and analyzing and interpreting test data, and prepares technical reports and publications.

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements

• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
• Create decision matrix for equipment and material selection

Evaluate and qualify new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

• Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

• Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
• Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
• Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support

Supplier Management & Engagement Program

• Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
• Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
• Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment
• Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication (verbal & written) and presentation skills (English speaking is must)
• Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements

• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
• Create decision matrix for equipment and material selection

Evaluate and qualify new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

• Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

• Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
• Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
• Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support

Supplier Management & Engagement Program

• Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
• Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
• Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment
• Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication (verbal & written) and presentation skills (English speaking is must)
• Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines

As a Non-Volatile Engineering Group (NVEG) Engineer / Senior Product Engineer in NAND Component Reliability team at Micron Technology, Inc., you will be part of NAND product development team responsible for developing and executing NAND component reliability test strategies for Micron's newest NAND products. You will be working with a group of Engineers to test and characterize Micron's latest NAND product in all Product Reliability aspects, defining reliability gaps and work with cross functional teams to drive for resolution and to achieve product qualification on time.

Additionally, you will be working closely with NAND product, Design, R&D, Fab and Quality teams and your success will be significantly contributing to Micron's strategic objective of maintaining Technology and Product leadership.

Key Responsibilities:

• Work with NAND Reliability Architecture /TD/Media architecture/System integration teams to define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
• Responsible for NAND Component Reliability testing execution to meet the aggressive timeline by managing the project schedule and collaborating with Reliability Operation teams for test plan execution.
• Analyze large amounts of reliability data and present it to cross functional teams to assess reliability capacity, defining reliability gaps and drive for resolution and improvements.
• Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
• Work closely with Global Quality team to define qualification plan, review the qualification execution progress and drive for qualification gating issue resolution.

Requirements:

• Degree in Electrical & Electronics Engineering or related disciplines.
• Good understanding of NAND device operation, Reliability testing and NAND-System integration.
• Good knowledge of semiconductor processing and device physics.
• Good knowledge of statistics and data analysis tools.
• Excellent Problem solving and Analytical skills.
• Effective communication and presentation skills.
• Self-motivated and enthusiastic.

We are looking for a Package-Silicon Integration Engineer in Micron's Package Development Engineering(PDE) Group, who will be responsible for driving advanced package development for next generation silicon and package technologies. You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

RESPONSIBILITIES include but are not limited to:

• Work with package design and development teams to complete chip package interaction risk assessment.
• Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules/FMEA.
• Work with die designers to enable design for manufacturing in area like die size, scribe width and pad size.
• Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
• Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
• Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
• Identify technology, quality, business process gaps and develop solutions.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

• Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field
• 5-7 years of semiconductor fab experience in Chip package interaction and integration
• Strong Project / Program management skills
• Possess sound methodology for organizing work, decision-making and setting priorities
• Strong analytical, problem solving, and organizational skills
• Proficiency in computer applications like Excel, Word, Power Point.
• Self-motivated and team-oriented.
• Strong interpersonal, oral and written communications-skills.

Keen on the role? Apply now!

As a Senior/Engineer, Equipment in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time.

Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Key Responsibilities :

• Install equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
• Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
• Work with process development team to quantify benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
• Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
• Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
• Design and implement advanced equipment monitoring and control methodologies.
• Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
• Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
• Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.

Requirements :

• Bachelor's degree in Electrical & Electronics, Chemical, Mechanical, Materials Engineering or equivalent.
• Minimum 2 to 3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Self-motivated and adaptable to a fast paced environment, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent communication and interpersonal skills to collaborate with various stakeholders both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

Responsibilities:

• Review, validate and monitor budgets, funds, expenditures, forecasts, and contingency drawdown for respective projects throughout the entire project lifecycle.
• Review cost estimates, develop and maintain forecasts, and cost control plans for assigned projects.
• Track and analyze project expenditures, identifying variances from budgets and recommending corrective actions.
• Conduct cost risk assessments and develop mitigation strategies to minimize budget deviations.
• Support to review and analyze material contracts and contractor subcontracts, ensuring alignment with project specifications and budget parameters.
• Manage and track change orders associated with material contracts and subcontracts, ensuring proper cost control carried out and approval processes is in accordance to Micron’s Construction Management of Change (CMOC)
• Support in reviewing estimate and justification for change according to Micron’s Change Management process.
• Collaborate with project teams across engineering, procurement, and construction disciplines to identify cost-saving opportunities.
• Analyze financial data to identify trends, discrepancies, and opportunities for cost savings, presenting findings to management and recommending actions.
• Monitor and verify project costs, including materials, labor, and equipment, ensuring accurate cost allocation based on Work Breakdown Structure (WBS) and financial reporting.
• Carry out regular updates to WBS dictionary and ensure standardization is effectively used throughout the project.
• Prepare comprehensive cost reports and presentations for project stakeholders. Maintain a strong understanding of cost control principles and best practices within the semiconductor industry.
• Utilize cost control software and tools to manage project financials effectively.
• Implement and oversee cost auditing processes to ensure compliance with company policies and financial regulations, identifying and resolving discrepancies.

Qualifications:

• Bachelor's degree in Engineering, Construction Management, Quantity Surveying, Finance, or a related field.
• 7 to 10 years of working experience in the Construction Industry
• Minimum 3+ years of experience in cost control, preferably within the semiconductor industry or a similar capital projects environment.
• Strong understanding of cost estimating, budgeting, and forecasting methodologies.
• Excellent analytical and problem-solving skills.
• Proficient in Microsoft Office Suite (Excel, Word, PowerPoint) and cost control software.
• Meticulous attention to detail and a strong work ethic.
• Excellent communication and interpersonal skills, with the ability to collaborate effectively with diverse teams.

Preferred Qualifications:

• Experience with Contingency Drawdown management and Quantitative Cost Risk Analysis (QCRA)
• Experience with Earned Value Management (EVM) principles.
• Knowledge of semiconductor manufacturing processes and equipment.

As Environment, Health and Safety (EHS) senior engineer, you will be responsible for the implementation of Fab10’s EHS programs at the site. You will conduct/coordinate EHS training to employees, conduct periodic EHS audits and surveys to identify level of implementation and efficiency of EHS management system, identify potential gaps or improvement opportunities and recommend measures and improvement plan to management. You will also be liaising with external organizations on EHS compliance issues.

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities and Tasks

• Ensure Micron's safety programs and procedures are effective, efficient, and conform to the Management System and regulatory requirements
• Develop and implements functional, cost-effective solutions for safety issues
• Coordinates, manages, and conducts safety walks, inspections, and audits to ensure operations comply with Micron safety procedure and regulatory requirements
• Responds to emergencies and investigates incidents and recommends preventive/corrective action
• Collect, analyze, and communicate safety related metrics and performance measurements.
• Support ISO System by participating in internal audits to continuously improve our safety program and procedures.
• Identify, develop, and provide safety training in accordance with company goals and objectives,

Education & Qualifications

• Bachelor's degree in occupational health and safety or related filed e.g. Engineering
• Safety and Health Certifications eg. Certified Safety Professional, WSH Safety Officer Certification, ISO auditor training and certification
• Experience with ISO 45001:2018 Occupational Health and Safety Management System
• Ability to read and develop understanding and interpretation of safety regulations
• Strong interpersonal communication and collaboration Department
• Minimum 4 years + of experience in related field

Develops, implements and monitors company safety programs and policies. Ensures compliance with government health and safety regulations. Conducts employee training in emergency response, life safety, industrial hygiene, and chemical and fire hazards. Conducts safety surveys and recommends corrective action where occupational hazards exist. Responds to emergencies and investigates accidents and recommends corrective action. Completes required federal, state and local government reports relating to safety.

As the Facilities Electrical Engineer, you will lead engineering and maintenance efforts for on-site electrical equipment and systems. With guidance from the Facilities organization, you will work towards achieving the goals of the facilities department, site, corporate facilities, and the company as a whole.

Job Responsibilities:

• Adhere to environmental safety policies, standard operating procedures, and quality standards. Perform risk assessments and maintain good housekeeping practices.
• Gain experience in maintaining and commissioning electrical systems up to 230kV, including emergency generators, Rotary UPS, and power quality equipment.
• Provide support for operational issues and root cause analysis using standard problem-solving techniques.
• Review and support capacity analysis for electrical systems.
• Review and advise on scope, schedule, and cost estimates for infrastructure additions or modifications. Supervise progress and provide engineering and design support during construction.
• Conduct risk and failure mode and effects analysis to eliminate single points of failure and mitigate risks.
• Guide, mentor, and certify the electrical team through classroom and site training.s.
• Participate in root cause identification for equipment and system abnormalities, conduct post-incident reviews, and implement corrective and preventive actions.
• Provide engineering support for system capacity expansion and improvement projects, ensuring alignment with production plans.
• Drive the implementation of SMART power systems, early detection, and team efficiency improvements.

Job Requirements:

• Bachelor’s Degree in Electrical Engineering required.
• Minimum 6+ years of experience in High, Medium, and Low Voltage Electrical Systems Design Maintenance and Operations, Semiconductor, and/or Facilities related Industry.
• Ability to prioritize and schedule workload and work on multiple tasks concurrently.
• Strong organisation skills and Service attitude.
• Excellent interpersonal skills and good team working skills, English Required.
• Self-motivated worker!
• Familiarity with semiconductor manufacturing and facilities systems.

As a Process Development Engineer, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

• Excellent execution on assembly process for 1st New Product Introduction (NPI) success and smooth transfer process from NPI to HVM
• Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline
• Full responsible on support NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation and documentations.
• Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline and design rules.
• Collaboration with cross functional team from NPI to LVM/HVM process transfer.
• On-time execution of NPI Customer samples and Engineering Samples build for new products and packages

SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

• Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continue improvement action, with problem solving methodology, statistical analysis and integration solution decision.
• Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
• Continuous develop in depth assembly process technical knowledge, well understand process capability/tolerance//spec limit/CpK, and utilize key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
• Global leader for cross team collaboration on network BKM, process recipe spec and recipe standardization/conversion.

Technology enablement and development – Process, Material, Equipment

• Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior 1st Qual Silicon deliver.
• Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues)
• Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensure key process technology and capability enablement is in-line.
• Frequent review and participant Competitor Analysis, to understand market trends and competitor’s technology/capability boundary
• Engage and follow PDE business process (TGR, TORB, KEG interlock) for new technology qualification, alignment and safe launch

Teamwork and General expectation

• Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross team (peers, counterpart)
• Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations and decision making.
• Develop, or coordinate development of, training materials for existing/new process
• Safety Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout and chemical safety.

Requirements:-

• Masters or Bachelor's degree in Mechanical/ Materials Engineering
• Experience in backend engineering process or package development preferred
• Good technical knowledge in component test and/or module manufacturing process
• Excellent data analysis, statistical analysis, data interpretation skills
• Ability to make sound data-driven decisions. Prioritize and apply due-diligence in day to day task.
• Possess analytical and problem solving skills
• Keen interest in semiconductor engineering
• Showcase leadership experience and potential

As an Engineer of MSB Lean Manufacturing, you will manage the implementation of Lean transformation methodologies and tools in Assembly, Test and SSD manufacturing at MSB. You will collaborate closely with site functional teams to identify, explore and implement lean methodologies and tools to drive improvements in throughput, labor productivity, yield, and cycle time performance.

Responsibilities:

• Lead the adoption and implementation of Lean methodologies and tools across Assembly, Test, and SSD manufacturing.
• Facilitate continuous improvement events across different functional teams (e.g., Kaizen, Value Stream Mapping (VSM), Projects, Workshops).
• Develop and sustain programs and systems to foster a Lean culture.
• Conduct labor productivity analyses (e.g., Touch-time, MMR, spaghetti charts) to enhance operator and technician efficiency and reduce operational errors.
• Oversee Utilization/ Overall Equipment Effectiveness (OEE) to identify key sources of losses and improvement opportunities.
• Collaborate with functional experts to identify areas for improvement through the application of Lean methodologies and tools.
• Propose Lean approaches and initiatives, including Kaizen and Continuous Improvement Projects.
• Act as the key integrator between central and site functional teams, developing, driving, and communicating progress on critical Lean improvement initiatives.
• Develop an overall view of critical initiatives and their impact on key performance indicators.
• Provide visibility on program status, including key achievements with clear ownership.
• Trigger interventions to ensure programs stay on track towards targets.
• Support regular reporting and meetings with senior leadership, including deep dives for weekly/monthly reports and ad-hoc senior management updates.

Requirements

• Bachelor’s /master’s in Industrial and system engineering, engineering management, Production & Operation Management, or related field.
• > 2 years of experience in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals in the semiconductor industry
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations

Keen on the role? Apply now!

Job Responsibilities

• Plan, design and lead mechanical system expansion projects to facilitate tool utilities demand of future technology of manufacturing equipment
  
• Responsible for Continuous improvement of preventive maintenance programs for systems to achieve optimal system performance and uptime.
  
• Maintain maintenance record for system fault history traceability, recommend and implement improvement/enhancement projects.
  
• Engage in driving system reliability improvement initiative to enable maximum equipment uptime and reduction of system interruption.
  
• Lead troubleshooting and timely response to site for system abnormities to reduce production impacts. Carry out Root cause analysis and implement action plans to prevent recurrence.
  
• Perform effective capacity tracking and planning for mechanical systems
  
• Innovate ideas, implement predictive maintenance through SMART Facilities initiative in collaboration with control team.
  
• Track and monitor equipment spare parts and consumable inventory
  
• Enforce to company’s environmental safety health policy and procedure, standard operating procedure with risk assessment, good housekeeping standard and quality policy when performing work.
  
• Utilize computer base software to document and analyses records of maintenance work order, equipment history and project tracking.
  

Job Requirements:

• Bachelor’s degree in Mechanical engineering.
  
• Design and Engineering background of mechanical system such as HVAC system and Exhaust system will be of good advantage.
  
• 5+ years of experience with mechanical facilities background in critical environment
  
• Ability to understand and use schematic, single-line drawing and related equipment and system documentation.
  
• Ability to work in a team environment with various professional level.
  
• Considerable knowledge and application of problem solving and data analysis methodology.
  
• Considerable knowledge of maintenance practices and procedure and installation work.
  

Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations.

Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings. Prepares bid sheets and contracts for construction and facilities acquisition.

Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs.

Inspects construction and installation progress for conformance to established drawings, specifications, and schedules.

Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

Your main responsibilities include:

• Develop and maintain product datasheet testing and characterization test programs for NAND and NOR components
• Working with product reliability engineers to define test flows for individual products
• Provide support to operation team to ensure seamless execution for generated test flow on the tester with live product
• Perform electrical failure analysis for failure validation and characterization

You are encouraged to apply if you can demonstrate some of the qualities listed below:

• Master's or Bachelor's degree in Engineering field. Microelectronic/Electrical/Computer Engineering fields are preferred.
• Positive attitude and self-motivation towards learning and development.
• Good analytical mindset and structured personality.
• Good written and verbal communication skills.
• Hands on experience with C++/Python and Object-Oriented Programming is a plus
• Understanding Automated Test Equipment and flash memory is a plus.
• Fresh graduates are welcome to apply.

Working location:

• 990 Bendemeer Road, Singapore 339942

As a Fab 10 Facilities Operations Transformation Engineer, you will play a pivotal role in redefining our Facilities Operations to support our advanced memory and AI applications. You will lead multiple exciting programs aimed at improving team productivity and ensuring an uninterrupted supply of plant utilities and facilities services, operating 24/7 to support Fab Production. Your innovative mentality and passion will drive continuous improvement through data, automation, and enhanced operational strategies. You will have opportunities to work with people from various backgrounds and different responsibilities.

Responsibilities and Tasks:

• Drive improvements to all existing and future Operations programs, coordinating with all Facilities system owners from all sites in Fab 10.
• Lead Post Incident Review (PIR) processes to prevent facilities supply interruptions and ensure smooth execution of critical work through the Site Incident Prevention Plan (SIPP).
• Spearhead labor productivity improvement projects, using business process improvement and automation in daily operations.
• Area Quality Coordinator (AQC), leading quality improvement programs, includes: problem-solving, quality champion, and human deviation reduction.
• Represent Fab 10 in Global Facilities AQC and Operational forums to handle, lead, and facilitate all Global Facilities operations and quality programs.
• Learn and drive improvement to Facilities daily operations, including but not limited to:
• Supervise and handle facilities equipment's and system through FMCS or equivalent, like Life safety system.
• Respond swiftly to abnormal condition affecting production or the site in general and raise it to relevant parties accordingly.
• Reponse and restore facilities services in a timely manner to minimize interruption to production or the site
• Support and implement operating procedures and risk assessments for all facilities systems and facilities-related work activities.
• Follow up on incidents or service interruptions with system owners.
• Coordinate and connect with internal and external parties for facilities operation-related activities.
• Support the shift operations ERT (Emergency Response Team).
• Support Facilities Operation meetings with the Facilities Operations Manager.
• Coordinate, handle, and improve the work permit system.
• Act as a backup for the Site Operations Manager’s functional scope if required.
• Prepare and consolidate operation reports.

Requirements:

• Bachelor in Engineering (Mechanical/Electrical/Controls and Instrumentation) or equivalent experience.
• Have experience with Facilities systems in Semiconductor Industry
• Experience and familiarity with data analytics/automation software such as: Tableau, Microsoft Excel, Python, SharePoint, Power BI, SQL.
• Ability to handle multiple tasks concurrently, prioritize and handle workload.
• Fluent digital literacy, including word processing, spreadsheet, database.
• Team player who enjoys working in a cross-functional environment and the ability to develop long term partnership across teams.
• Positive, energetic, and daring to innovate with the drive to actualize concept into plan.
• Excellent problem solving and analytical thinking!

Responsibilities:

- Assess Die Overkilling In Line and Optimization of criteria

• Define Sampling Criteria for Yield Enhancement (YE) Wafer – Initial is to align with RPM lot
• Define and Create YE In Line DL2 & MRDA Flow: Full scan with tighter criteria (higher magnification) with non-die-kill
• Create Deviation flow to Route to YE Flow
• Define and Create YE Probe Flow: Full data logging and Test-to-end to capture as much data as possible
• Data Analysis:
• Correlation of MRDA (Metro Real-time defect analysis) Defect to Probe to identify in line failure mode causing probe fail and failure analysis

- Manage Risk of deviation

- Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions

• Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
• Collaborate with peers to construct global solutions.
• Ensure conflict resolution and assist with identifying escalation paths.
• Align internal strategies and communicate line of sight to corporate strategic objectives.
• Establish and communicate department capabilities to ensure partner expectations are aligned.
• Manage conflict and build effective relationships with internal and external partners.
• Initiate and sustain effective communication with internal and external partners.
• Provide advice to senior and executive management on strategic decisions
• Establishes and manages budget/finances for the team

- Ensure a Safe, Compliant, and Ethical Work Environment

• Maintain knowledge of and apply company safety, labor, and ethics policies.
• Communicate requirements and expectations to leaders and external partners.
• Ensure execution of mandatory training for organization.
• Identify and resolve and / or report potential safety, security, and labor issues.

Requirements

• Bachelors, Masters or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• At least 4 years of experience in Semiconductor Manufacturing and on a leadership capacity, with focus on Advance Packaging technologies and High Bandwidth Memory (HBM) integration, in yield enhancement
• Experience in PWF (Post Wafer Fabrication), Backend engineering process, assembly package technology development and technical knowledge with die and wafer level process technology with understanding of Micron’s silicon and how it interacts at a package level through CPI (Chip Package Interaction), in yield enhancement
• Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
• Demonstrated ability to influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Ability to be guided by business objectives and determine best methods for delivering results.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Keen on the role? Apply now!

As a Package Design Engineer within the Package Development and Engineering (PDE) organization in Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a multi-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation. You will be ensure the completion of design activities within the project schedule and ensure that design outputs are within Assembly and vendor capability.

Responsibilities will include, but are not limited to:

• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Work closely with multi-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
• Interact with PDE assembly team and external assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Support package technology development, including material selection, process development, DOEs, and related activities
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program milestones to ensure timely development execution.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and contribute to the Global Design, Simulation and Substrate (GDSS) team on continuous improvement efforts such as:Global design alignment activities
  Continuous improvement efforts
  Package design rules
  Package roadmaps
  Competitive Analysis review

Requirements:

• Master (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in semiconductor packaging industry OR PhD graduates in Electrical Engineering
• Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures, die stack-up, packaging layout optimization.
• Excellent communication skills, both oral and written in English.
• Excellent problem solving and analytic skills.
• Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
• Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
• Ability to work independently, prioritize and manage numerous projects with minimum supervision.
• A global perspective and the ability to work in a multicultural environment.

Performs semiconductor design engineering assignments including engineering and designing packaging stack-up, layout checking, documenting specifications, modifying and evaluating packaging risk in the areas of electrical, thermal, mechanical and reliability. Reviews package design requirements, define the package stack-up and conduct final design review. Typically responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor Packaging.

Responsibilities:

- Assess Die Overkilling In Line and Optimization of criteria

• Define Sampling Criteria for Yield Enhancement (YE) Wafer – Initial is to align with RPM lot
• Define and Create YE In Line DL2 & MRDA Flow: Full scan with tighter criteria (higher magnification) with non-die-kill
• Create Deviation flow to Route to YE Flow
• Define and Create YE Probe Flow: Full data logging and Test-to-end to capture as much data as possible
• Data Analysis:
• Correlation of MRDA (Metro Real-time defect analysis) Defect to Probe to identify in line failure mode causing probe fail and failure analysis

- Manage Risk of deviation

- Provide organizational leadership to build functional strategies & processes, and collaborate with partners to deliver strategic solutions

• Establish organizational roadmaps and strategies. Apply extensive knowledge and tenacity to carry out strategies.
• Collaborate with peers to construct global solutions.
• Ensure conflict resolution and assist with identifying escalation paths.
• Align internal strategies and communicate line of sight to corporate strategic objectives.
• Establish and communicate department capabilities to ensure partner expectations are aligned.
• Manage conflict and build effective relationships with internal and external partners.
• Initiate and sustain effective communication with internal and external partners.
• Provide advice to senior and executive management on strategic decisions
• Establishes and manages budget/finances for the team

- Ensure a Safe, Compliant, and Ethical Work Environment

• Maintain knowledge of and apply company safety, labor, and ethics policies.
• Communicate requirements and expectations to leaders and external partners.
• Ensure execution of mandatory training for organization.
• Identify and resolve and / or report potential safety, security, and labor issues.

Requirements

• Bachelors, Masters or PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• At least 4 years of experience in Semiconductor Manufacturing and on a leadership capacity, with focus on Advance Packaging technologies and High Bandwidth Memory (HBM) integration, in yield enhancement
• Experience in PWF (Post Wafer Fabrication), Backend engineering process, assembly package technology development and technical knowledge with die and wafer level process technology with understanding of Micron’s silicon and how it interacts at a package level through CPI (Chip Package Interaction), in yield enhancement
• Strong leadership and vision and must be able to comfortably work across organizational boundaries and geographies.
• Demonstrated ability to influence executives, senior leaders and partners on strategic decisions across multiple functions and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Ability to be guided by business objectives and determine best methods for delivering results.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Proven facilitation skills including the ability to influence others, build consensus, and resolve conflict.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Keen on the role? Apply now!

As a Non-Volatile Engineering(NVE) Product Engineer at Micron technology Inc, you will be responsible for driving an effort to accelerate NAND development learning cycles to achieve best in class cycle time from first silicon to qualified system.

Additionally, you will work with various Engineering and Development groups to ensure necessary actions are taken to meet NAND reliability( material assessment flow) product requirements. You will be engaged in developing, validating, characterizing, and qualifying Micron's next generation 3D NAND memory products to power our customer's innovation.

Key Responsibilities :

• Define NAND Flash reliability test flow to assess the product reliability performance and ensure no intrinsic reliability issues escape to customer
• Perform high volume statistical data analysis for NAND intrinsic reliability risk assessment
• Drive Solution Space through electrical failure analysis through trims characterization with root cause understanding
• Develop short term counter measures in form of stresses/screens by exercising Digital and Analog Circuit, Device Physics, Process Engineering knowledge
• Collaborate with Fab, NAND Technology Department, NAND Design, NAND Product Development, System Development and Quality/Reliability team to develop solutions and ship end products

Requirements :

• Bachelor's Degree in Electrical Engineering or related disciplines with at least 3 years of related work experience
• Excellent understanding of NAND Flash Device Physics is required
• Knowledge of Programming Languages such as Python/C/C++ is required
• Effective communication skills in written and spoken English
• Good multitasking skills and ability to set priorities in a fast moving, dynamic environment.
• Excellent problem solving and analytical skills
• Self-motivation and enthusiasm

Responsibilities and Tasks
• Provide engineering study is to include good design practice for state-of-the-art system designs, system capacity and capability analysis, planning for future requirements, as well as code compliance.
• Maintain engineering data bases in support of capacity tracking, capital equipment facilitation, and cash flow project management for assigned systems/areas.
• Provide support for start-up of new equipment and ensure that all equipment will properly interface to other mechanical and electrical systems.
• Specify critical components for design projects and is responsible for assuring designs meet all applicable codes and regulations. The applicable code review and analysis utilizing (but not limited to): IFC, IBC, NEC, NFPA, FM, CGA and Semi standards. This requires continual review and analysis of new and existing equipment, applications, and technology.
• Perform engineering study on emerging facilities technologies to support cutting edge semiconductor processes.
• Participate in mid to long term infrastructure planning for facilities in support of the overall company plan.
• Work with in-house TGCM contractor and ensure chemical and Gas Delivery system running smoothly.
• Review and improve Operation and Maintenance SOP and RA.
• Respond to system issues. Perform Trouble Shooting with in-house TGCM contactors and OEMs.
• Verify all works done by Chemical and Gas section are in accordance with company safety guidelines;
ensure safety features are engineered into designs; and maintain good communication with other engineering disciplines and customers throughout the organization.
• All team members are required to complete their learning items within the stipulated time frame.

For business process and/or QMS component that one is responsible or accountable for:
a. ensuring the QMS/business process that is effective and conforms to requirements.
b. ensuring that the processes are delivering their intended outputs.
c. reporting on QMS/business process performance and opportunities for improvement to management.
d. ensuring the promotion of internal and external customer focus throughout the organization.
e. ensuring the maintenance of the integrity of the QMS/ business process when changes are planned and implemented.
f. ensuring customer requirements are met.

• Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws
and regulations.
• Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings.
• Prepares bid sheets and contracts for construction and facilities acquisition.
• Reviews and estimates design costs including equipment, installation, labor, materials,preparation and other related costs.
• Inspects construction and installation progress for conformance to established drawings, specifications, and schedules.
• Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

Education

• Bachelor’s degree in Chemical Engineering or equivalent discipline.

Skills, Knowledge and Abilities

• Good team work and collaboration

• Excellent communication and presentation skills

• Strong problem solving and analytical skills

• Independent and able to work on own initiative

• Good organizational skills and ability to prioritize and schedule workload

• Good knowledge of Microsoft Office

Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations. Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings. Prepares bid sheets and contracts for construction and facilities acquisition. Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs. Inspects construction and installation progress for conformance to established drawings, specifications, and schedules. Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

As a Product Development Engineer, the Non-Volatile Engineering (NVE) Product Engineering organization at Micron Technology, Inc., you will be part of a brilliant team of engineers that solves complex problems. You will be responsible for enabling Micron’s NAND products with seamless and issue free release to both internal and external non-volatile system customers.

Key Responsibilities :

• Design novel test algorithms and develop test programs for validating NAND features and commands
• Study the latest RG NAND designs, with focus on customer mode operations
• Use high-speed tester hardware to perform functional and design validation of new NAND devices
• Perform Electrical Failure Analysis during the evaluations, and investigate root causes of reported device issues
• Make use of Verilog/Synopsis VCS for simulation study and analysis
• Involvement in high-speed fail debug
• Collaborate with NAND Design, Application Engineering, Product and System teams to drive closure of device issues
• Develop and optimize deterministic usage case flow and Random Sequence Generator for validation purpose
• Automation of program development and work processes using scripting

Requirements:

• Degree in Electrical and Electronics Engineering / Computer Engineering with 1-3 years’ relevant experience in NAND related product and/or test program development
• Software development proficiency (e.g. C-based programming) and scripting (e.g. Perl, Python)
• Simulation software know-how (e.g. Verilog, Synopsis VCS)
• Excellent problem solving and analytical skills
• Good multitasking and organizational skills
• Strong presentation skills Self-motivation and enthusiasm
• Effective communication skills in written and spoken English

We’re looking for people who are passionate about reliability and want to be part of a team revolutionizing NAND process and product development.

As a key technical member of DDQA NAND team in Micron’s Global Quality team, you will collaborate with technology development and design engineering teams to predict product failure modes. You will work shoulder-to-shoulder with media health and test solution engineers to develop fault isolation strategies and create new risk assessment methods. You will orchestrate data feeds from many sources, intelligently mash them together, engineer new predictive models to guarantee product reliability. Your effort in the emerging technology will pave the success of the next best-in-class memory products with quality embedded in the design and development strategies. Qualified applicants will be seasoned in memory product architecture, characterization, fault isolation and reliability data analytics.

Micron Technology operates in a highly competitive industry where innovation depends on talented minds extracting fresh insights from an ever-expanding data universe. We work in a diverse, collaborative environment where problem solving is a team sport and creative solutions are recognized and rewarded. Does this sound like the right team for you? Good news - We’re hiring!

We're looking for applicants who have:

• Passionate in memory cell, periphery and defectivity process, product failure modes
• Solid knowledge in semiconductor device physics. Knowledge in CMOS and NAND cell reliability physics is a must
• Experience in FMEA is a must, FMEA in multiple domains is a plus, fault isolation expertise is a strong plus
• Experience with statistical analysis is a must. Knowledge in reliability statistics is a plus
• Experience with automated data analytics and scripting. Experience with machine-learning/artificial intelligence is a strong plus
• Exposure in memory testing platform, hands-on experience with NAND characterization is a strong plus
• Ability to manage multi-domain projects, promote structural problem-solving and mentor across geographical or organizational boundaries
• Excellent technical leaderships, communication, and think outside of the box

Education Requirements:

B.S. degree (or equivalent experience) in Electrical Engineering or related fields. 10 years minimum work experience in semiconductor device development or manufacturing

Responsibilities and Tasks

• Provide engineering study is to include good design practice for state-of-the-art system designs, system capacity and capability analysis, planning for future requirements, as well as code compliance.
• Maintain engineering data bases in support of capacity tracking, capital equipment facilitation, and cash flow project management for assigned systems/areas.
• Provide support for start-up of new equipment and ensure that all equipment will properly interface to other mechanical and electrical systems.
• Specify critical components for design projects and is responsible for assuring designs meet all applicable codes and regulations. The applicable code review and analysis utilizing (but not limited to): IFC, IBC, NEC, NFPA, FM, CGA and Semi standards. This requires continual review and analysis of new and existing equipment, applications, and technology.
• Perform engineering study on emerging facilities technologies to support cutting edge semiconductor processes.
• Participate in mid to long term infrastructure planning for facilities in support of the overall company plan.
• Work with in-house TGCM contractor and ensure chemical and Gas Delivery system running smoothly.
• Review and improve Operation and Maintenance SOP and RA.
• Respond to system issues. Perform Trouble Shooting with in-house TGCM contactors and OEMs.
• Verify all works done by Chemical and Gas section are in accordance with company safety guidelines; ensure safety features are engineered into designs; and maintain good communication with other engineering disciplines and customers throughout the organization.
• All team members are required to complete their learning items within the stipulated time frame.

For business process and/or QMS component that one is responsible or accountable for:
a. ensuring the QMS/business process that is effective and conforms to requirements.
b. ensuring that the processes are delivering their intended outputs.
c. reporting on QMS/business process performance and opportunities for improvement to management.
d. ensuring the promotion of internal and external customer focus throughout the organization.
e. ensuring the maintenance of the integrity of the QMS/ business process when changes are planned and implemented.
f. ensuring customer requirements are met.

• Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations.

• Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings.

• Prepares bid sheets and contracts for construction and facilities acquisition.
Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs.

• Inspects construction and installation progress for conformance to established drawings, specifications, and schedules.

• Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

Education

• Bachelor’s degree in Chemical Engineering or equivalent discipline.

Skills, Knowledge and Abilities

​​ 3 to 5 years experience in relevant fields of Chemical and Gas system

• Good team work and collaboration

• Excellent communication and presentation skills

• Strong problem solving and analytical skills

• Independent and able to work on own initiative

• Good organizational skills and ability to prioritize and schedule workload

• Good knowledge of Microsoft Office applications

Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations. Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings. Prepares bid sheets and contracts for construction and facilities acquisition. Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs. Inspects construction and installation progress for conformance to established drawings, specifications, and schedules. Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.