Total 156 Senior Executive electronic engineer job vacancies in Toa Payoh

Ground Labs is seeking a Senior Software Engineer to join our high-performing team working on diverse products and technologies. Based in our Singapore headquarters, you'll collaborate closely with our engineering and product teams. We're a fun-loving team passionate about our work.

Who you are:

• An experienced backend or full-stack software engineer with at least 7 years of development experience.
• A champion of clean, efficient, and high-quality code
• A creative problem solver with strong analytical skills
• Self-motivated and proactive, with a passion for continuous learning of new information and technology

What you'll do:

• Develop new product functionality and fix software bugs
• Participate in all phases of software development (specification, design, development, documentation, unit testing, code reviews)
• Work with Customer Support and customers to troubleshoot and resolve issues
• Research new technologies and prototype solutions
• Contribute to software design and architecture improvements
• Manage software availability, latency, scalability, security and efficiency

What you bring:

• Degree/Diploma in a computer science or closely related field.
• Hands-on experience in modern C++ development
• Experience developing software for multiple platforms (Linux, UNIX, Windows…)
• A solid understanding of databases, computer network, software security and cloud hosting platforms
• Proficiency in design patterns and software development best practices
• Experience working in an agile environment
• Experience in developing scalable, multi-threaded, low latency systems
• Ability to work efficiently with existing codebases
• Ability to take ownership of product components
• Excellent written and oral English communication skills

Join Ground Labs and be part of our exciting journey:

We're a people-focused company that takes pride in what we do and has fun doing it. If you're a driven developer who thrives in a collaborative environment, we invite you to join our team!

Responsibilities:

· Coordinating, planning and conducting the project plan

· Project formulation and monitoring progress and schedule

· Effective communication and co-ordination between project participants

· Attend site meeting, inspect, monitor and report project progress.

· Submit and update monthly project status

· Perform other duties or tasks as assigned by immediate superior or Project Manager

Requirements:

· Degree in Civil/Structural Engineering or its equivalent

· At least 3 years relevant working experience as Project Engineer in main contractor office

· Proficient in MS Office Word, Excel and Project Scheduling software

· Bilingual with good communication skills

About us

Since the 1930s, the way we commute, socialise and even how we make payments have changed, and yet our fundamental approach to the healthcare system hasn’t.

At Ordinary Folk, we’re reimagining the building blocks of healthcare, through Noah, Zoey, and Cyrus. Noah allows men to receive remote diagnosis and treatment across varying areas of care. Through Zoey, women’s sexual wellness and fertility journeys are supported with thoughtful products and services. Cyrus, our modern logistics fleet makes ultra fast deliveries for medication with the help of AI.

Job description

As a Full-stack Engineer at Ordinary Folk, you’ll help to:

• Developing and directing software system validation and testing methods.
• Directing our software programming initiatives
• Overseeing the development of documentation.
• Working closely with clients and cross-functional departments to communicate project statuses and proposals.
• Analyzing data to effectively coordinate the installation of new systems or the modification of existing systems.
• Managing the software development lifecycle.
• Monitoring system performance.
• Communicating key project data to team members and building cohesion among teams.
• Developing and executing project plans.
• Applying mathematics, and statistics to problem-solving initiatives.
• Applying best practices and standard operating procedures.
• Creating innovative solutions to meet our company’s technical needs.
• Testing new software and fixing bugs.
• Shaping the future of our systems.

What we’re looking for from you

• Strong knowledge of HTML, CSS, and Javascript/Typescript
• Proficiency with React for client-side development and Node.js for backend development
• Experience with relational database (e.g. PostgreSQL)
• Experience in production development of RESTful APIs
• eCommerce experience. You have experience building eCommerce platforms (e.g. customer
• management, transactions, order, invoicing) and have the requisite skills to meet the technical demands.
• Startup experience. You will have a huge passion for startups and fast-growing teams. You will have been part of the journey of a successful startup.

Why join Ordinary Folk?

Our mission is to revolutionise the way people access medical treatment.

We’ve built brands tailored to the differing needs of people across diverse Asian cities, and delivered healthcare solutions the modern way — online and to your doorstep.

Working with medical professionals in each country, who are armed with decades of expertise in their specialised fields, allows us to tailor treatment plans that work for the broad range of individual needs for their local populations.

Looking for the highlights?

• We’re one of the fastest-growing healthcare companies in Asia.
• You’ll be working alongside team members who’ve joined us from companies like BBH, Grab, Unilever, Ogilvy and IDEO.
• Join a team of 40 on the ground floor of an exciting start-up ready to blast off.
• Employee equity scheme giving you a share in the company and the work we do.
• A development allowance so you can upskill yourself and your career.

What is working at Ordinary Folk like?

We’re not your stereotypical healthcare company. We’re a bunch of creatives, entrepreneurs and tech-driven individuals from a wide range of cultural backgrounds – all with a focus on delivering better health to people.

Our team is based around Asia and as long as you’re between GMT+7 and GMT+11, you can work wherever you want. We also hate overbearing managers – at Ordinary Folk, the best ideas, not the manager’s ideas, win.

Life moves pretty fast around here because speed and execution matter more than anything else. But we believe that the A+ players at Ordinary Folk need and deserve the freedom to contribute their best to the company so they can help keep our trajectory on the up.

Contact and apply to [email protected]

Project Client Management:

• Excellent execution of project towards company objectives and client satisfaction
• Good understanding of job nature
• Monitor progress of project and update project status to Superior & Finance Department
• Being efficient & manage project efficiently
• To assist engineers in day-to-day issues

Technical Competencies:

• Good understanding of local code requirements
• Good engineering knowledges in relation to company services offered(eg. M&E professional services, Green Mark Related work etc.)
• Help to review the works of the engineers assigned to you, with the objective of compliance to local authority requirements coupled with sound engineering principals

REQUIREMENTS :

• Degree in Electrical or Mechanical Engineering or equivalent.
• Minimum 5 years of working experience in M&E consulting firm.
• Strong building M&E knowledge with hands-on experiences.
• Knowledge in design and building project and relevant code of practice.
• Proficiency in AutoCAD / BIM software is an added advantage.
• Provide guidance to junior engineers.
• Able to work as a team, assertive, independant and proactive.

Interested candidates please submit updated resume via “APPLY NOW”.

Please include your availability date and expected salary in your resume.

We regret only shortlisted candidates will be notified.

1. PREPARATION OF INSTALLATION SCHEDULE

2. PREPARATION OF SUBCONTRACTOR’S CONTRACTS

3. SITE SUPERVISION AND PROGRESS MONITORING

4. EQUIPMENT & MATERIAL ARRANGEMENT, DELIVERY & CHECKING

5. SITE CO-ORDINATION MEETING

6. PREPARATION OF DAILY REPORTS, MONTHLY REPORTS, PURCHASE ORDERS & DELIVERY ORDERS

7. PREPARATION OF BUDGETARY AND CONTROL

8. PREPARATION OF SITE PROGRESS CLAIM

9. SAFETY

10. WORK QUALITY CONTROL

11. PREPARATION OF OPERATION & MAINTENANCE MANUAL

12. COMMISSIONING, PREPARATION AND MONITORING

13 PREPARATION OF AS-BUILT DRAWING

14. PREPARATION OF COST ESTIMATION

Responsibilities:

• Attend the Toolbox Meeting to explain daily tasks and coordinate work for Shimizu workers and subcontractors.
• Create a comprehensive schedule for the construction area.
• Prepare Method Statements and obtain necessary approvals from consultants.
• Collaborate with RSS teams to arrange inspections and prepare relevant inspection forms.
• Participate in daily coordination meetings to align activities with subcontractors and other areas.
• Report daily progress to the Quantity Surveyor
• Oversee CBP (Concrete Block Paving) construction, including temporary works.
• Manage RC (Reinforced Concrete) & Steel construction, ensuring temporary works are in place.
• Supervise finishing and external work construction, incorporating temporary works as needed.

Requirements:

• Bachelor of Science in Civil Engineering or equivalent
• minimum of 10 years of experience in construction management is essential, demonstrating a solid understanding of project oversight.
• Proficiency in Microsoft Excel, Word, and Office Suite is necessary for documentation, reporting, and scheduling tasks.

Responsibilities:

• To lead and drive the requirements gathering process.
• To lead and manage a small team of developers to deliver the modules to develop web-based application systems.
• Participate in the design and development of web applications based on Ecquaria’s product (J2EE-based).
• Lead and manage the user acceptance testing process.
• Implement, customize, test, document and maintain software applications.
• Ensure that the modules delivered are according to the specifications and are of high quality.

Requirements:

• A Degree/Diploma in Computer Science with at least 3 years' software development experience in Internet technology in Win NT, UNIX or LINUX platform
• Those with leadership experience may be considered for the Project Lead position.
• Technical skills include proven object-oriented programming experience with Java and C++ together with extensive RDBMS through JDBC
• Experience in J2EE, Web Services and XML will be advantageous
• Experience in Elixir reporting solutions will be advantageous
• Very strong in SQL
• Data analysis skill will be an added advantage, although this is not compulsory to have.
• Good interpersonal skills

Toppan Ecquaria is an equal opportunity employer and values diversity within our company. We welcome all interested candidates to apply for this position, however, we regret to inform that only shortlisted candidates will be contacted by us for an interview.

Find us at www.topppanecquaria.com or www.linkedin.com/company/toppan-ecquaria

For more career opportunities, please visit our career site at:- https://toppanecquaria.com/careers/job-openings?utm_source=Jobstreet&utm_medium=Page&utm_campaign=2020

(Please copy & paste the above link onto your browser)

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

As a Test Engineer at MSB, you will be responsible for developing frameworks for monitoring and improving Engineering performance to plan, providing value-add engineering solutions, and driving continuous improvement projects in Test processes. You will also provide support in product test proliferation and excursion management activities.

Responsibilities and Tasks

Develop frameworks for monitoring and improve Engineering performance to plan

• Maintain knowledge of engineering plans, forecasts and targets
• Develop systems for tracking and monitoring actual performance
• Evaluate and resolve performance issues
• Drive projects to improve performance to plan

Provide value-add engineering solutions to meet cycle time improvement, cost reduction and quality performance goals

• Participate in Test cycle time, cost and quality improvement teams
• Review and evaluate variables that contribute to cycle time, cost and quality
• Develop and implement cycle time, cost and quality improvement projects

Drive continuous improvement projects in Test processes to improve operational efficiency and productivity

• Maintain Test process, equipment, systems and product knowledge
• Perform Test efficiency and productivity analysis
• Develop and implement improvement projects

Provide support in product test proliferation activities

• Activate manufacturing test readiness team
• Verify production readiness
• Perform production validation
• Ensure qualification effectiveness and efficiency

Support Quality team in excursion management activities

• Participate in Test containment and disposition activities
• Perform and verify Test disposition system set ups
• Execute and ensure timely disposition of deviation materials

Work closely with Test planning/manufacturing/engineering teams to ensure the smooth execution of Test manufacturing operations

• Participate in Test operations review discussions
• Provide tactical engineering support

Collaborate with multi-functional Central/Site teams to overcome Test operation issues and challenges

• Investigate and identify root cause of issues
• Implement corrective actions
• Design preventive measures

Job Requirements

• Bachelors /Masters in Electrical and Electronic Engineering, or related fields.
• Knowledge of semiconductor processing, device physics, and Silicon IP.
• Self-motivated, enthusiastic, and proactive.
• Proficiency in statistics, data analysis tools, problem-solving and analytical skills.
• Excellent communication and presentation skills both oral and written.
• Ability to work independently, prioritize tasks, and manage numerous projects with minimal supervision.
• Effective collaboration across departments and with external partners.
• Familiarity with Big Data Analytics, Process Automation and Generative AI Applications will be an added advantage.
• Leadership experience
• Keen and knowledge of the semiconductor Industry
• Experiences in the development, procurement, installation, and calibration of instruments, equipment, and control devices for both New Product Introduction (NPI) and High Volume Manufacturing (HVM). Experiences in managing the operational, functional, and performance testing of semiconductors and conducts Root Cause Analysis for low yield issues and analyzing and interpreting test data, and prepares technical reports and publications.

About Us!

The Housing and Development Board (HDB) has been at the forefront of the Public Service Transformation effort, iteratively building towards the successful delivery of HDB’s services to our customers digitally. The Information Services Group in HDB champions this effort, developing customised IT solutions that affords HDB the flexibility and efficiency in serving its missions.

What Will You Do?

You will be in a pioneer team in HDB’s Information Services Group that seeks to embrace DevSecOps culture and practices for application development. With the goal of creating cross-functional teams that would be responsible for the end-to-end delivery of IT services, we aim to adopt a you-code-it, you-run-it approach to software product development and maintenance. The success of our endeavour will form the blueprint upon which all subsequent in-house DevSecOps teams can be modelled after.

As a software engineer on this team, you will work with fellow developers, your Technical Lead, Product Owner and Delivery Manager in iteratively delivering IT solutions for both internal and external stakeholders of HDB. You will have the opportunity to be exposed to different aspects of software delivery, including solution design, CI/CD pipeline configurations, frontend and backend development, and test automation.

You will be a Great Fit if you Have:

1. Have 3+ years frontend and/or backend software engineering experience in building scalable products, with a demonstrated ability in designing and building well-structured enterprise applications on commercial cloud:
a. Skilled in modern web application technology stack, such as React.js, Spring, FastAPI, Django, PostgreSQL.
b. Experienced in development and deployment on commercial cloud such as Amazon Web Services (AWS), Google Cloud Platform (GCP) and Microsoft Azure
c. Experienced in Loosely Coupled Architecture and Application Integration Patterns, such as Microservices and Scatter-Gather, with the ability to design and architect scalable and resilient systems
d. Experienced in containerisation technologies, such as Docker, AWS ECS and Kubernetes
e. Has exposure to infrastructure provision tools, such as Terraform and Ansible
f. Embraces the concept of DevSecOps and CI/CD, with experience in relevant CI technologies such as Git, Jenkins, and Bamboo.
g. Understand the concept of Secure-By-Design Lifecycle for Agile and the utilisation of technologies for SAST and DAST
h. Practised Test-Driven Development with the utilisation of automated testing
i. Exposure in performance optimisation and tuning of applications and databases
2. Is adaptable and thrives in dealing with uncertainties
3. Can articulate software problems and proposed solutions clearly
4. Thrives in working as a team, and embraces a team-first mentality

Good to Have:

- Adaptability and thrives in dealing with uncertainties

- Can articulate software problems and proposed solutions clearly

- Thrives in working as a team, and embraces a team-first mentality

- Takes initiative, pride and ownership in work

- Growth mindset

Successful candidates will be offered a 1+1 year contract in the first instance. Conversion to perm is dependent on good performance.

Find out more about a career with HDB at www.hdb.gov.sg/cs/infoweb/about-us/careers

Entry level applicants are welcomed to apply.

Please apply for the job through the Careers@Gov job portal as linked:

https://www.careers.hrp.gov.sg/sap/bc/ui5_ui5/sap/ZGERCFA004/index.html#/JobDescription/15360504/bd622d52-6b55-1eef-acdd-0adabd72e206

Responsibilities:

• Define requirements and features for semiconductor equipment
• Develop concepts and architecture of new equipment
• Design mechanical systems which involve the selection and use of motors, actuators, gear drives, pumps and valves.
• Produce detailed engineering drawings
• Perform design verification and validation testing to ensure compliance with specifications, safety regulations and product requirements.
• Improve design of legacy machines
• Application of analysis tools like Fish Bone Diagram, FMEA etc.

Requirements:

• Degree in Mechanical or Mechatronics Engineering
• More than 5 years of experience in semiconductor equipment design
• Good knowledge and experience in the following areas :

1. Design of automation or semiconductor equipment
2. High precision machine design
3. Design of High Speed Pick and Place mechanisms

• Familiar with 3D CAD software
• Ability to plan, prioritize, and coordinate throughout the project cycle
• Ability to work independently with high level of motivation and communicate with all levels
• Equipment troubleshooting skills
• Ability to produce detailed Mechanical drawings and apply knowledge of
• Geometric Dimensioning & Tolerancing.

Job Responsibilities:-

• Define, architect and document the Design-for-Testability (DFT) concept for SOC’s
• Develop, implement and verify DFT measures
• Work closely with cross-function teams (design/verification, physical, and operation) to ensure all test requirements are met and DFT function is correctly implemented for effective DFT solutions
• Achieve target structural test coverage for logic, memories, serdeses and other mixed signal IPs
• Test pattern generation/verification/post-silicon ATE support

Job Requirements:-

• Master's or Bachelor Degree in Electronics and Communications Engineering or equivalent
• Minimum 10 years of working experience in DFT field
• Good knowledge in Boundary Scan, ATPG Scan, Synopsys SMS and/or MBIST is a must
• Working experience in industry standard tools like Test Kompress, DFT advisor, DFT Compiler, Mentor’s SSN and OCC controller are desirable
• Knowledge of full VLSI RTL2GDSII design flow
• Knowledge in high level programming and script writing
• Knowledge in HDL, synthesis, static timing analysis and constraining will be an added advantage
• Some Experience in Test development and Product engineering

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

As an Engineer of MSB Lean Manufacturing, you will manage the implementation of Lean transformation methodologies and tools in Assembly, Test and SSD manufacturing at MSB. You will collaborate closely with site functional teams to identify, explore and implement lean methodologies and tools to drive improvements in throughput, labor productivity, yield, and cycle time performance.

Responsibilities:

• Lead the adoption and implementation of Lean methodologies and tools across Assembly, Test, and SSD manufacturing.
• Facilitate continuous improvement events across different functional teams (e.g., Kaizen, Value Stream Mapping (VSM), Projects, Workshops).
• Develop and sustain programs and systems to foster a Lean culture.
• Conduct labor productivity analyses (e.g., Touch-time, MMR, spaghetti charts) to enhance operator and technician efficiency and reduce operational errors.
• Oversee Utilization/ Overall Equipment Effectiveness (OEE) to identify key sources of losses and improvement opportunities.
• Collaborate with functional experts to identify areas for improvement through the application of Lean methodologies and tools.
• Propose Lean approaches and initiatives, including Kaizen and Continuous Improvement Projects.
• Act as the key integrator between central and site functional teams, developing, driving, and communicating progress on critical Lean improvement initiatives.
• Develop an overall view of critical initiatives and their impact on key performance indicators.
• Provide visibility on program status, including key achievements with clear ownership.
• Trigger interventions to ensure programs stay on track towards targets.
• Support regular reporting and meetings with senior leadership, including deep dives for weekly/monthly reports and ad-hoc senior management updates.

Requirements

• Bachelor’s /master’s in Industrial and system engineering, engineering management, Production & Operation Management, or related field.
• > 2 years of experience in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals in the semiconductor industry
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations

Keen on the role? Apply now!

We are looking for a Package-Silicon Integration Engineer in Micron's Package Development Engineering(PDE) Group, who will be responsible for driving advanced package development for next generation silicon and package technologies. You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

RESPONSIBILITIES include but are not limited to:

• Work with package design and development teams to complete chip package interaction risk assessment.
• Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules/FMEA.
• Work with die designers to enable design for manufacturing in area like die size, scribe width and pad size.
• Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
• Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
• Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
• Identify technology, quality, business process gaps and develop solutions.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

• Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field
• 5-7 years of semiconductor fab experience in Chip package interaction and integration
• Strong Project / Program management skills
• Possess sound methodology for organizing work, decision-making and setting priorities
• Strong analytical, problem solving, and organizational skills
• Proficiency in computer applications like Excel, Word, Power Point.
• Self-motivated and team-oriented.
• Strong interpersonal, oral and written communications-skills.

Keen on the role? Apply now!

As a Non-Volatile Memory Quality & Reliability Assurance (NVMQRA) Engineer at Micron Technology, you will be responsible for performing formal Failure Analysis of customer reported failing devices via the Returned Material Authorization (RMA) process. You will be required to summarize lab analysis results at the electrical and physical level to identify root cause and establish an associated containment plan. In this role, you will have the opportunities to collaborate with various engineering and manufacturing stakeholders to evaluate and review Corrective Actions /Preventive Actions. You will provide documentation of the RMA findings and oversee the final customer report till closure. In addition, for the senior role, you will be asked to provide guidance and lead the team when solving complex unplanned deviations reported by our customers. Project management skills are necessary and the ability to make critical decisions that directly translate to quality and timely completion of the project is highly desirable. You will also be required to spearhead the sustaining efforts and keeping up to date on new product knowledge, as well as developing and mentoring new talents.

Responsibilities and Tasks

Perform Failure Analysis of Customer Returns

• Understand customer complaint of the memory component failure
• Initiate communication with Micron Customer-facing team for further details on customer complaint, requesting additional questions to provide best opportunity for successful analysis
• Perform bench level analysis including initial data image analyis/examination
• Perform Automated Test Equipment (ATE) analysis and interpret results
• Work with the appropriate engineering teams (e.g., PE, PYE) to perform detailed fault isolation when electrical failure has been confirmed
• Summarize findings and submit for physical failure analysis (PFA).

Provide FA Reports for Micron Customer Facing Team for Communication to External Customers

• Summarize analysis at electrical and physical level into customer friendly formats.
• Work with the appropriate manufacturing Global Quality teams through the appropriate request systems (example: GPSS) for Root Cause and/or Corrective Action and a containment plan
• Identify potential risk to external customers
• Communicate with respective BU (Business Unit) on potential impact to customers
• Communicate FA updates through interim reports or during scheduled meetings with the customers.
• Provide formal FA Report with findings

Sustain Knowledge of Device Capabilities and Characteristics

• Keep up to date with latest Fab/ASM process technology
• Understand datasheet specifications for each device and the differences from previous technode for NOR * NAND product family
• Comprehension of qualification data and potential impact to customer operation
• Stay up-to-date on common customer applications and usage model
• Partnering with customer support team to resolve ongoing customer issues

Qualifications and Experience

• Excellent verbal and written communication skills in English. The ability to communicate clearly and concisely both verbally and in writing is critical in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work effectively in cross-functional teams and handle pressure situations in a professional manner
• Excellent problem-solving and analytical skills with strong attention to details.
• Familiarity with NexTest /Teradyne bench analytical tools, scripting in linux console will be an added advantage.

Candidates with 2-3 years of experience in the semiconductor industry as Product or QA engineer are preferred. Relevant experienced candidates will be considered for the Senior Role.

Education

A Bachelor or Masters Degree in Electrical Engineering or similar field of study.

Job Responsibilities:-

• Utilize in-depth knowledge of Foundation IP to evaluate and qualify IP’s. Able to benchmark and optimize Std cells/IO’s/memory for optimum performance, area or power needs of a project
• Conduct Spice simulations to verify the performance and reliability of designs on RC extracted netlists
• Perform library characterization to ensure accurate timing, power, and area models. Stay up-to-date with industry trends and emerging technologies in library characterization and PPA analysis
• Help to develop and maintain EDA automation scripts to streamline CAD flow and design processes
• Modify and optimize IPQA scripts to improve efficiency and performance
• Analyze and understand both hard and soft IPs within SOC designs. Work with IP vendors to deliver custom specs needed for MXL project needs
• Review silicon reports and provide detailed analysis to identify and resolve issues
• Work closely with vendors and cross-functional teams to ensure successful project outcomes. Collaborate with design teams to ensure seamless integration of libraries and IP blocks
• Maintain comprehensive documentation of IP Vendor engagement. Troubleshoot and resolve issues related to IP, EDA tools and automation flows

Job Requirements:-

• Bachelor’s or Master’s Degree in Electrical Engineering, Computer Engineering, or a related field
• Minimum 10 years of experience in design engineering or a related field. Good understanding of the IC design flow, including front-end and back-end processes
• Proficiency in Foundation IP, Spice Simulation, Library Characterization, EDA automation scripts, and IP script modifications. Familiarity with library characterization tools such as Liberate, Cadence Genus, or Synopsys Library Compiler
• Strong ability to review and analyze silicon reports and provide detailed insights. Excellent analytical and problem-solving skills
• Excellent interpersonal and communication skills for effective collaboration with vendors and team members
• Experience with advanced node technologies (e.g., 8nm, 4nm, and below)
• Experience with SOC IP design and verification
• Knowledge of emerging technologies such as FinFET, FD-SOI, or III-V semiconductors
• Familiarity with industry-standard EDA tools and methodologies
• Experience with tools such as Synopsys PrimeTime, Cadence Genus, or Mentor Graphics Questa

Location: Next to Bendemeer MRT

Interested candidates may submit detailed CV with the following info:-

• Current salary, including AWS or Variable Bonus
• Expected salary
• Availability

As a Package Design Engineer within the Package Development and Engineering (PDE) organization in Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a multi-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation. You will be ensure the completion of design activities within the project schedule and ensure that design outputs are within Assembly and vendor capability.

Responsibilities will include, but are not limited to:

• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Work closely with multi-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
• Interact with PDE assembly team and external assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Support package technology development, including material selection, process development, DOEs, and related activities
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program milestones to ensure timely development execution.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and contribute to the Global Design, Simulation and Substrate (GDSS) team on continuous improvement efforts such as:Global design alignment activities
  Continuous improvement efforts
  Package design rules
  Package roadmaps
  Competitive Analysis review

Requirements:

• Master (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in semiconductor packaging industry OR PhD graduates in Electrical Engineering
• Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures, die stack-up, packaging layout optimization.
• Excellent communication skills, both oral and written in English.
• Excellent problem solving and analytic skills.
• Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
• Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
• Ability to work independently, prioritize and manage numerous projects with minimum supervision.
• A global perspective and the ability to work in a multicultural environment.

Performs semiconductor design engineering assignments including engineering and designing packaging stack-up, layout checking, documenting specifications, modifying and evaluating packaging risk in the areas of electrical, thermal, mechanical and reliability. Reviews package design requirements, define the package stack-up and conduct final design review. Typically responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor Packaging.

As a Process Control System Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

As a PDE Network Engineering Process Control System (PCS) Engineer/Senior Engineer, we will be responsible to develop smart manufacturing solutions towards the Industry 4.0 standard. We will gain exposure and knowledge in many cutting-edge areas including Machine Learning, Advanced Control Solutions and Deep Learning. As a PDE PCS Engineer, we will have the opportunity to develop a complete solution that starts from requirements gathering, data analysis and modeling with big data platform, followed by system development and integration; and then network wide implementation. The work we do directly affects the bottom line of the entire company by providing scrap/excursion control, Statistical Process Control (SPC), Advanced Process Control (APC or Run-to-Run), Fault Detection and Classification (FDC), and overall enhanced process capability. We will meet regularly and team with Process areas to understand their tools, processes, and challenges and work with them to create process control models, strategies, and other methods for ensuring quality output.

Responsibilities

• We develop, implement and improve smart control solutions for optimum manufacturing performances.
• We provide technical oversight, guidance and support for process control implementation
• We conduct intensive data analysis and modeling to identify sources of variation in the process and translate it into control solutions.
• We support PDE KEG team in Classification, Characterization and Categorization and define Data Collection Requirements, Perform Integration and Setup Data Collection in E3 Environment.
• We define Analysis and setup Requirements and Setup Limits and OCAP and engage in periodic review with PCS team and network on BKM practices.
• We develop and deliver training on control systems and related topics.

Requirement

• PhD, Masters/Bachelor’s Degree in Electrical and Electronics Engineering/Computer Science/Statistics/ Mathematics/Physics
• At least 4 years of experience in semiconductor manufacturing advanced process control.
• Experience and knowledge in Programming and Data Analysis. Preferred experience in Python/R/SQL/Hadoop eco-system and/or in the development of web-based applications
• Familiar with Machine Learning.
• Good communication and interpersonal social skills.
• Excellent problem solving and analytical skills.
• Excellent verbal and written communications skills. Good interpersonal skill and a good teammate.
• Excellent Project management skills.
• Ambitious and ability to multi-task and balance dynamic priorities.
• Ability to participate in a multi-functional team environment.
• Willing and capable of international travel, as needed, to accomplish your objectives.

Keen on the role? Apply now!

Key Responsibilities:

• System Development, Implementation and Support
• Evaluate requirements and analyze impact to the application
• Involve in design and development stage
• Involve in application setup and deployment
• Provide guidance towards testing phases
• Provide level 3 production support to relevant open systems applications 
• Coordinate with internal teams and vendors to resolve application and system issues
• Execute tasks related to project / change request / maintenance request

Key Requirements:

• Degree in Computer Science or equivalent
• 5 years of UNIX/LINUX/SQL/Korn Shell programming experience
• Hands-on experience on Oracle database, Webserver such as Apache, Java platform / J2EE and Java web container such as WebLogic, JBoss EAP, Tomcat
• Relevant working experience with good working knowledge in cards, loyalty, remote commerce, portals or digital payment domains.
• A good understanding of API frameworks will also be desired.
• Ability to multi-task and perform well under pressure

# Risk Management & Project Management

# Network Migrations - LAN & WAN, Network security

# Experience in Data Centre Project

Job Description:

• Plan and execute data centre migration
• Oversee procurement of new servers and network equipment
• Manage data migration and verification processes
• Set up new Server Room compliant with Green Book standard
• Other ad-hoc tasks assigned
• 
  
• Diploma/Degree Holder and above
• At least 5 years of experience of handling ICT projects such as DC relocation etc
• Relevant IT certifications (eg. ITIL, CISSP, PMP) preferred

Send your cv to [email protected]

As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will be managing and optimizing your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor or master’s in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 4 or more years of experience with proven track record of technical leadership in semiconductor manufacturing in Metro Real-Time Defect Analysis Process & Equipment Engineering. Experience in other Front-End areas, in Post Wafer Fabrication & High Bandwidth Memory technology
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill
• Excellent communication skills

Keen on the role? Apply now!

Responsibilities:

· Coordinating, planning and conducting the project plan

· Project formulation and monitoring progress and schedule

· Effective communication and co-ordination between project participants

· Attend site meeting, inspect, monitor and report project progress.

· Submit and update monthly project status

· Perform other duties or tasks as assigned by immediate superior or Project Manager

Requirements:

· Degree in Civil/Structural Engineering or its equivalent

· At least 3 years relevant working experience as Project Engineer in main contractor office

· Proficient in MS Office Word, Excel and Project Scheduling software

· Bilingual with good communication skills

Responsibilties

• Lead the engineering teams within the verticle
• Evaluating and analyzing existing processes and procedures to identify areas of improvements
• Oversee the projects by planning, prioritizing tasks, resource allocation, giving instructions, reviewing code and implementation
• Collaborate with Product Managers, Designers and other key stakeholders to deliver on key priorities
• Strategic thinking to deliver end-to-end user experience solutions with a focus on user needs and business goals

Requirements

• 6-10 years of software engineering experience
• Degree in computer science, information security, or a related subject
• Familiarity with backend development related technology stacks
• Experience leading design and implementation of a highly scalable web services
• Strong interpersonal and communication abilities work successfully with stakeholders
• Great time management skills while working under tight timeline
• Strong analytical and problem-solving skills
• Ability to communicate in mandarin with our stakeholders would be an added advantage

• Knowledge of submicron semiconductor technology
• Familiar with digital ASIC/SOC design flow from RTL to silicon characterization
• Familiar with Synopsys and Cadence EDA tools for Simulation, Synthesis, Timing (STA), Formal and Assertion based verification, etc.
• Familiar with design and programming languages: Verilog, System Verilog, Python, Perl, C, C++, etc.
• Familiar with code base management method including subversion, git, GitHub, etc.
• Ability to apply analytical and problem-solving skills
• Strong written and verbal communication skills, ability to negotiate design features and options
• Knowledge of embedded system design, verification, and product development lifecycle
• Deep knowledge and domain know-hows in one or more areas below is a big plus.