Total 14 Senior Executive process improvement manager job vacancies in Kaki Bukit, South East

Job Description

• 5 years relevant working experience in Water Treatment industries is preferable.

• Experienced in the design of water treatment plants (desalination, potable water, demineralization) and membranes systems (MBR, MF/UF, Reverse Osmosis, Nano-Filtration, etc.), experience in Demineralization System will be added advantage.

• Strong technical knowledge (i.e Process Design and Calculation) in Membrane (MF/UF/RO/EDI), Ion Exchange, and pretreatment processes (coagulation / flocculation, sedimentation, clarification, filtration)

• Review Client’s Requirement, Technical Specifications & Tender Specifications to generate engineering deliverables (General Specification & Particular Specifications, Datasheets, Major Equipment List, Pipe List, Mass Balance, Hydraulic Profiles, Process Flow Diagram, Process & Instrumentation Diagram, etc.)

• Assist the Engineering Manager & Lead Engineer, Process on engagement with Clients, Consultants, Sub-Contractors, Vendors, and others for the development of design, procurement, fabrication, construction, erection and commissioning works.

• Coordinate with inter-disciplines engineering team (Process, Mechanical, Electrical, Instrumentation & Control Automation, C&S and Drafting) on development of engineering deliverable on a timely basis.

• Procurement Services Support: Develop the applicable Equipment List/Package, Technical Specifications and Bill of Materials to support Procurement Department to issue Request for Quotation (RFQ). Assist to review the RFQ, prepare applicable technical & commercial clarifications with selected Sub-Contractors or Suppliers. Provide justification on the shortlisted Sub-Contractors or Suppliers for onward negotiations.

Requirement:

• Degree in Chemical Engineering or Environmental.

• Prior experience of at least 5 years in process design. Experience in UltraPure Water (UPW) will be added advantage.

• Ability to establish and maintain appropriate relationships with team members.

• Able to work independently with minimal supervision

JOB SUMMARY:

Undertake detailed process and mechanical engineering for awarded projects to support the project execution teams and deliver profitable projects. At the same time, expect to support the proposal team on upcoming tenders on process and mechanical engineering. Provide process support to optimize and troubleshoot operating plants when required which will ensure lowest lifecycle costs and provide feedback for improvements in design.

RESPONSIBILITIES:

• Assist the proposal team to develop the treatment process and provide the mechanical engineering support during the tender stage.
• Once the order received, proceed in detail engineering for project execution.
• Develop cost effective and innovative water/wastewater treatment process design that meet client design basis and requirements.
• Develop PFD, GA, P&ID, interface drawings and any other materials relevant to proposals submission.
• Review and understand project specifications to ensure company design complies with customer specifications;
• Assist in developing the RFQ to the vendors on the treatment process equipment and mechanical components and parts.
• Prepare equipment datasheets (valve list, equipment list, piping schedule, instrument list, etc);
• Supervise and review complex equipment skid 3D model to ensure compliance with project specification;
• Assist in project costing through lifecycle of the project and submit to business development for pricing.
• Assist in technical and commercial proposals by working with internal teams (BD, engineering, operations, HSEQ), as required.
• Participate in vendor evaluation and risk assessment process.
• Participate and present in customer meetings and design reviews if required (Bid Clarifications, HAZID/HAZOP studies).
• Prepare detail process engineering deliverables (e.g.: design basis, process design calculations, PFD, P&IDs, HMB, equipment lists, control philosophy, datasheets, commissioning and performance testing plans/procedures, O&M manuals) and work with project and engineering team closely to assist them after the award of project.
• Review outputs by other Senior Process and Mechnical Engineers and less experienced Process and Mecahnical Engineers.
• Mentor less experienced Process Engineers when required.
• Support commissioning / site project related activities where and when required.
• Provide process support for O&M contracts including optimisation and troubleshooting when required.
• Maintain good communication with all stakeholders and provide visibility on direction and results.
• Continuous learning and improve knowledge on process technologies and designs.
• Review of vendors, fabricators and sub-contractors quotations to ensure compliance with project specifications;
• Review of vendors, fabricators and sub-contractors engineering deliverables to ensure compliance with project specifications

REQUIREMENTS:

• Bachelor's Degree/Post Degree in Engineering: Chemical or Environmental is preferred
• At least 8 years or more of relevant experience in industrial water/wastewater treatment;
• Experience in commissioning of water/wastewater treatment;
• Experience in the O&G industry is a plus;
• Experience in the design of complex skid-based industrial water treatment systems;
• Experience working on multiple projects simultaneously;
• Knowledge of industry standards and specifications;
• Able to work in multi-cultural teams;
• Proficient in MS Office applications;
• Willing to travel

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities:

• Evaluate existing logistic processes, identify areas for improvement, and implement streamlined procedures.
• Work collaboratively with cross-functional teams to ensure seamless integration of the processes with other business functions
• Keep abreast of changes, develop and update policies and procedures to align with industry best practices and legal requirements
• Research and analyze information, and provide the management team advice and decisions to maintain market competitiveness and support business goals
• Responsible for quality control and continuous improvement.
• Mange operations and process efficiency and effectiveness;
• Support Team work on daily reporting such as inventory report, warehouse and distribution tracking report.
• Assist in any other duties as required

Requirements:

• Degree or Diploma in Supply Chain / Logistics or related studies
• At least 1 years of experience in supply chain project management and process design
• Experience in warehouse operation
• Good project management skills

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026