Total 11 Senior Executive process improvement manager job vacancies in NEA-CHOA CHU KANG CEMETERY AND COLUMBARIUM

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026

Responsibilities

• Responsible for ensuring products produced meet the product and customers' quality requirement
• Responsible for developing and improving the processes to gain productivity, efficiency, quality and costs.
• Responsible for coordinating NPI/NPQ activities with details and meeting timeline.
• Responsible for supporting and resolving daily technical issues in operations
• Responsible for supporting analysis of failures from yield loss, reliability failures, new products, new materials.

Requirements

• Min Diploma in Electronic Engineering, Material Science or relevant
• Min 5 years of working experience in semicon assembly and test environment
• Experience in Assembly FOL of dicing, die attach, wire bond
• Experience in maintenance of assembly and test machines of dicing, die attach, wire bond encapsulation, testing

Please kindly email your resume in Ms Word to [email protected]

We regret to inform that only shortlisted candidates would be notified.

Registration Number: R1328870

EA License No. 22C1026