ROLE:

IME A*Star is currently working on establishing a hybrid fabrication platform for 150mm & 200mm Silicon Carbide (SiC) power MOSFETs as part of the new SiC R&D program. The main objective of this program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration for various types of power MOSFETs and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, with a specific focus on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this deputy lead for wide-bandgap device integration role include the development and integration of several modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, ohmic contact formation etc are essential. We are actively looking for individual with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, device layout design, design verification, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• To lead development of SiC power technologies, serving as both front and back-end process integration in collaboration with advanced module development team. And aim
to grow this team to ~10 headcounts in the next 3 years.

• Optimize and customize process flows for individual SiC products

• Identify and resolve process integration issues and related problems

• Develop specific or derivative processes to meet customer needs

• Support new designs by conducting module characterization and developing effective design rules

• Define and implement measures to enhance stability, yield, reliability, and reduce development costs & time

• Plan and implement sustainable corrective actions to address process deviations

• Continuously monitor and utilize expertise in process and equipment capabilities to achieve optimal device performance

• Determine the correct and effective way to deliver processes, functional devices, and other items to multiple customers

• Perform project management tasks and conduct data analysis

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device Physics

• Highly proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and MOSFET device physics

• Proficient in teaching and knowledge transfer to junior staff members

• Strong communication skills to effectively convey information about process module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data; combined with strong presentation abilities.

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

Position:

Our team is starting an exciting project to develop RF/mm-wave ICs for the future of communication for Beyond-5G to 6G applications. We are looking for an exceptional candidate with relevant expertise to join us. Our team focuses on developing communication modules for both terrestrial and non-terrestrial needs. You will work at the Institute of Microelectronics (IME) to create the most advanced semiconductor technologies. You will collaborate with world-leading industries and academic institutions on innovative designs and strategic intellectual properties.

Job Responsibility:

• Benchmarking with datasheets, prior arts, and latest academic work.
• In-depth design and analysis with electrical/electromagnetic simulations.
• In-depth analysis of design robustness, optimization, and testability.
• In-depth presentations and report recording of design, layout, test and measurement, and fault analysis.
• Working independently, as a team, and with collaborators from industry and academic backgrounds.

Pre-requisites:

• A Master’s / PhD Degree in Electronics or Electrical Engineering and proven academic and industry experience are pluses.
• Experienced in designing RF/mmWave such as LNA, mixer, PA, buffer, transmission line, baluns, PLL, VCO, etc.
• Experienced in designing base-band/mixed-signal circuits, such as amplifiers, bandgap, ADC, DAC, etc., is a plus.
• Knowledgeable in design trade-offs at the circuit-level specification.
• Experienced in designing in CMOS and SiGe technology or any other technologies like RF-SOI and compound-semiconductor is a plus.
• Proficient in using Cadence and EM tools like ADS for EM circuit simulation, IC layout, LVS, and DRC verification.
• Familiarity with IC measurement and debugging and hands-on experience with RF/mmWave equipment such as spectrum analyzer, network analyzer, oscilloscope, and probe station.
• Good publication record with a strong awareness of state-of-the-art.
• Good communication and teamwork.

MedTech Catapult is a national initiative for accelerating the development of high-value MedTech projects through an in-house product engineering unit. This productization unit is responsible for supporting the development of technologies through the medical device development cycle to produce full-fledged hardware product systems.

The Lead Engineer will report to the Lead, Product Engineering.

Job Responsibilities

• Responsible for software engineering efforts for integrated medical technology product solutions.
• Responsible for software architecture design and FW requirements specifications generation.
• Design, develop and implement embedded SW for medical instruments and devices and related interface systems using a variety of languages (e.g. C#, ASP.NET etc.), ensuring optimal performance, reliability, and power efficiency.
• Lead software risk management and DFMEA, software verification and validation activities from early concept phase through release to manufacturing according to IEC 62304.
• Responsible for software integration and implementation for embedded systems, ensuring products are according to design requirement.
• Write and execute complete testing plans, protocols, and documentation.
• Identify, debug, and create solutions for issues with code and integration into application architecture.
• Incorporate real-time data acquisition from sensors and closed loop control algorithms and verify real-time closed loop control of systems parameters.
• Support development of intellectual property portfolio in device design and process technology know-how.
• To interact closely with engineers from other disciplines to achieve an optimized design within the stipulated project schedule.
• Write and review documentations for QMS.
• To support other activities for product engineering when required.

Requirements

• Degree in Information Technology, Computer Science, Electronics or a related discipline.
• Minimum 10 years of experience in developing embedded firmware with hardware integration experience related to MedTech applications.
• Complete product lifecycle experience including early concept work, and successful transfer of designs into manufacturing.
• Experience with electrical components such as ADC, DAC, stepper and dc motors, image sensors, Ethernet, I2C, SPI, USB and CAN.
• Good experience with ARM processors or other microprocessor architectures.
• Knowledge of computer architecture and operating systems.
• Familiarity with variety of Operating systems including Windows, MacOS X and Linux; and Mobile platforms, including iOS and Android.
• Familiarity with Network technologies, including TCP/IP, Bluetooth, Zigbee, WiFi and Modbus.
• Familiarity with Languages such as C/C++, C#, Python, MATLAB, and Java.
• Experience managing QMS and proficient with GMP guidelines.
• Good collaboration skills, organised and detailed.
• Demonstrate strong interpersonal skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

JOB DESCRIPTION

This job focuses on software development for Software as a Medical Devices. Junior Project Manager will be working closely with Project Managers and project teams to ensure the software as a medical device product management Lifecyle is followed thoroughly.

• Support project manager in Plan and execute Software as a Medical Device (SaMD) projects including AI applied to healthcare.
• Support technical team in product development, design verification and validation of medical devices including software as medical device.
• Prepare design and development documentation by working together with software developers, quality and regulatory personal.
• Prepare project agreements, procurement specifications and Technical documents.
• Follow-up on project milestones.

REQUIREMENT

• Preferred to have one year of experience in software development or medical device product development.
• Educational background of computer engineering or bio medical engineering
• Knowledge in software development, experience in software development environment will be an added advantage
• Knowledge / willingness to learn the ISO 13485 documentation practices and drive project teams for adherence
• Ability to follow up on commitments

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

JOB DESCRIPTION

This job focuses on software development for Software as a Medical Devices. Junior Project Manager will be working closely with Project Managers and project teams to ensure the software as a medical device product management Lifecyle is followed thoroughly.

• Support project manager in Plan and execute Software as a Medical Device (SaMD) projects including AI applied to healthcare.
• Support technical team in product development, design verification and validation of medical devices including software as medical device.
• Prepare design and development documentation by working together with software developers, quality and regulatory personal.
• Prepare project agreements, procurement specifications and Technical documents.
• Follow-up on project milestones.

REQUIREMENT

• Preferred to have one year of experience in software development or medical device product development.
• Educational background of computer engineering or bio medical engineering
• Knowledge in software development, experience in software development environment will be an added advantage
• Knowledge / willingness to learn the ISO 13485 documentation practices and drive project teams for adherence
• Ability to follow up on commitments

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

We are looking for an enthusiastic, self-motivated, innovative, quick learner with excellent interpersonal skills to work in National Metrology Centre. The successful candidate will provide technical support and leadership in:

1. Maintenance and quality assurance of national measurement standards in length and dimensional areas.
2. Establishment of international equivalence of length and dimensional measurement capabilities through participation in measurement comparisons.
3. Achieving international recognition for calibration and measurement capabilities in length and dimensional areas through peer-reviews by external experts; and undertaking peer-reviews of other national metrology institutes as a domain expert.
4. Dissemination of the national length and dimensional standards and measurement technologies to the industry through calibration and measurement services and R&D in metrology.
5. Developing new measurement solutions, and building new metrology capabilities and services based on emerging needs of the industry; and developing programmes to enhance technical competencies of lab personnel.
6. Raising measurement capabilities of industry by conducting consultancies, training and proficiency testing in length and dimensional measurements.
7. Supervision of students and trainees from industry under attachment programmes.
8. Conducting technical assessments under Singapore Accreditation Council-Singapore Lab Accreditation Scheme, and training of new technical assessors.

Job requirements

1. Bachelor degree in Engineering or Physics.
2. 0 to 3 years of relevant experience preferred.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

As part of IME’s Photonics & Sensors Department, the candidate will take the lead for the development of advanced photonics integration. This could include but not limited as photonic heterogeneous integration by bring various best-in-class materials into silicon wafer, electro-photonics integration, etc. You will work closely with an excellent multidisciplinary team involving photonics, semiconductor process, and fab operation.

Responsibilities:

• Development of various photonics integration capabilities with 8-inch and 12-inch facilities, with emphasis on photonics heterogenous integration.
• Design and fabricate various advanced photonics components and integrated circuits aiming for next-generation photonic applications.
• Design of Experiments (DOE) for both design and process margin checking and control.
• Process metrology data taking, device / circuit performance data taking.
• Data analysis and documentation
• Preparation of technical presentations and papers for internal meetings, as well as conferences and journals.
• Collaborate with project team to ensure quality and on-time delivery for various projects.
• Performs other duties as assigned.

Qualifications:

• PhD in Integrated Photonics, Opto-electronics, Materials Science, Physics or equivalent
• Strong hands-on experience in photonics integration.
• Experience in one or more topics listed below is strongly preferred: confocal microscopy, Raman spectroscopy, semiconductor carrier lifetime measurement, optical nonlinear device characterization, ultrafast optics, or other relevant fields.
• Hands-on experience in photonic simulation using various electrical / photonics design software.
• Strong communication, industry awareness, and problem-solving skills.
• Strong self-motivation and interest in the next-generation photonics technology development.
• Industry experience is a plus.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

ROLE:
IME is leading the effort to establish the industry leading Silicon Carbide R&D program. This program aims to advance 200mm Silicon Carbide technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The main objective is to drive disruptive innovations in power device research, with a specific focus on >1.2KV power MOSFETs. These innovations are intended to enhance automotive technologies, vehicle electrification, safety measures, sustainable energy grids, and industrial automation. Key aspects to demonstrate for this role include high power device design, novel device concepts, doping design, gate oxidation, and wide-bandgap process simulations. To achieve this, we are seeking individual with extensive industry experience in using Synopsys/Silvaco TCAD simulator, relevant device characterization skills, design simulation development abilities, a willingness to mentor junior staffs, and strong interpersonal skills. The candidate will contribute to the wide-bandgap & Silicon Carbide team by utilizing their device knowledge, guiding team on device characterization, implementing state-of-art Silicon Carbide power MOSFETs (Planar, Trench & Super-Junction), and innovative novel power MOSFETs for future applications.

RESPONSIBILITIES:

• TCAD modeling & simulation, novel high power device design, simulation, and device characterization

• Design and simulate high voltage Silicon Carbide MOSFETs (planar, trench, SJ MOSFET, IGBT) with a blocking voltage of >1.2K using Synopsys/Silvaco simulator

• Design & simulate practical and effective junction terminations

• Provide guidances on device structure, optimizing cell, power/performance analysis, process risk assessment, and recommendations for experimental split and improvement

• Develop and apply fundamental MOS device physics-based TCAD modelling & electric field management to calculate band structure, carrier transport, blocking voltage,
switching properties, and thermal management for vertical power devices in the presence of interface state density, gate oxide defects, and defects in Silicon Carbide

• Model transport and carrier scattering in devices operating in extreme ambient conditions

• Collaborate with diverse teams, including process integration, characterization, and circuit design engineers, to analyze and troubleshoot device-related issues during
development

• Serve as a resource for colleagues with less experience, and lead small projects with manageable risks and resource requirements

• Work closely with both internal and external customers to understand customer issues and align their demands. And grow this wide-bandgap team to ~5 headcounts in the
next 3 years.

JOB REQUIREMENTS:

• PhD in Electrical Engineering or related field

• >10 years industrial experience for high power device design and modeling

• Deep knowledge of high voltage, high power MOSFETs (including Planar, Trench, S-J MOSFETs, and IGBTs) design and device characterization on 4H-SiC & GaN substrates.

• Solid understanding of wide-bandgap semiconductor materials and the strong physics of MOSFET devices

• Ability to teach and transfer knowledge to junior staff members

• Ability to effectively communicate and plan with customers regarding their needs, issues, and demands

ROLE:

IME A*Star is currently working on establishing a hybrid fabrication platform for 150mm & 200mm Silicon Carbide (SiC) power MOSFETs as part of the new SiC R&D program. The main objective of this program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration for various types of power MOSFETs and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, with a specific focus on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this deputy lead for wide-bandgap device integration role include the development and integration of several modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, ohmic contact formation etc are essential. We are actively looking for individual with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, device layout design, design verification, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• To lead development of SiC power technologies, serving as both front and back-end process integration in collaboration with advanced module development team. And aim
to grow this team to ~10 headcounts in the next 3 years.

• Optimize and customize process flows for individual SiC products

• Identify and resolve process integration issues and related problems

• Develop specific or derivative processes to meet customer needs

• Support new designs by conducting module characterization and developing effective design rules

• Define and implement measures to enhance stability, yield, reliability, and reduce development costs & time

• Plan and implement sustainable corrective actions to address process deviations

• Continuously monitor and utilize expertise in process and equipment capabilities to achieve optimal device performance

• Determine the correct and effective way to deliver processes, functional devices, and other items to multiple customers

• Perform project management tasks and conduct data analysis

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device Physics

• Highly proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and MOSFET device physics

• Proficient in teaching and knowledge transfer to junior staff members

• Strong communication skills to effectively convey information about process module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data; combined with strong presentation abilities.

ROLE:

A*Star-IME is currently working on establishing a hybrid fabrication platform for 150mm and 200mm Silicon Carbide (SiC) power MOSFETs as a new pillar on Singapore"s Future of Microlectronics in wide-bandgap. The main objective of this SiC RnD program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, specifically focusing on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this role to be successful include the development and integration of several process modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, and ohmic contact formation. We are actively looking for individuals with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• Lead develop process technology for SiC power MOSFETs and ensure it meets the requirements for prototyping manufacturing

• Collaborate with advanced process module development team to establish a process flow for fabricating specific MOS devices

• Responsible to develop and improve test structures that enable fast and rigorous characterization of process

• Accountable to improve device performance and yield through the design, execution, and analysis of experiments for each specific device and product

• Work with cross-functional teams to minimize defects and address technical and yield concerns

• Drive CIP (Continuous improvement plans) to deliver integrated process modules and specific device per project goals

• Make decisions regarding the delivery of process, active and passive devices to multiple customers

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device physics

• Proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and the physics of MOSFET devices

• Strong communication skills to effectively communicate information about module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data, coupled with strong presentation abilities

Scientist/Senior scientist will be part of heterogeneous integration group focused on development of the quantum packaging technology platforms to integrate qubit and control chip on superconductivity interposer.

He/she will work with cross functional team to:

• Design and simulation of superconducting circuits for salable quantum processor in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detector.
• Design and layout of circuits components of a superconducting qubit.
• Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on the simulation results.
  Prepare competitive grant research proposals and lead execution of these proposals.
  Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms.

Job Requirements:

• Master/PhD in quantum computing; Electrical and Computer Engineering; Material science area
• 4 to 5 years’ experience in superconducting circuits design and simulation for scalable quantum processor. Deep understanding on 3D quantum package
• Working experience on measuring loss and dielectric constants of materials at cryogenic temperatures
• Strong communication, industry awareness, and problem-solving skills.
• Highly motivated to succeed, a self-starter who is driven and able to work with others effectively to get things done.

We are seeking a highly skilled High-Speed IO Modeling designer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (Masters/PhD) , with a focus on high speed circuit modeling, statistical analysis, jitter analysis, digital signal processing, and signal integrity. The successful candidate will play a crucial role in developing IO performance models for chiplet-based high-speed communication protocols and generating complete high-speed link performance matrices based on advanced packaging.

Key Responsibilities:

• Develop IO performance models (Tx, Rx) for chiplet-based high-speed communication protocols such as UCIe, AIB, and others.
• Create complete high-speed link models by integrating IO performance models with advanced packaging interconnects.
• Generate comprehensive high-speed link performance matrices, considering various parameters such as technology node, area, latency, power, number of channels, micro bump pitch, and frequency of data rates.
• Collaborate with cross-functional teams to ensure the successful integration of IO performance models into the overall system design.
• Develop parameterised PDN model and fluent in analysing SI and PI simulations
• Stay up-to-date with the latest advancements in high-speed IO modelling techniques and technologies, and apply this knowledge to improve existing models and develop new ones.

Required Qualifications:

• Master's degree in Electrical or Computer Engineering with 2+ years of relevant experience, or a PhD in Electrical or Computer Engineering with 1+ years of relevant experience.
• Strong understanding of package/interconnect/I-O modelling, statistical analysis, jitter analysis, digital signal processing, and signal integrity.
• Experience in mixed-signal circuit design for High-Speed IOs (e.g AIB, AXI, UCIe).
• Proficiency in IBIS-AMI specification and model creation using Keysight ADS.
• Programming and scripting skills in one or more of the following: Python, Perl, C/C++, TCL, or AEL.

Preferred Qualifications:

• Ability to develop and implementing high-speed IO performance models using industry-standard tools/methodologies.
• Experience with advanced packaging technologies and their impact on high-speed link performance.
• Strong problem-solving skills and the ability to think creatively to overcome technical challenges.
• Excellent communication and collaboration skills, with the ability to work effectively in a team environment.

Account Assistant

Working day: Mon to Fri, 5 day work week
Salary: $2200 - $2800
Working location: Orchard
Working hours: 9am - 6pm

Position Overview:

We are looking for a Bookkeeping Accounts Executive to join our finance team. In this role, you will be responsible for maintaining accurate financial records, processing transactions, and ensuring compliance with accounting regulations. You will play a crucial role in supporting our financial operations and helping to achieve our organizational goals.

Key responsibilities:

• Reporting to the General Manager
• Maintain accurate and up-to-date financial records, including ledgers, invoices, and receipts.
• Able to read, prepare, manage, use and interpret financial books.
• Process accounts payable and receivable, ensuring timely and accurate payment of invoices.
• Perform regular bank reconciliations and resolve discrepancies in financial records.
• Assist in the preparation of monthly, quarterly, and annual financial reports for management review.
• Help track and monitor budgets, providing insights on variances and financial performance.
• Ensure compliance with accounting standards and regulatory requirements.
• Assist with internal and external audits by providing necessary documentation and explanations.
• Work closely with the General Manager to provide financial insights and support operational decisions.

Skills and Requirements:

• Diploma in Accounting, Finance, or a related field.
• At least 1-2 years of experience in bookkeeping or accounting.
• Strong knowledge of accounting principles and practices.
• Proficiency in accounting software and Microsoft Office Suite, especially Excel

WhatsApp: +65 9642 0989 (Han)

Email: [email protected]

Chaw Chiaw Han, Reg No：R22106723

The Supreme HR Advisory Pte Ltd, EA No：14c7279

You will be involved in Works Train Operation to carry out on-site inspections and co-ordinate with contractors to resolve daily site issues. Tasks include controlling of the movement of locomotives and wagons and pedestrian access by work parties. You will also be required to operate locomotives, supervise and train the Works Train operators/ shunters when necessary.

• Diploma in Civil/ Mechanical / Electrical / Electronic Engineering

• At least 2 years of engineering experience, preferably in a railway/underground construction environment

• Candidates with supervisory experience will be preferred

• Team player who is analytical, resourceful, self-driven and keen to learn new skills

• Good communication, writing and presentation skills

• Good working knowledge of Microsoft Office applications

• Able to perform 2 or 3 rotating shifts

• Well Established Company
• Basic $5000 - $8000 + AWS + Variable Bonus
• Excellent Welfare and Benefits + Career progression
• Working location: Tuas (Transport Provided)
• Working days: Monday to Friday
• Working hours: 8am to 5pm

Job Responsibilities:

• Develop and implement department procedures, ensuring compliance with safety regulations and standards
• Oversee and coordinate the daily engineering operations, including conducting routine inspections and maintenance of machinery
• Manage the maintenance budget, ensuring efficient allocation of resources
• Supervise engineering staff, including hiring, training, and performance management
• Prepare preventative and maintenance schedules
• Identify and address potential issues before they result in equipment failure or downtime
• Collaborate with other departments to prioritize maintenance needs and manage work orders
• Manage inventory of maintenance equipment
• Prepare and present reports on maintenance operations and costs
• Keep abreast of advancements in maintenance and repair technologies

Requirements:

• Bachelor’s degree in Mechanical Engineering
• Min 5 years of relevant working experience and knowledge
• Strong planning, people management, analytical and problem solving skills

Candidates are encouraged to apply this position via Apply Now button with the following information in the resume

• Work experiences and job responsibilities
• Current and Expected salary
• Reason for leaving
• Date of availability
• Education background

We regret that only shortlisted candidates will be contacted.

THIEN CHING MEI (R2198032)

EA Recruitment Pte Ltd

EA License No: 21C0492