IMPORTANT
Only apply if you meet the requirements. Must be in Photonics
Job Objective/s
Candidate will be part of the technology development team for photonic integration solutions. To develop technical know-how of integration onto Photonic Integrated Circuit (PIC) platforms for a suite of of III-V photonic devices. To define the optical, mechanical and electrical interface required. The candidate is required to manage and define the technical scope of work with external vendors related with the CMOS processing.
Additional scope includes design and development of optoelectronics devices, including but not limited to FP lasers, DFB lasers, gain chips, SLEDs, semiconductor optical amplifier, electroabsorption modulator/laser, photonics integrated circuits and their packaged modules, as well as photonics systems such as external cavity lasers.
Duties and Responsibilities
· Perform application specific photonic system-on-chip designs on Silicon Photonics wafer.
· Management of out-source wafer processes for III-V and Silicon wafers. Processes include, not limited to under-bump metal, evaporation, wafer grinding and polishing, wafer singulation processes.
· To evaluate and design optical coupling solutions for optoelectronic components through micro-lens, fiber coupling, chip-chip edge/surface coupling. Using simulation tools such as (CrossLight, ALDS, Optiwave), optical ray tracing (Zemax, Optalix), thermal (Solidworks) and electrical (5Spice) properties of optoelectronics devices
· Design and development of advanced optoelectronic packaging solutions required for prototyping and new product introduction.
· Hands on development of high-precision flip-chip die attach processes for optical applications. To perform bonding verification and functional optical testing of the assembled devices.
· Analysis of optoelectronics device epigrowth and wafer fabrication process integration, device functional and reliability performance characterization and test results, referencing to the state-of-art, simulated performance, data-mining internal test-results data-base, and refine design, fabrication specifications, and simulation model and parameters to optimize fit between design and measured outcomes
· Report generation of design and simulation outcome with support of experimental data, where available
· Build up database of optoelectronics device design white papers, and management of all design documentation repository
· Define and develop device test and characterization methodologies to extract basic intrinsic parameters of optoelectronics devices
· All other reasonable duties, as assigned
Qualification Guidelines
Minimum Education
o Degree (in semiconductor based light emitting optoelectronics preferred)
Minimum Experience
o Minimum 5 years’ working experience with technical background in optoelectronics and wafer fab processes in optical laser component, photonics device system and sub-system
o Proven working experience in optoelectronics design and program/project management in the manufacturing industry
Specific Knowledge / Skills
o Excellent written and verbal communication skills
o Proven organizational skills and multi-tasking skills
