As NAND Sg Process Development (PD) Program Management Engineer, you will support the Program Manager, in his collaboration work with Technology Development (TD) peers, High Volume Manufacturing (HVM) Fabs, Operations Central Teams (OCT) and other stakeholders to drive best in class performances and all critical initiatives for NAND nodes to meet program milestones.

You will play a key role in establishing and managing cost programs to meet allocated capital expenditure budget, operational expenditure cost management; and deliver node-over-node cost per gigabit (CPGB) reduction targets meeting business requirements.

You will work in a fast-paced environment with the world’s Best NAND TD team in a role that is highly Collaborative and requires a great deal of Customer Focus; continuous improvement and an Innovative growth mindset are required to achieve desired results. You will work within a Process Development organization alongside leaders and engineers from Fab functional Process Areas.

Responsibilities:

• Regular interaction with PD/PI team for MOR Updates/Tracking in close collaboration with Industrial Engineering (IE) Modeling Team.
• Drive alignment and timely delivery of results on critical projects, manage execution of TD roadmaps/strategies to meet milestones.
• Drive continuous improvement of PMI/SPC from process areas, publish roadmaps, highlight risks and mitigate.
• Prequal Expense: Work with stakeholders to drive prequal expense reduction (materials, spares etc).
• TD-University Engagements: Engage with Talent Acquisition teams to initiate/support initiatives to build strong TD talent pipelines.
• EBD Grants: Collaborate with Finance Team to comply with regular submissions and meet yearly audits.
• Additional portfolio includes Micron Voice Engagements, managing Dept budget, compliance with NMI processes, related TD audits and new scopes along the way that contribute to NAND program successes.

Successful candidates for this position will have:

• Bachelor/Masters in related Engineering fields.
• Familiar with both TD and manufacturing environment and business processes
• Extremely strong organizational and communication skills.
• Strong interpersonal skills for smooth collaboration with cross-functional teams.
• Solid communication skills for cross department alignment and providing clarity to leadership and executive teams.
• Highly motivated and adaptable to our demanding, dynamic and rapidly changing work environment.

Job Description

• Attend meetings with stakeholder, contractor and supplier
• Supervise the construction of works in accordance with the project plan and drawings.
• Co-ordinate layout plan, detailed drawings and prepare time schedule
• Work closely with customers; co-ordinate with internal staff; manage sub-contractors
• Determine material type and quantities and placing order with internal staff or suppliers
• Supervise, control and coordinate work according to project plan to ensure timely completion and high quality work.
• Conduct frequent sites inspections and meetings to ensure high quality work by sub-contractors and on time delivery of materials in accordance with schedule
• Enforce site safety procedures, identify and manage risks arising from the workplace or work process

Job Title: Project/Site Engineer - Fire Protection, Plumbing & Sanitary

Job Description:

1. Assist in site supervision of Fire Protection, Plumbing, and Sanitary systems.
2. Coordinate project planning, documentation, and execution of works on-site.
3. Monitor project progress, including manpower, materials planning, and ordering.
4. Liaise with internal departments and external stakeholders, including clients and subcontractors.
5. Oversee submission coordination and prepare necessary progress reports.
6. Conduct site inspections to ensure quality control and compliance with project requirements.
7. Attend site meetings and resolve technical/site issues as needed.
8. Report to the Construction Manager (CM) or Project Manager (PM).

Requirements:

1. Diploma or Degree in Mechanical Engineering or related field.
2. 1-5 years of experience in construction projects.
3. Strong communication skills and ability to interact across all levels.
4. Knowledge of project management processes across all project stages.
5. Experience in wafer fabs or pharmaceutical projects is an advantage.

Your primary responsibilities will be:

• Risk assessment of NAND cell reliability, identification of the process/trim/test strategy to bridge the gaps for JEDEC and internal product qualification.
• Design experiments to identify and segment the limiting reliability mechanisms impacting NAND quality.
• Design high volume electrical experiments (both wafer level and component level) and perform statistical data analysis to validate process/trims solutions required to close reliability gaps.
• Update management and provide continuous feedback to process development and product engineers on the NAND reliability status and roadmap to bridge gaps.
• Contribute to develop forward looking technology path finding for next NAND generation, including reliability risk assessment and product capability projections, identify innovative design and product features required to meet quality specification.

Required skills:

• Proven experience with NAND device structures, operations and algorithms
• Knowledge and understanding of electrical properties of semiconductor and insulator materials, semiconductor device physics and solid-state physics
• In-depth understanding of physics-based modeling of non-volatile memory and semiconductor devices failure mechanisms, reliability analysis
• Knowledge and understanding of statistical analysis and numerical computing software (Matlab, Octave, JMP)
• Knowledge and ability of scripting languages (C, C++, Matlab, Perl)
• Familiar with Big Data and database queries
• Knowledge of JEDEC standards

Responsibilities:

• Prepare Product / Architectural / Mechanical drawings with AutoCAD / Solidworks.
• Work within stated procedures to ensure that design records/controls are maintained.
• Provide product technical support to customers / suppliers.
• Ensure Supplier’s Quality meet our Quality Standard.
• To Initiate / propose / participate in Quality Improvement.
• Take part in new product development.
• Other ad-hoc job assigned by the supervisor.

Requirements:

• Min Degree in Mechanical/Engineering or equivalent.
• Good understanding of Precision machining processes.
• Well versed with manufacturing process & good understanding of material specifications common to Ironmongery industry.
• Minimum 3 to 4 years experience in mechanical field or Ironmongery industry.
• Required language(s): English, Mandarin (to liaise with 90% Mandarin speaking customers - majority, and suppliers in regard to technical support).
• Well verse in Solidworks & AutoCAD Software.
• Responsible, mature, independent with a positive attitude and willingness to learn.

Additional Information

• Office Location: 141 Woodlands Industrial Park E 5, Woodland E-Terrace Singapore 757507.
• Working Hours: Mondays to Fridays (8:30am to 5:30pm), Alternative Saturdays (8:30am to 1:30pm)

For immediate consideration, please indicate the following information in your resume:

(a) Current and expected salary

(b) Earliest available date to commence work

Please note that qualified applicants who are immediately available will be given priority, and we regret that only shortlisted applicants will be notified.

As a Senior- level Device Engineer in Micron's Front End Central Process Integration Engineering (cPIE) team, you will co-work with the global Micron network on improving Device performance to meet product yield and quality requirements, through optimizing process steps, reducing device variability, optimizing design layout or test specs, and standardizing device engineering business process and working methodology. The primary focus could be either DRAM or NAND flash memory when needed.

Requirements:

• Bachelor's degree with a minimum 5 years of relevant working experience is required. Master's or Ph.D. degree in Physics or Engineering areas is preferred.
• Working experience in fab process or process integration or test engineering. Direct experience in CMOS or NAND/DRAM memory device engineering is preferable.
• Require proven knowledge in semiconductor physics and understanding of transistor operations, scaling limitations and reliability, basic knowledge of CMOS circuits and characterization methods. Experience in advance transistor architectures such as High-K metal gate or FinFET or GAA is preferred.
• Deep understanding of at least one semiconductor fabrication process area, including tool sets, process mechanism, tuning knobs, etc.
• Excellent data analysis skills using at least one software (JMP, SPOTFIRE, etc).
• Strong task ownership, self-motivated to work with other team members to make progress collaboratively.
• Open-minded attitude to learn new skills and could adapt to new working environment swiftly.
• Good communication skills. Proficient in English (speaking and written). Working-level communication capability in Mandarin Chinese OR Japanese is preferred.
• Good digital literacy with MS office. Programming capability such as Python is a plus.
• Occasional domestic and international business travel is required.

Job responsibility:

cPIE Device Engineer, responsible for product yield and quality improvement, by working collaboratively with Micron global network, to improve device performance, standardize business procedure and working methodology.

Your primary responsibilities will be:

• Risk assessment of NAND cell reliability, identification of the process/trim/test strategy to bridge the gaps for JEDEC and internal product qualification.
• Design experiments to identify and segment the limiting reliability mechanisms impacting NAND quality.
• Design high volume electrical experiments (both wafer level and component level) and perform statistical data analysis to validate process/trims solutions required to close reliability gaps.
• Update management and provide continuous feedback to process development and product engineers on the NAND reliability status and roadmap to bridge gaps.
• Contribute to develop forward looking technology path finding for next NAND generation, including reliability risk assessment and product capability projections, identify innovative design and product features required to meet quality specification.

Required skills:

• Proven experience with NAND device structures, operations and algorithms
• Knowledge and understanding of electrical properties of semiconductor and insulator materials, semiconductor device physics and solid-state physics
• In-depth understanding of physics-based modeling of non-volatile memory and semiconductor devices failure mechanisms, reliability analysis
• Knowledge and understanding of statistical analysis and numerical computing software (Matlab, Octave, JMP)
• Knowledge and ability of scripting languages (C, C++, Matlab, Perl)
• Familiar with Big Data and database queries
• Knowledge of JEDEC standards

Working location:

• 1, North Coast Drive, Singapore 757432

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

FE Central Product Integration Engineering (CPIE) HPM PI Engineer

As FE CPIE HPM (High Performance Memory) PI Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive HPM Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

Responsibilities and Tasks

• Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
• Active engagement with PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.
• Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.
• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.
• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.
• Travel to Micron Fab locations as necessary for face-to-face collaboration for program requirements.

Requirements

• Background in electrical engineering, materials science, transistor physics and semiconductor process knowledge.
• Experience with Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test, and probe yield will be an added benefit to this position.
• Good data analysis, troubleshoot, problem solving, reporting and presentation skills.
• Good multi-tasking, verbal, and written communication skills.
• Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
• Good organizational capabilities and ability to work effectively with minimal supervision.
• Intermediate to advanced PC skills including Microsoft Office.
• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
• Travel Required: Yes. Willing to travel as needed to support department goals
• Travel Frequency: 20-50%.

Education

• Bachelor’s degree and above in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science or related field of study

Job Description

· Work closely with the Project Team on identifying the customer’s needs and expectations. Site Survey and measurement.

· Support the Project Team on administrative works such as handling customer enquiries, preparing tender documentation, technical and material specifications and daily project reports (photos etc).

· Arrange meetings and monitor progress of the project works to ensure the projects are is on schedule, within budget and completed with good quality.

· Prepare workers’ worksite schedule and logistics arrangement.

· Coordinate with key stakeholders such as contractors, customers, QE/PE to meet authorities requirements and obtain the permits required for project completion.

· Upon completion of project, ensure proper project handover and follow up on maintenance services.

Requirements

· This is a non-executive position with at least 3 years relevant work experience.

· Proactive, committed, and able to work in a fast-paced environment.

· Possess initiative and ability to work independently.

· Good team player with excellent interpersonal and communication skills.

· Class 3 driving license is required

· Job Types: Full-time, Permanent

Job Description
As a Design Engineer, you will report to the Senior Design Engineer and be responsible for the successful implementation and management of BIM processes in the construction field, specifically focusing on Building Services, Airconditioning, and Mechanical (M&E, ACMV) works. You will collaborate closely with the design department to ensure compliance with engineering and safety requirements and coordinate with stakeholders to maintain the integrity and accuracy of the BIM model throughout the project lifecycle.

Key Responsibilities

1. Construct and manage Building Information Models (BIM) with precision, ensuring the integrity and accuracy of all models. Ensure timely coordination and completion of tasks as assigned by the immediate superior.
2. Ensure all BIM models comply with project specifications and requirements.
3. Maintain and update the model library for all ongoing projects, ensuring that all data remains secure and is treated as company property.
4. Collaborate with project teams to collect site information for updating project BIM models.
5. Work closely with the Quantity Surveying department to provide drawings and information required for tendering, cost estimation, monitoring, and scheduling.
6. Coordinate with the BIM department to validate and confirm the accuracy of BIM designs.
7. Maintain, update, and manage hardware and software essential for the operation of BIM.
8. Assist in the creation of 2D AutoCAD drawings and ensure seamless integration between 2D and BIM models, bridging the gap between office and site operations.
9. Ensure all work conforms to the company’s ISO standards.
10. Support the submission of Operation, Maintenance, and Monitoring (OMM) manuals and media presentations using BIM models.
11. Follow the company's responsibility and authority matrix in the execution of duties.
12. Participate in the conceptualization and detailed design of ACMV/HVAC systems, ensuring compliance with local codes and standards, such as Singapore Code of Practice (CP13), SS553, and the Fire Code.
13. Utilize design software to perform thermal load calculations, energy modelling, and system sizing.
14. Prepare design documents including system layouts, schematics, and specifications.

Preferred Experience Areas:

• Hospitals, Labs, Operating Theatres
• Commercial or Industrial Buildings (Warehouses, Factories)
• Government Projects
• Data Centers

Requirements

• Education: Degree in Mechanical Engineering or a related field. Candidates with a degree in Sustainable Infrastructure are welcome to apply. Fresh graduates are encouraged to apply.
• Experience: Must have project ACMV experience.
• Certifications: Safety certification, minimum Bizsafe Level 2. Training will be provided if not already certified.
• Skills:Proficient in English, both written and spoken.
  Strong independence and leadership in a teamwork environment.
  Knowledge in BIM is an added advantage. Inexperienced candidates must be willing to learn, with training provided.
  Ability to move across various local sites.
• Soft Skills: Excellent communication, collaboration, and problem-solving skills.

Advantages & Benefits:

• 5-day work week.
• Progression-centric career development.
• AWS and Variable Performance Bonus included.
• Annual Incentive Trip.
• Sponsorships for further learning/education.
• Flexible working hours and work-from-home options.
• Comprehensive medical benefits.

We are looking for a highly motivated, ambitious, result driven individual with strong work ethic and integrity to join us as a Photolithography Process Development Engineer/Senior Engineer in NAND Technology Integration (NTI) R&D group. You will be using state of the art equipment to support activities associated with rapid deployment of technology nodes, process margin improvement activities and ensure extended engagement with manufacturing on the upcoming technology nodes.

You are responsible for, but are not limited to, the following:

• Develop and optimize lithography processes to meet yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing photolithography team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Collaborate with Boise R&D peers on technology adaptation and cost optimization towards upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough.

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Possess the above qualities ? Join Us !

Responsibilities:

• Design, development, testing and support of firmware/embedded software applications for microcontroller based wireless systems.
• Develop software communication protocols for wireless communication systems
• Drive technology/development projects in all phrases from specification to release.
• Read or understand electronics schematic and system design.
• Work closely with cross functional teams to ensure project delivery on time.
• Define and create product software specification including software architecture, feature descriptions and applications notes of the system
• Research technical issues and/or opportunities and provide recommendations.
• Participate in ad hoc software projects and assignments as required

Requirements:

• Degree in Electronic/Electrical/Computer Engineering/Computer Science, Software Engineering or related fields.
• Minimum 3-5 years of experience in real time embedded system
• Must process strong knowledge of C/C++ language
• Experience with Arm, Cortex based microcontroller is required
• Strong Knowledge of the communication transport protocol like I2C, SPI, UART and USB
• Understanding of the Bluetooth protocol and stack is a plus.
• Familiarity with DSP programming is an added advantage
• Excellent teamwork skills, flexibility, and ability to handle multiple tasks.
• Able to manage one's own time efficiently

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

Interested candidates may also apply or write in to CS Chua, EA 12C6130/ R1548619 [email protected]. Shortlisted candidates will be contacted for a discussion.

Job Responsibilities

• Advanced process development tasks SEM CD, OCD or other metrology techniques in 3D NAND technology.
• Identify and provide solutions for inline detection in collaboration with process engineer and process integration.
• Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe
• Collaborate with US TD Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements.
• Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.
• Influence vendor equipment roadmap to enable new technology development in Micron

Requirements:

• Bachelor’s/ Masters in Engineering would be advantageous
• Experience with semiconductor inspection equipment is preferred.
• Data Science and Data Manipulation skills: Ready to learn and apply basic scripting, coding, or programming.
• Preference for metrology or inspection experience: Especially related to data analysis and root cause investigation.
• Good communication skills (verbal and written)

Responsibilities:

• Review and analyze experimental process flows: Identify defect anomalies and quarantine out-of-control process tools.
• Embrace continuous improvement: Seek ways to enhance operations
• Raise awareness of process anomalies: Recognize and communicate issues promptly.
• Leverage inline process signals: Drive process improvements using real-time data.
• Explore new inspection tools and strategies: Aim for earlier problem detection and source identification.
• Innovate with existing tools: Develop techniques to identify relevant process issues.
• Manage image classification models: Enable automated reporting systems.
• Collaborate with the global network to develop best-known methods and maintain alignment between sites.

Requirements:

• Bachelor’s/ Masters in Engineering would be advantageous
• Experience with semiconductor inspection equipment is preferred.
• Data Science and Data Manipulation skills: Ready to learn and apply basic scripting, coding, or programming.
• Preference for metrology or inspection experience: Especially related to data analysis and root cause investigation.
• Capable of international travel up to 3-5 months
• Good communication skills (verbal and written)

• Application for Building Management System / Energy Management in Singapore/ PLC Programming
• Lead technical discussion and clarification with the customer acting as key contact person for all technical related topics. Under Project Manager leadership monitor engineering deliverables and progress through continuous communication with team members and perform regular technical status reports. Take active part in meetings with the customer.
• Perform and get customer approval on basic and detailed design of integrated solutions in line with the contract (technical, time & performance requirements) and leveraging of products and systems, maximize project profitability and manage technical risk.
• Produce engineering outputs such as System architecture, sub-systems interfacing points, detailed point schedules, control panel drawings, equipment and control valve schedules, description of operations, database generation, graphics development, system hardware and software configuration and programming, etc. Proposal of HVAC and EMS controls strategies in various application.
• Master all technical aspects of the Project: design, integration, testing, FAT, installation,
  commissioning, warranty. Validate technical choices in compliance with the design (based on Technical
  Design Process). Manage stakeholders involved in the execution.
• Proficiency in Programmable Logic Controller, SCADA and DDC Controllers (preferably in Schneider
  brand) development and implementation for redundant system architectures on HVAC applications
  including chiller systems.
• Perform documentation relating to the project properly and promptly dealt with in the correct
  contractual manner. Production and control of RFI's, production of related design, engineering and
  commissioning documentation and operating and maintenance manuals in line with project
  requirements.
• Work in close collaboration with the customer’s project teams, consultants, main contractor, 3rd party
  vendors, Schneider Electric PM & technical leaders for sub-parts to understand the project milestones
  & deliverables and contribute to the overall profitability of projects and to achieve high level of
  customer satisfaction.
• Constantly strive to improve efficiency of the Engineering Solutions through use of standards, tools,
  best practice and lessons learned associated to Controls Strategy, Programming, Graphics, Database
  generation, testing and Engineering Documentation to final Operation & Maintenance Manual.
• Insure good project execution within allocated budget. Identify and anticipate potential risks vs. agree
  budget. Identify and implement technical optimization to save time and cost. Contribute to overall
  Project risk analysis, assess technical risks and propose all necessary actions to avoid, mitigate or
  reduce its impacts. Pro-active in developing and implementing risk response strategies to minimize or
  remove risks
• Identify any potential changes on the job versus the contract or agreed design. Work closely with the Project Manager to specify the change and its implications including the quotation until getting the variation order which will contribute to Project Margin Improvement.
• Master from technical perspective all technical parts of the delivery sub-contracted to external vendors in strong coordination with purchasing team. Implement clear and meaningful scoping of subpart of project scope to insure effective progress and completion monitoring
• Alert on a possible non-technical feasibility as soon as identified. Provide necessary reporting to the PM and management

Responsibilities :

Equipment Performance

• Come up with methodologies to improve %UD/SD performance globally.
• Design Tier 2/3 matrices to improve %UD/SD.
• Develop suitable global reports for sites to benchmark against each other on %UD/SD
• Design and implement a process to improve workstations MOR %UTIL through %MA & Lost time improvement.
• Study the wafer path taken in critical workstations.
• Identify key data that needs to be extracted from the tool EDA system to map the time taken to complete wafer processing.
• Collaborate with SMAI to build a system to compare the wafer processing time between tools within a workstation.
• Quantify capex avoidance/savings that arise from improving Equipment Performance.

Address Tool to Tool mismatches in Process Areas

• Build a database of inputs for all process areas to address tool to tool mismatch proactively.
• Database of inputs should cover the cross matching of software, hardware & process related inputs.
• Collaborate with SMAI to build a system using these inputs to identify & fix tool to tool mismatches in a workstation.
• Appropriate measures, processes, and metrics should be devised to handle and maintain tool to tool mismatches effectively.

Standardization of practices & BKMs in Process Areas

• Setup global area alignment teams to address chronic issues, drive improvements & eliminate wastes.
• Channel improvements and lessons learnt established from various forums, eg. TPM Forum, Excursion Review, etc.  into global area forums to decide on the standards for deployment, implementation and audit.
• Design suitable matrices for each process area so that improvements impact the 4 pillars.
• Create a library of area level BKMs for Equipment & Process Engineers to search for standards involving the setup of Equipment & associated processes.
• This library must also serve the purpose to feed-forward area level BKMs to TD for process development & HVM for improvement work that will impact the 4 pillars.
• Sit in transfer reviews to ensure N-1 standards are fed-forward to N technode for sustenance

Demonstrate Leadership

• Adopt benchmarking and deliver strategies to close the gaps.
• Challenge complacency and do not let strong market conditions give a false sense of reality.
• Gain insights into the competitor's culture, approach, and capabilities.
• Understand that the only way to guarantee our future is to be the best.
• Understand the challenges your team faces.
• Don’t underestimate the effort it takes to be number one.
• Ignite the passion in people to achieve the impossible.
• Dare to set high targets, expect innovation and breakthroughs.
• Give honest, tough, but productive feedback to the team, and be willing to receive it yourself.
• Challenge others and be willing to stand for something.
• Have the courage to turn a crisis into an opportunity.
• Lead from the front and lead by example.
• Become the team that will out-innovate and out-execute the competition. Don’t accept anything less.
• Be unrelenting and “unreasonable”.
• Cultivate a habit of winning. Winning breed’s confidence.
• Find top talent willing to take risk and support them in doing the exceptional.
• Face unsolvable problems head-on and turn them into opportunities.
• Develop teams and team members to enable them to reach their full potential and reward them accordingly.
• Support team members with coaches and mentors who push TM outside their comfort zone.
• Lead the team to success.
• Leave a legacy behind that we are proud of.
• Believe in your team.

Requirements :

• Bachelors Degree in Electrical / Electronics / Semiconductor Engineering
• 10 years of experience and/or demonstrated ability in any of the following Field (Equipment or/& Process)
• Preferably experienced in Photo & PCVD area.
• Applicants must have a consistent record to collaborate globally and influence by indirect leadership in order to drive resourcing to critical projects across Micron.
• Applicants must have a shown capability in dealing with complexity and an ability to apply resources effectively to bring clarity to required actions.
• Applicants must hold a record of performance excellence for current area of responsibility; and are recognized as having demonstrated successful leadership characteristics both in present and past jobs.
• Applicants are viewed by current reports as an excellent mentor, team builder and motivator.
• Applicants must have demonstrated the ability to solve problems across multi-functional groups, both within and outside their department/Site.
• Applicants must have experience handling large, multi-layer groups that encompass a variety of fields.
• Applicants must have proficiency in handling through systems, informing, organizational agility, dealing with ambiguity, and listening. They must demonstrate a strong alignment with Micron Behaviors and the skills they'll use every day.

Job Responsibilities:

• Solicits new customer/products, existing customer’s recommendation and other sources which provide regular updates on construction projects
• Review M&E (Electrical) tender documents and drawing
• Material takes off, prepare bill of quantities and cost estimation
• Prepare technical data quotation and proposal to clients
• Attend to site visits/offices for contract negotiation
• Collects and collates background and ongoing project information of new customers to better facilitate credit approval
• Analyzes reports which helps to increases sales revenue and achieve profitability
• Other ad-hoc activities assigned by superior

Education Required:

• Diploma/Degree in Quantity Surveying, Electrical Engineering

Experience Required:

• Min 2 years in Electrical sector
• Working experience as Electrical QS is preferred
• Proficiency in MS Office & Auto CAD

Competencies and Skills Required:

• Communication skills – Good listening skill, English speaking and in writing.
• Possess good negotiating skills, analytical and research skills
• Good knowledge of materials and construction at site;
• Possess good inter-personnel skill to interact with all levels
• Pay attention to drawing details & requirements.
• Tactfulness with self-confidence.

Responsibilities :

• Establish Detection to have 100% Inline visibility and Inline control

• Improve Detection strategy, system, and methods to continuously strengthen detection performance.

• Enhance Detection capability and strategy to enable Yield improvement, improve Cycle of Learning and strengthen Defense Line.

• Establish and improve BKM (Best Known Method) related to RAM Detection performance, RAM detection cost and RAM supplier engagement

• Ensure BKM sharing spans across all sites regardless of technology and/or site mission differences.

• Set up process parameters for Inspection and Measurement equipment.

• Plan and Evaluate through supplier demo, tool evaluation or H2H (head to head) and Promote new equipment/ material through TOR (Tool of Record) process.

• Implement abnormal analysis and improvement.

• Facilitate and drive global peer groups (HVM and TD) to ensure alignment on strategy and roadmap to achieve area objectives

• Prioritize resources (internally across network and/or externally with Suppliers) to close any gaps.

• Lead Copy Smart Team (CST) and hold the teams accountable to deliver to timelines/commitments. Support cross sites alignment activities through CST and provide strategic direction for the team.

• Set Business Process to handle your area(s) of responsibility to meet the expectations of programs and business processes and adhere to the standards required by those programs and processes.

• Actively provide recommendations to improve and optimize programs and processes to the respective program and/or process owners.

• Be part of the team to handle global business for RAM area, including Tool of Records (TOR), Model of Records (MOR), Manufacturing Tool Evaluation Program (MTEP), DOC2, Executive Review Meeting (ERM), Supplier Change Notice (SCM) documentation etc.

• Keep Acceptance Documentation and Configuration Specs (ADCS) updated to current TOR configuration in your area(s) of responsibility.

• Handle projects with proper Project Management process with metric to track project success.

• Initiate, develop, drive and support strategies that not only benefit one site, but Micron network as a whole.

• Identify and share Best Known Method (BKM) across sites and track compliance to agreed upon alignment to BKMs.

• Track Fab performance metrics for benchmarking purposes. Identify gaps and area of improvements for Fabs.

• Partner with Technology Development and Global Procurement to drive suppliers' competitiveness in RDA and Metrology area to reduce CapEx and OpEx.

• Provide tactical support and coordination for the Fabs as required for issues of People, Safety, Time to Mature cummulative Yield, Quality, Cost, and Cycle Time.

• Engage and drive suppliers on Tool roadmap (MRM), Technology sharing, and other projects

Requirements :

• Masters/Bachelors in Engineering

• Relevant working experiences in RDA and/or Metrology

• Willing and capable of international travel, including Extended International Business Travel (EIBT) assignment to 6 months as needed, to accomplish the goals. Work with suppliers to address issues of spares delivery, quality, performance and change management.

• Good communication skill, maintain a strong and open relationship with peer group and appropriate team members in other functional areas such as Process Integration Engineering, Quality Systems, Production Operations Management, and Purchasing.

• Promote worldwide sharing and transfer of area-specific domain knowledge

Working Location : 1, North Coast Drive, Singapore 757432

Product Integration Engineering team strives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with highest quality and fastest speed through innovation and collaboration with multi-functional team. With the diversity of technology in DRAM/NAND and geography (TD development sites – Boise/Japan, 5 manufacturing sites – US (F6), Taiwan (F11/F16), Japan (F15) and Singapore (F10)), Frontend Central PIE team will be responsible to identify best-known-method holistically, align best-known-method timely and implement improvement systematically across the network. As FE Central PIE Standardization & Metrics Senior Engineer you will be responsible to lead the the team on:

• Drive for alignment and standardization across various fabs on Best-Know-Methods (BKMs)
• Develop Metrics to measure the standardization, sustainability, scalability and synchronization of the BKMs.
• Identify gaps in current programs and use SMART metrics to drive effectiveness and efficiency on program deliverables.
• Transform yield SEAL and SWATs to achieve cPIE missions, improving network resource/talent leverage.
• Constantly drive productivity and eliminate inefficiency / ineffectiveness through metrics and reports automation, drive data to be accurate, accessible and comprehensive.
• Collaborate with various multi-functional teams on yield reports, develop business process to optimize current system with clear roles and responsibility.
• Promotes cPIE teams alignment and collaboration with crtical metrics /metrics definition.
• Collaborate with WFD to standardize network PIE training curriculum, connect with cPIE and network PIE to build training courses.
• Develop human resource strategies to attract, retain and reward talent and effectively deploy them to enhance every individual’s potential
• Engage team members and drive accountability, performance driven culture through clear communication, formal and informal feedback, goals and critical metric
• Drive diversity, equality, and inclusive working environment and foster teamwork and trust in the organization
• Effectively manage team’s internal and worldwide meeting structure. Ensure meetings are efficient, effective and targeted to achieve required outcomes.
• Maintain knowledge of equipment and materials safety concerns. Take a proactive approach to safety, and apply corporate and site safety resources for partner concern issues as appropriate.
• Maintain a strong and open relationship with peer group and managers in other functional areas within CPIE and outside organizations such as Fab, FE PMO/SIC/OCT and Global Quality.
• Travel to Micron sites as necessary for face to face collaboration.

Requirements:

• Bachelor’s Degree in Engineering and related field of study
• 2 years experience in engineering field
• Applicants must have a proven ability to collaborate globally and influence by indirect leadership to drive resourcing to critical projects across Micron
• Applicants must have a proven capability in dealing with complexity and an ability to use resources effectively to bring clarity to required actions
• Applicants must hold a record of performance excellence for current area of responsibility; and are recognized as having demonstrated successful leadership characteristics both in present and past jobs
• Applicants must have demonstrated the ability to solve problems across multi-functional groups, both within and outside their department/Site

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities

• Leading the design, development and characterization of new tools and identifying and closing any hardware and procedural gaps.
• Innovate solutions that enable best in class performance
• Oversee installation and upgrades of tools ensuring quality of work, cost control and alignment to project schedule.
• Engage equipment vendors to improve current products and implement roadmap needs.
• Work with Process Engineers, Manufacturing, Procurement, and Vendor partners to develop a comprehensive package capable for our volume manufacturing sites.
• Generating and maintaining documents that outline equipment performance, operating procedures, maintenance specifications, and cost metrics.
• Support Internal And External Audits

Requirements:
• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, troubleshooting and tool installation procedure is a must.
• Exposure to R&D equipment transfer and ability to develop/optimize equipment hardware design is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
• Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
• Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

GJS for this position: E2 and above

Location: Fab10N

Closing Date: Until filled

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities

• Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond.
• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes.
• Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability.
• Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts.
• Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors’ degree or higher in Materials Science, Chemical Engineering or Physics with minimum 2 years hands-on experiences in relevant regE process developments.
• Familiarity with regE process developments and yield improvements.
• Understanding of various integration and structural impacts and constraints related to wafer edge.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.

As a Senior NAND Cell Device Engineer, in the Singapore Device Technology Development group of Micron Technology Inc., you will be responsible for electrical characterization of the NAND memory cell and develop novel device solutions for cutting-edge 3D-NAND flash technologies. You will have an exciting opportunity to develop best-in class non-volatile memories and products in the world!

Job responsibilities:

• Develop an understanding of performance & reliability requirements for new NAND cells and help refine requirements, as necessary.
• Characterize NAND Memory cell and array properties to identify device improvement directions.
• Analyse automated tester data to establish product qualification gaps, identify new device corners and improve detection capabilities.
• Contribute to the architecture and process definition for state-of-the-art NAND cell, by providing expertise in NAND device physics and array operation.
• Collaborate effectively with process, integration, product, and design engineers, to address NAND memory cell deficits and deliver improvement roadmaps.

Requirements:

• M.S or Ph.D. in Electrical or Electronics Engineering, Physics or Materials Science Engineering or similar.
• 3+ years of work experience in CMOS or non-volatile memory is preferred.
• Deep understanding of semiconductor device physics and processes.
• Knowledge of statistical methods for experiment design and data analysis.
• Solid communication and reporting abilities.
• The ability to be highly skilled at driving for results.

As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization/development to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with equipment/material suppliers to achieve yield, quality, cost and risk management objectives.

Micron’s NAND Technology Integration (NTI) Singapore R&D group is looking for process development engineer to support R&D activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND products.
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing CVD/PVD teams on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise R&D to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

Requirements

• Master degree or higher in Materials Science, Chemical/Microelectronic Engineering, or Physics with minimum 3 years hands-on experience in leading edge film deposition/implant technology work. Fresh PhD/Masters graduates in Materials Science, Chemical/Microelectronic Engineering or Physics are also welcome to apply.
• A deep understanding of chemical kinetics, thermodynamics, physical phenomena and their direct application to CVD/PVD deposition in various deposition methods.
• An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects.
• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise R&D for 4-6 months at a stretch to work on technology development.

Overview

Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our powerful, award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. Diversity, equity & inclusion are integral parts of our culture and drivers of innovation at Keysight. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

Keysight's customers encounter significant cybersecurity risks, which present both opportunities and challenges for our products and solutions. Our mission, "accelerating innovation to connect and secure the world," embodies our purpose and dedication to ensuring the security of our own products. To fulfill this mission, we must prioritize cybersecurity within Keysight and in the products and solutions we provide to our customers.

Job Description:

As a Product Security R&D Engineer at Keysight Technologies, your primary responsibility will involve close collaboration with the Product Security Applications team. Your task will be to integrate secure development methodologies into all our products and services. This includes working with embedded Windows and Linux platforms across various operating systems. The overarching goal of our Product Security Programs is to ensure that all Keysight products meet the necessary regulatory security standards and requirements before they are shipped out.

Team Overview: The Product Security Applications Team, established in Singapore in 2017, is an R&D team dedicated to enhancing the security standards of Keysight products. Their focus is on making sure our products are safe and secure for our end customers. As the sole R&D security team within Keysight, their primary objective is to continually elevate the security baseline of our products.

Responsibilities:

• Collaborate with product development teams throughout different stages of the development lifecycle to integrate product security requirements using Keysight’s Windows and Linux platforms.
• Provide technical support for product security assessments, utilizing tools such as composition analysis, vulnerability management, penetration testing, and fuzz testing. Additionally, assist development teams in devising strategies to address and mitigate identified vulnerabilities.
• Provide technical support for third party open-source license compliance.
• Support and/or recommend third-party tools to assess the security posture of our products in alignment with recognized industry standards.
• Understand and implement product security programs across all operating system (OS) platforms used by Keysight’s products.

Basic Qualifications:

• Bachelor’s degree in computer science/engineering or equivalent experience with security technologies.

Desired Qualifications:

• Experience in software development using C/C++, JavaScript, and Python programming languages.
• Good understanding of common application and network protocols, cryptographic technologies, and common security threats on OS designs (including Linux, Windows, and mobile platforms).
• Strong interest in software engineering, security application development, and security assessment.
• Ability to thrive in dynamic and highly technical organizations.
• 1-2 years of experience working with product development/engineering and security expertise.

Fresh graduates with security-related internship experiences and security knowledge may also be considered

JOB DESCRIPTION
Department: Facility Engineering
Report to: Facility Executive
Functional Relationships with:
Machine Engineering, Manufacturing Engineering and Production

POSITION PROFILE:
Based in: Singapore
Job site: Yishun
The successful candidate will explore the knowledge of Facility equipment maintenance, energy saving, and EHS-related activities.

KEY DUTIES & RESPONSIBILITIES:
• Overhaul, preventive maintenance, corrective maintenance
• Monitor equipment operating condition and record in the checklist
• Making of DI water & treatment of wastewater including maintenance
• Changing of H2 LPG cylinder and monitor N2 consumption
• Maintenance of RTO solvent pumps & room pressure condition
• Maintenance of Last IC Air-Con, Compressors, Vacuum & Exhaust system
• Maintenance and repair of general breakdowns such as toilet taps, floor tiles, painting, etc.

ABILITY/COMPETENCY REQUIRED:
• Diploma in Engineering field (Electrical/Electronic/Mechatronic/Electromechanical) or equivalent.
• Able to work 12 hours rotating shift (morning and night)
• At least 1 year of working experience in the related field is preferred for this position

• Fresh graduates are welcome to apply

• Able to work well as a team player while being independent and pro-active

• Communicate, interact well with all concerned parties Employer questions