Meet the Team

The IoT Digital team is a state-of-art IC design team focused on producing world-class Wireless MCU SoCs. The architecture specification, design, verification, and implementation of the Wireless MCU SoCs is the responsibility of the IoT Digital team. These SoCs include an embedded CPU system with analog and digital peripherals, advanced security, state-of-the-art power management, and best-in-class radios to support a wide range of wireless IoT applications and standards.

As Verification Engineer, you will be working closely with the IC Design, System, and Architecture teams to develop and execute the verification plan for the next generation of IoT chips.

Responsibilities

• Block and IP Verification
• Block-level verification to validate block performance and adherence to requirements
• Generate and execute verification plan based on specifications
• Architect and implement test benches using UVM-based constrained-random and formal methods
• Coverage definition, implementation, and analysis
• Formal Verification of mixed-signal IP integration, including real-number modeling
• SoC Integration and Verification
• Define, test and debug use cases for the SoC
• Verify and debug low-power design
• Flows and Methodology
• Improve flows and methodologies to streamline IP development and integration.

Skills You Will Need

Minimum Qualifications:

• Min. 5 years of IC design experience for senior positions. Open to junior candidates with strong foundation.
• Industry experience developing test benches and verification components with SystemVerilog and UVM is required
• Knowledge of scripting/language (Python, PERL, shell, TCL)
• Design/Verification skills such as Software/Firmware coding (C), SystemVerilog Assertion and coverage analysis, Low-power implementation (UPF), Mixed Signal Real Number Modeling (RNM, Spice)

Benefits & Perks:

You can look forward to the following benefits:

• Employee Stock Purchase Plan (ESPP)
• Insurance plans with Outpatient cover
• Flexible work policy

• To support customer in maintaining their existing AliCloud solutions in accordance with best practices.
• To fix issues in customers existing AliCloud solutions.
• To communicate with Alibaba Cloud for advice on technical issues.
• To communicate and align with offshore AliCloud Data Engineer on task assigned to FPT team.
• Bachelor degree or above in IT and engineering, with relevant professional certificates.
• AliCloud related certification is a MUST.
• At least 1 other cloud (non AliCloud) certification will be preferred. More cloud certifications will be a big PLUS.

Requirements

• 3 to 5 years of working experience in IT industry.
• Hands-on experience in at least 1 AliCloud related project is a MUST. More AliCloud projects will be a PLUS.
• Hands-on experience in other cloud (i.e. non-AliCloud) related projects will be a PLUS.

Job Description & Requirements

Job Description

a) To report to the Manager or team leader as shown in the organization chart. He/she is responsible for the assigned or related project tasks and responsibilities.

b) The detailed duties and responsibilities include but not limited to the following:

i) Study and fully understand the ISO requirements, technical drawings, scope, contractual requirements and sub-contract agreements. Work with the consultants to resolve technical issues prior to construction.

ii) Submit to superior for feedback and concurrence on short or medium-term programmes and execute the works according to the detailed programme.

iii) Ensure that the works are carried out according to the approved drawings, quality procedures and EHS requirements. Managing the works with excellent housekeeping is a key focus.

iv) For quality management, the engineer is responsible to fully implement with the quality recordings, carry out result analysis and formulate action plans for continuous improvement.

v) Implement and maintain proper recordings to comply with EHS, quality, client and authorities’ requirements.

vi) Responsible for cost management so that the materials used for both temporary works and permanent works are not damaged or control the wastage within specified tolerance. Rework or abortive work which has serious time and cost impacts shall be avoided.

vii) Ad-hoc matters as assigned by the PM which is necessary for the execution of the project.

Job Requirements

- Diploma/Bachelor's degree in Mechanical Engineering

- Mininum 2 - 5 years' experience working in construction industry

- Have experience with HDB projects

Project Client Management:

• Excellent execution of project towards company objectives and client satisfaction
• Good understanding of job nature
• Monitor progress of project and update project status to Superior & Finance Department
• Being efficient & manage project efficiently
• To assist engineers in day-to-day issues

Technical Competencies:

• Good understanding of local code requirements
• Good engineering knowledges in relation to company services offered(eg. M&E professional services, Green Mark Related work etc.)
• Help to review the works of the engineers assigned to you, with the objective of compliance to local authority requirements coupled with sound engineering principals

REQUIREMENTS :

• Degree in Electrical or Mechanical Engineering or equivalent.
• Minimum 5 years of working experience in M&E consulting firm.
• Strong building M&E knowledge with hands-on experiences.
• Knowledge in design and building project and relevant code of practice.
• Proficiency in AutoCAD / BIM software is an added advantage.
• Provide guidance to junior engineers.
• Able to work as a team, assertive, independant and proactive.

Interested candidates please submit updated resume via “APPLY NOW”.

Please include your availability date and expected salary in your resume.

We regret only shortlisted candidates will be notified.

Project Client Management:

• Excellent execution of project towards company objectives and client satisfaction.
• Good understanding of job nature
• Monitor progress of project and update project status to Superior & Finance Department
• Being efficient & manage project efficientcy

Technical Competencies:

• Good understanding of local code requirements
• Good engineering knowledges in relation to company services offered (eg.M&E professional services, Green Mark Related work etc.)

REQUIREMENTS :

• Candidate must possess at least Diploma/Bachelor's Degree in Engineering (Electrical/Electronic), Engineering (Mechanical) or equivalent.
• Required language(s): English
• At least 2 Year(s) of working experience in an M&E Consulting firm.
• Knowledge in design and building project and relevant code of practice.
• Proficiency in AutoCAD/BIM software is an added advantage.
• Able to work as a team, assertive , independent and proactive.
• Candidate without relevant working experience but with good interpersonal skills will be considered.

Interested candidates please submit updated resume via "APPLY NOW".

Please include your availability date and expected salary in your resume.

We regret only shortlisted candidates will be notified.

We are seeking qualified candidates to join our team in the following roles:

• Project Coordination.
• Manage and engage client/contractors and loca authorities to drive project exceution, submission to authorities and overall on-site construction supervision
• Carry out inspection of M&E work, such as Fire Sprinkler, Fire Suppression, FAP..etc
• Ensure contractor comply with all necessary standards, code of practice and safety regulations
• Prepare M&E coordination drawings and liaise with Architectural Coordinators for drawing issuance
• Handle any other ad-hoc duties and tasks assigned.
• .

Requirements:

• Ability to work proactively, independently, and as part of a team.
• Demonstrated ability to learn quickly.
• Knowledge in Mechanical & Electrical Engineering is a plus.

If you are interested in joining our dynamic team and meet these qualifications, please submit your resume and a cover letter. We look forward to welcoming you!

1. PREPARATION OF INSTALLATION SCHEDULE

2. PREPARATION OF SUBCONTRACTOR’S CONTRACTS

3. SITE SUPERVISION AND PROGRESS MONITORING

4. EQUIPMENT & MATERIAL ARRANGEMENT, DELIVERY & CHECKING

5. SITE CO-ORDINATION MEETING

6. PREPARATION OF DAILY REPORTS, MONTHLY REPORTS, PURCHASE ORDERS & DELIVERY ORDERS

7. PREPARATION OF BUDGETARY AND CONTROL

8. PREPARATION OF SITE PROGRESS CLAIM

9. SAFETY

10. WORK QUALITY CONTROL

11. PREPARATION OF OPERATION & MAINTENANCE MANUAL

12. COMMISSIONING, PREPARATION AND MONITORING

13 PREPARATION OF AS-BUILT DRAWING

14. PREPARATION OF COST ESTIMATION

• Proficiency in Scala programming and functional programming principles.
  • Strong SQL skills, including query optimization and database design.
  • Hands-on experience with Hadoop ecosystem tools (HDFS, Hive, YARN, MapReduce).
  • Familiarity with other big data tools like Spark, Kafka, or Flink is a plus.
• Problem-Solving:
  • Strong analytical skills with the ability to troubleshoot and resolve complex data issues.
• Communication:
  • Excellent communication skills to effectively collaborate with technical and non-technical stakeholders.
• Experience:
  • 6+ years of experience in data engineering, big data technologies, or a similar role.

Office Location : Tai Seng

Working hours : Monday to Friday | 8am to 6pm | Saturday 8am to 12pm

Salary (commensurate with experience) : Up to $5,000 + Variable Bonus + Annual Leaves + Medical Benefits

Industry : Construction Sector - A&A / Building Works

Job Responsibilities:

•Check and analyse drawings, authority requirements and tender specifications

•Check site installation whether it is in accordance to design and standards

•Check and prepare for discrepancies of drawings to be highlighted to consultant

•Oversee the projects and follow the terms and conditions of contracts. Ensure compliance to contracts and the drawings with regulatory specifications

•Able to coordinate with owners, architects, consultants, project managers, sub-contractors and suppliers.

Job Requirements:

•Candidate has at least 2 years of relevant working experiences that possess Degree in Construction, Civil Engineering and M&E or equivalent

•Entry level candidates are encouraged to apply ，as training will be provided.

•Knowledgeable in basic Autocad software

•Has positive attitude and sense of responsibilities

•Able to handle construction projects with commitment on work

•Good in communication and written abilities

•Required skill : Able to use Microsoft Project to present schedule to the clients

Maxhunt Resource Pte Ltd | EA Licence: 22C1322
Loh Wing Sheng | Registration No: R22110239

Basic salary: $3,200 - $4,500

Working hours: 8.30am to 6pm, 5 days work week

Location: Serangoon

Job Description

● Technical transfer product/project in assembly and testing, and from customers

● Provide technical support in manufacturing and testing in product build

● Provide technical support to QC in RMA issue

● Provide technical support to QA in Compliance, Regulatory, Customer & Audit

Requirements:

● Minimum Diploma in Electronics Engineering

● At least 2 years of relevant work experience in Electronics Manufacturing industry

● Technical competent to handle product/project manufacturing, transfers and troubleshooting

● Experience in product/project, PCBA manufacturing and testing

● Able to liaise with customer on technical matters

● Experience in manufacturing environment with ISO13485 & FDA preferred

● Good communication and problem-solving skills

● Medical product experience and Quality Management System exposure preferred

If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

EA Personnel.: Chan Jun Wei

EA Registered no.: R1543992

Recruit Now Singapore Pte Ltd

EA License no.: 21C0845

Job Description:

• Planning of hardware (control panel, wiring diagrams)
• Developing and documentation of the software
• Commissioning of equipment Asia Pacific (a high travel readiness is required).
• Be responsible for the complete electrical field of the projects.

Requirements:

• Degree in electrical engineering
• At least 1 year of experience with Siemens PLC S7, TIA PORTAL V15
• Knowledge of E-Plan and HMI programming is an advantage

Responsibilities:

• Perform and manage software development activities including requirements gathering and analysis, planning, systems design, development and implementation, documentation, testing and deployment.
• Participate and manage in all areas of the software development lifecycle from requirements definition to deployment.
• Document and demonstrate solutions by developing documentation, flowcharts, wireframes, diagrams, charts, UI/UX, code comments and code reviews.
• Recommend and evaluate detailed design of system components/libraries to ensure reusability and flexibility is practiced, where applicable.
• Develop and Implement the software in accordance to the coding standards and design patterns specified in the design document
• Debug, troubleshoot and resolve bugs and complex issues.
• Research and evaluate new software technology stacks for project and product development.
• Report to and coordinate closely with Team Lead / Project Manager for projects deliverables.
• Provide operational support, ongoing maintenance and enhancement.
• Provide guidance to junior engineers.

Requirements

• Bachelor’s degree with solid programming skills in C# is highly desired.
• Strong working knowledge on Microsoft technologies like .Net, service-oriented architecture, Entity Framework, nHibernate, ASP.NET, WPF, WCF and MS SQL.
• Strong OOP design experience.
• Working experience in healthcare domain, HL7, DICOM is a plus.
• Working knowledge on cloud DevOps
• Familiarity with software design patterns, such as MVC and MVVM.
• Able to work independently with minimum supervision.
• Experience with Python or React would be advantageous.
• A good innovative team player with strong sense of integrity & accountability.
• Great communication skills.
• Must have willingness to learn new technologies.
• Excellent problem solving and analytical thinking skills.

What we offer:

• An attractive remuneration package will commensurate your experience and qualification.
• Work with a team who are generous in knowledge sharing, friendly, smart, passionate, and funny too.
• Business casual dress throughout the week.
• Professional training opportunities. We believe learning is a lifelong journey. We offer everyone the internal and external training opportunity to grow employee’s technical skills.

Responsibilities:

• Perform and manage software development activities including requirements gathering and analysis, planning, systems design, development and implementation, documentation, testing and deployment.
• Participate and manage in all areas of the software development lifecycle from requirements definition to deployment.
• Document and demonstrate solutions by developing documentation, flowcharts, wireframes, diagrams, charts, UI/UX, code comments and code reviews.
• Recommend and evaluate detailed design of system components/libraries to ensure reusability and flexibility is practiced, where applicable.
• Develop and Implement the software in accordance to the coding standards and design patterns specified in the design document
• Debug, troubleshoot and resolve bugs and complex issues.
• Research and evaluate new software technology stacks for project and product development.
• Report to and coordinate closely with Team Lead / Project Manager for projects deliverables.
• Provide operational support, ongoing maintenance and enhancement.
• Provide guidance to junior engineers.

Requirements

• Bachelor’s degree with solid programming skills in C# is highly desired.
• Strong working knowledge on Microsoft technologies like .Net, service-oriented architecture, Entity Framework, nHibernate, ASP.NET, WPF, WCF and MS SQL.
• Strong OOP design experience.
• Working experience in healthcare domain, HL7, DICOM is a plus.
• Working knowledge on cloud DevOps
• Familiarity with software design patterns, such as MVC and MVVM.
• Able to work independently with minimum supervision.
• Experience with Python or React would be advantageous.
• A good innovative team player with strong sense of integrity & accountability.
• Great communication skills.
• Must have willingness to learn new technologies.
• Excellent problem solving and analytical thinking skills.

What we offer:

• An attractive remuneration package will commensurate your experience and qualification.
• Work with a team who are generous in knowledge sharing, friendly, smart, passionate, and funny too.
• Business casual dress throughout the week.
• Professional training opportunities. We believe learning is a lifelong journey. We offer everyone the internal and external training opportunity to grow employee’s technical skills.

Responsibilities

Excellent execution on assembly process for 1st NPI success and smooth transfer process from NPI to HVM

• Excellent execution of the qualification of NPI products / packages build that proliferate from the pilot products and packages according to planned timeline
• Full responsible on support NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation and documentations.
• Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline and design rules.
• Collaboration with multi-functional team from NPI to LVM/HVM process transfer. On-time execution of NPI Customer samples and Engineering Samples build for new products and packages

SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization

• Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continue improvement action, with problem solving methodology, statistical analysis and integration solution decision.
• Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
• Continuous develop in depth assembly process technical knowledge, well understand process capability/tolerance//spec limit/CpK, and apply key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
• Global leader for cross team collaboration on network BKM, process recipe spec and recipe standardization/conversion.

Technology enablement and development – Process, Material, Equipment

• Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior 1st Qual Silicon deliver.
• Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues)
• Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensure key process technology and capability enablement is in-line.
• Frequent review and participant Competitor Analysis, to understand market trends and competitor’s technology/capability boundary
• Engage and follow PDE business process (TGR, TORB, KEG interlock) for new technology qualification, alignment and safe launch

Teamwork and General expectation

• Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross team (peers, counterpart)
• Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations and decision making.
• Develop, or coordinate development of, training materials for existing/new process
• Safety Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout and chemical safety.

Qualification

• Bachelor or Masters in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 1-3 or more years of experience in Semiconductor Manufacturing, Process & Equipment Engineering and/or New Product Introduction.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Organized, meticulous, and strong focus on results.
• Excellent analytical skills
• Excellent communication and written skills

As a Quality & Reliability Assurance Engineer in Global Quality, we are encouraged to conduct electrical failure analysis and data analysis of next-generation 3D NAND memory devices. To sustain and improve Micron's memory quality, and developing outgoing monitor strategies together with risk assessment and product disposition in deviation management in HVM (high volume manufacturing( environment.

Responsibilities and Tasks

• Develop outgoing quality and reliability monitor strategies of NAND products in production phase.
• Perform product failure analysis on rejects to identify the failure mode and mechanisms that will lead to successful corrective actions and/or preventive actions.
• Assist and consult on post qualification quality and reliability issues and assist in the analysis and disposition of these materials.
• Coordinate with Research and Development and Product Engineering teams to comprehend new reliability issues and how to test for and assess their impact to customer risk and reliability.

Requirements

• Excellent problem-solving and analytical skills with strong attention to details.
• Ability to communicate clearly and concisely both verbally and in writing is essential in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work optimally in cross-functional teams and handle pressure situations in a professional manner.
• Candidates with at least 2 years of experience in the semiconductor industry as QRA or Product Engineer are preferred but fresh graduates are welcomed to apply. Experience in flash memory debugging and failure analysis is a plus.
• Bachelor's or Master's degree Electrical Engineering, Electronics Engineering, or a related discipline.

Key Responsibilities:

• Development of Analog/Mixed-Signal circuits from specifications to prototypes.
• System-level analysis and evaluation, full-chip architecture design, analysis, modeling, simulation, and integration.
• Schematic entry, corner simulation, layout consideration, and post-layout simulation.
• Work closely with the layout engineer to conduct the physical implementation (layout) and chip floor planning.
• Responsible for post-layout extraction and parasitic analysis.
• Able to work with other designers, Chip Architects, and layout engineers to achieve full-chip integration, place and route, top-level verification, and tape out.

Requirements:

• Ph.D./Master/Degree in Electrical Engineering or Microelectronics with excellent technical background in Analog /Mixed-Signal IC design
• Min. 3 years of experience in CMOS Analog IC design and simulation
• Good design experience in Analog IC design involving two or more of the following blocks: low noise pre-amplifier (low offset, high CMRR, high PSRR and bandwidth up to 600MHz), CMOS Gigahertz Oscillator, switched capacitor circuit, LDO, Differential Amplifier, comparator, Opamp, TIA, and Bandgap Reference and high-frequency full-wave rectifier, etc.
• Good design knowledge in ESD and Latch-Up.
• Experience in isolator devices (capacitive-coupler or optical-coupler) and photodetector-associated circuits will be an added advantage.
• Experience with sigma-delta modulators and IO drivers will be an added advantage.
• Good working knowledge of relevant analog IC design and simulation tools (Spice or its equivalent)
• Basic understanding and can develop simple design-related scripts with some common script languages, such as perl, Tcl, matlab or cadence skill etc.
• A team player with good communication skills.
• Able to work independently, flexibly, and creatively.
• Candidates with no prior working experience are welcome to apply.

Key Responsibilities:

• Development of Analog/Mixed-Signal circuits from specifications to prototypes.
• System-Level analysis and evaluation, full-chip architecture design, analysis, modeling, simulation, and integration.
• Schematic entry, corner simulation, layout consideration, and post-layout simulation.
• Work closely with the layout engineer to conduct the physical implementation (layout) and chip floor planning.
• Responsible for post-layout extraction and parasitic analysis.
• Able to work with other designers, Chip Architects, and layout engineers to achieve full-chip integration, place and route, top-level verification, and tape out.

Requirements:

• Ph.D/Master/Degree in Electrical Engineering or Microelectronics with excellent technical background in Analog /Mixed-Signal IC design.
• Min. 5 years of experience in CMOS Analog IC design and simulation.
• Good design experience in Analog IC design involving two or more of the following blocks: low noise pre-amplifier (low offset, high CMRR, high PSRR and bandwidth up to 600MHz), CMOS Gigahertz Oscillator, switched capacitor circuit, LDO, Differential Amplifier, comparator, Opamp, TIA, and Bandgap Reference and high-frequency full-wave rectifier, etc.
• Good design knowledge in ESD and Latch-Up.
• Experience in isolator devices (capacitive-coupler or optical-coupler) and photodetector-associated circuits will be an added advantage.
• Experience with sigma-delta modulators and IO drivers will be an added advantage.
• Good working knowledge of relevant analog IC design and simulation tools (Spice or its equivalent).
• Basic understanding and can develop simple design-related scripts with some common script languages, such as perl, Tcl, matlab or cadence skill etc.
• A team player with good communication skills.
• Able to work independently, flexibly, and creatively.

Key Responsibilities:

• Development of Analog/Mixed-Signal circuits from specifications to prototypes.
• System-level analysis and evaluation, full-chip architecture design, analysis, modeling, simulation, and integration.
• Schematic entry, corner simulation, layout consideration, and post-layout simulation.
• Work closely with the layout engineer to conduct the physical implementation (layout) and chip floor planning.
• Responsible for post-layout extraction and parasitic analysis.
• Able to work with other designers, Chip Architects, and layout engineers to achieve full-chip integration, place and route, top-level verification, and tape out.

Requirements:

• Ph.D/Master/Degree in Electrical Engineering or Microelectronics with excellent technical background in Analog /Mixed-Signal IC design
• Min. 8 years of experience in CMOS Analog IC design and simulation
• Good design experience in Analog IC design involving two or more of the following blocks: low noise pre-amplifier (low offset, high CMRR, high PSRR and bandwidth up to 600MHz), CMOS Gigahertz Oscillator, switched capacitor circuit, LDO, Differential Amplifier, comparator, Opamp, TIA, and Bandgap Reference and high-frequency full-wave rectifier, etc.
• Good design knowledge in ESD and Latch-Up.
• Experience in isolator devices (capacitive-coupler or optical-coupler) and photodetector-associated circuits will be an added advantage.
• Experience with sigma-delta modulators and IO drivers will be an added advantage.
• Good working knowledge of relevant analog IC design and simulation tools (Spice or its equivalent)
• Basic understanding and can develop simple design-related scripts with some common script languages, such as perl, Tcl, matlab or cadence skill etc.
• A team player with good communication skills.
• Able to work independently, flexibly, and creatively.

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Advance Packaging Integration – Senior Engineer (Package Development Engineering, Silicon Technology Package Integration) (PDE STPI)

We are looking for a Package Silicon Integrator in Package Development Engineering (PDE) Senior Engineer who will lead and drive Micron’s Packaging Technology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal, Electrical, Mechanical, Reliability and Cost. You will collaborate with Micron’s multi-functional team that include Product Development, Wafer level process, Assembly, Test, Manufacturing and Global Quality. Together, we will be responsible for the designing Test Vehicle Development Strategy, and execution to definition, development, and delivery of state-of-the-art product/packages that will shape the future of advanced computing, automotive and mobile products.

Responsibilities will include, but are not limited to:

• Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet “go to market” timelines.
• Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices, body sizes, manufacturability, and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
• Evaluate wafer design inclusive of bondpad, scribe, pillars/bump and polyimide, and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
• Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA, DMA, nanoindentation, and packaging mechanical and thermal stress stimulus.
• Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical, mechanical (1st, 2nd, and 3rd level interconnect), thermal, reliability, cost, and other system level requirements.
• Interface closely with multi-functional team that include Product Development, Wafer Level Process, Assembly, Test, Manufacturing and Global Quality and manage the product/package to mass production.

Requirements:

• Bachelor/Masters of Science in physics, materials, mechanical, chemical, or electrical engineering. MS or PhD preferred
• 5+ years of relevant experience in semiconductor manufacturing or a related field, with hands-on experience in semiconductor packaging or Frontend processes, specifically in technology on
• Appreciation for Structured Problem Solving
• Ability to interpret die-, package-, and system-level design and simulation (thermal/mechanical/electrical) methodologies and results
• Knowledge in Chip Package Interaction (CPI)
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures is a plus
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical partners
• Demonstrated leadership experience in guiding multi-functional teams and driving technical excellence

Keen on the role? Apply now!

Summary:

• Customer Service in logistic industry (Air & Sea)
• Basic salary up to $2400
• Location: Changi
• 5.25 days work week
• 9.00 - 6.00pm
• Entry level / Fresh grad are welcomed to apply

Key Responsibilities:

• Provide support to the customers / overseas agent by handling sales quotation and other inquiries for air
• Arrange air export booking with airlines
• Handle air export billing and invoice
• Liaise with operation team for shipment arrangement
• Perform other ad hoc duties as requested

Key Requirements:

• Bilingual in English and Mandarin to deal with Mandarin speaking clients
• Basic computer skills (ie Microsoft Office)

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Summary:

• Basic up to $4500
• Performance bonus
• 5 days work week, 8-5pm
• Location: Pioneer
• MNC company
• Career Advancement
• Proficiency in CNC machines

Key Responsibilities:

• To repair & service CNC machines in the region
• To implement service programmes for customer service
• Machine Installation
• Documentation (Service report, Machine registration, filing and record)
• Other related adhoc duties

Key Requirements:

• Min Diploma in Electrical / Mechanical / Mechatronics Engineering
• Min 2 years of relevant experience in servicing CNC turning / milling machines
• Possess class 3 driving license

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Summary:

• Basic salary up to $4500
• Commission + Variable bonus
• Transport allowances or reimbursement
• 5 days work week @ 8.30 - 5.30pm
• Location: Tai Seng (walkable from MRT station)
• Opportunity to travel overseas
• Sales or engineering experience / background

Key Responsibilities:

• Identify and approach potential clients via cold calling, proposal emails, networking and etc
• Establish and maintain relationships with clients to foster long-term business
• Prepare quotes and proposal tailored to client's needs
• Use knowledge of products and services to recommend solutions
• Coordinate with internal departments to resolve operational issues
• Address customer concerns related to products
• Other ad hoc duties

Key Requirements:

• Min Nitec in Electrical / Electronic engineering or equivalent
• 2 year of sales / engineering experience
• Willing to travel overseas

Interested applicants, please submit your updated resume in MS Words / PDF format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be informed that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Job Description

• Understanding of Project Specifications, construction drawings and to ensure that all site activities comply with the regulations and client’s requirements
• Monitor site works to ensure the method statements and work procedure are strictly followed.
• Competent in carrying out supervision of structural works by identifying any non-conformity of contractor’s work site
• Ensure the Builder (incl. technical supervisors) executes the work in accordance to Consultant’s instructions
• Check drawings for discrepancies and highlight to Consultant, suggesting possible solutions to prevent delays
• Conduct quality inspections and quality control of materials used for the project
• To ensure proper documentation of site inspection records, safety records and approved /as-built drawings
• Maintaining and updating site records on progress of work, housekeeping and preparing reports
• Verify the contractors’ progress payment, claim in terms of work done and materials/equipment delivered and stored on site
• Witness all the inspection, testing and commissioning sessions performed by the contractors to ensure compliance with designs and specifications
• Report to project QP / Project Consultants Team on quality and progress
• Supervision of demolition of basement/foundation, ERSS construction and all other design works
• To manage & coordinate with the site supervisors (incl. RTO) with respect to C&S engineering works, architectural and M&E engineering works
• Possesses a complete understanding of local requirements, especially to comply with BCA's criteria for build-ability and safety assurance system
• To carry out regular site checks on Builder and ensure compliance on health and work safety in accordance with MOM
• To attend site, progress, variation and coordination meetings.
• Period: 12 months
• Start from: January 2025

Requirements:

• min. Degree in Civil / Structural Engineering or equivalent
• At least 8 years of relevant experience in supervision of Hospital and Architecture work
• Resident Engineer Certificate accredited by IES / ACES is a must, candidate without RE certificate need not apply
• Conversant in statutory code and requirements
• Good team player with strong interpersonal and communications skills essential

Please indicate project involved, expected salary and notice period required in CV.

We regret that only short-listed candidates will be notified.

For more posting, please refer to https://www.facebook.com/profile.php?id=61566487478500&mibextid=LQQJ4d

Office Location : Tai Seng

Working hours : Monday to Friday | 8am to 6pm | Saturday 8am to 12pm

Salary (commensurate with experience) : Up to $5,000 + Variable Bonus + Annual Leaves + Medical Benefits

Industry : Construction Sector - A&A / Building Works

Job Description

•Check and analysis drawings, authority requirements and tender specifications

•Check site installation whether it is in accordance to design and standards

•Oversee the projects, ensure compliance of contracts and the drawings with regulatory specifications.

•Able to coordinate with owners, architects, consultants, project managers, sub-contractors and suppliers.

•Attend meetings with architects and consultants

•Other ad-hoc duties as assigned

Job Requirements: Possess at least diploma in Electrical Engineering and Mechanical Engineering (M&E) or equivalent

•However, entry level are encouraged to apply, from recognized University by Singapore PE Board as training will be provided.

•Good operational planning for construction projects

•Good in communication and written abilities

•Required skill: Able to use Microsoft Project to present schedule to the client

•Knowledge in Construction and Renovation.

•Skills required: Autocad

Maxhunt Resource Pte Ltd | EA Licence: 22C1322
Loh Wing Sheng | Registration No: R22110239