Summary:

• Basic up to 6k
• Performance bonus
• 5 days work week
• Location: Pioneer
• MNC company - stable revenue
• Strong in CATIA

Key Responsibilities:

• Produce CNC design solutions for customize specification
• Produce design for automation
• Make drawings (2D & 3D) in CATIA
• Make parts explosion / BOM list using ENOVIA
• Documentation for fabrication
• Evaluation for design solutions
• Support production for machine modification design
• Do engineering presentations
• Other related adhoc duties

Key Requirements:

• Min Diploma in Mechanical Engineering
• Min 2 years relevant working experience
• Strong in CATIA

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

IT Support Engineer

Responsibilities:

- Installing and configuring computer hardware, software, systems, networks, printers etc

- Responding in a timely manner to service issues and requests

- Providing technical support across customers

- On-site support for IT related issues at customer office

- Performing & maintaining customers’ IT inventory list

- Handling server related issues through the ticket system, escalate to server supplier TAC and follow up accordingly.

- Replace parts for servers like mainboards, CPU, RAM, HDD/SSDs, network linecards / modules, transceivers and cables

Requirements:

- Diploma in Computer Science, Information Technology or related disciplines

- Strong interpersonal and communication skills and the ability to work effectively with a wide range of constituencies in a diverse community.

- Troubleshooting & Problem-solving skills

- Ability to determine computer problems and to coordinate hardware, software, and/or network solutions.

- Ability to communicate technical guidance and instruction to users on the use of PC and/or mainframe applications and systems.

Capable of working in a fast paced environment

- Knowledge of a wide range of computer systems software, applications, hardware, networking, servers and communications.

- Familiar with data center environment is a PLUS

------------- Send me your resume via WhatsApp ❤

WhatsApp: (https://api.whatsapp.com/send?phone=6592377799)

I regret to share that only shortlisted candidates will be notified. www.dadaconsultants.com EA Registration Number: R22108564

Data provided is for recruitment purposes only Business Registration Number: 201735941W. Licence Number: 18S9037

ROLE:

A*Star-IME is currently working on establishing a hybrid fabrication platform for 150mm and 200mm Silicon Carbide (SiC) power MOSFETs as a new pillar on Singapore"s Future of Microlectronics in wide-bandgap. The main objective of this SiC RnD program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, specifically focusing on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this role to be successful include the development and integration of several process modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, and ohmic contact formation. We are actively looking for individuals with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• Lead develop process technology for SiC power MOSFETs and ensure it meets the requirements for prototyping manufacturing

• Collaborate with advanced process module development team to establish a process flow for fabricating specific MOS devices

• Responsible to develop and improve test structures that enable fast and rigorous characterization of process

• Accountable to improve device performance and yield through the design, execution, and analysis of experiments for each specific device and product

• Work with cross-functional teams to minimize defects and address technical and yield concerns

• Drive CIP (Continuous improvement plans) to deliver integrated process modules and specific device per project goals

• Make decisions regarding the delivery of process, active and passive devices to multiple customers

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device physics

• Proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and the physics of MOSFET devices

• Strong communication skills to effectively communicate information about module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data, coupled with strong presentation abilities

• Knowledge on HVAC fundamentals (chillers, pumps, cooling towers, air handling units)
• Identify, design, and propose energy conservative measures (ECM) on the chilled water system which includes:

1. Instrumentations selection and design on the measurements and verifications (M&V) system (temperature sensors, flow meters, pressure sensors, weather stations, power meters)
2. Centrifugal water pumps energy optimizations strategy
3. Chillers energy optimizations strategy
4. Cooling tower energy optimizations strategy
5. Heat balance substantiating test

• Operating system efficiency (OSE) report preparation
• Documentation of the chiller system optimization design

We prefer full time interns who can commit at least 5 months between January 2025 to July 2025.

Remuneration: Basic + VB

Work location: Alexandra

Job Description:

Report to the Project Director / Manager in Charged of the WTW system.

• Project Support: Provide technical expertise to oversee the design, development and construction of the WTW system.
• Interface with WTW system designer, vendors, fabricators including drawings reviews, sourcing equipment, cost control and monitoring, schedule monitoring and update.
• Project Execution: Oversee project implementation according to the requirements and objectives. This includes schedule monitoring, vendors sourcing and recommendation, purchase/ cost evaluation, resources allocation, attend to inquiries, clarifying technical details, supervising project execution, implementing corrective actions, conducting Factory Acceptance Tests, and finalizing as-built
• documentation.
• Troubleshooting and Repair: Diagnose and resolve malfunctions in deck machinery using technical manuals, hand tools, and power tools.
• Record Keeping: Meticulously maintain records of all changes, maintenance, repairs, and inspections.
• Develop operating, maintenance and safety procedures for the WTW system.

Job Requirements:

• Degree in Mechatronic or equivalent
• Min 5 years working experience in Marine Industry or shipyard environment.
• Good understanding of deck machinery such as winch, crane, lifting and handling equipment and the related IACS (particular ABS, DNV, BV) rules and regulations.
• Specific experience in WTW system (Offshore Passenger Transfer System) is highly advantageous
• Strong understanding of mechanical principles, hydraulic and electrical system and P&ID with ability to perform trouble shooting.
• Strong leadership with problem-solving skills. Strong understanding in structural design is highly advantageous
• Ability to speak both English and Mandarin to liaise with Mandarin speaking clients
• Software – able to use MS Office, MS Powerpoint, MS Project, Adobe and AUTOCAD. Ability to use Primavera scheduling software is highly advantageous
• Good understanding of Document Control. Knowledge of ISO9001:2015 QAM system is highly advantageous
• The candidate must be willing to travel and work in marine and offshore environment.

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

Summary:

• Basic up to 4.5k
• Performance bonus
• 5 days work week, 8-5pm
• Location: Pioneer
• MNC company
• Career Advancement
• Proficiency in CNC machines

Key Responsibilities:

• To repair & service CNC machines in the region
• To implement service programmes for customer service
• Machine Installation
• Documentation (Service report, Machine registration, filing and record)
• Other related adhoc duties

Key Requirements:

• Min Diploma in Electrical / Mechanical / Mechatronics Engineering
• Min 2 years of relevant experience in servicing CNC turning / milling machines
• Possess class 3 driving license

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

Summary:

• Basic up to 6k
• Performance bonus
• 5 days work week
• Location: Pioneer
• MNC company - stable revenue
• Strong in CATIA

Key Responsibilities:

• Produce CNC design solutions for customize specification
• Produce design for automation
• Make drawings (2D & 3D) in CATIA
• Make parts explosion / BOM list using ENOVIA
• Documentation for fabrication
• Evaluation for design solutions
• Support production for machine modification design
• Do engineering presentations
• Other related adhoc duties

Key Requirements:

• Min Diploma in Mechanical Engineering
• Min 2 years relevant working experience
• Strong in CATIA

Interested applicants, please submit your updated resume in MS Words format by using the APPLY NOW BUTTON.

By submitting your personal data and/or resume, you give consent to the collection, use, and disclosure of your personal data and/or resume by the company (or its agent) for the purpose of the processing and administration by the company relating to this job application.

Please be notified that only shortlisted candidates will be notified.

Your recruiter for this job: Stella

WhatsApp me @ 8772 4117 for a prompt response to your enquiry!

Stella Aw Yong See Hui | R24121552

Recruit Now Singapore Pte Ltd | EA No: 21C0845

As part of IME Integrated Circuit Design and System Department, we are seeking a candidate with relevant experience in analog integrated circuit design. This candidate will contribute to developing analog circuit blocks e.g. low-power operational amplifiers, voltage/current references, and voltage regulators based on thorough topology analysis. This candidate will work closely with other team members for the circuit design, test verification, as well as system integration and validation for a broad range of innovative sensor systems.

Role & Responsibilities

• Circuit schematic design and simulation, layout supervision, pre-tapeout design verification, test plan development and chip measurement
• Work together with teams to investigate novel circuit/system solutions to create new inventions

Requirements

• Bachelor’s / Master’s degree in Electronic Engineering
• Good understanding of CMOS analog IC design methodologies
• Familiar with analog IC design and verification flow
• Industry experience would be a plus
• Familiar with the IC test equipment such as oscilloscope, spectrum analyzer, etc.
• Able to generate high-quality scientific publications and patents
• Team player, quick learner and self-driven

Basic salary: ($3,200 - $4,500)

Location: Serangoon

Mon - Fri, 8.30am to 6pm

Job Description

• Technical transfer product/project in assembly and testing, and from customers
• Provide technical support in manufacturing and testing in product build
• Provide technical support to QC in RMA issue
• Provide technical support to QA in Compliance, Regulatory, Customer & Audit

Job Requirements

• Minimum Diploma in Electronics Engineering
• At least 2 years of relevant work experience in Electronics Manufacturing industry
• Technical competent to handle product/project manufacturing, transfers and troubleshooting
• Experience in product/project, PCBA manufacturing and testing
• Able to liaise with customer on technical matters
• Experience in manufacturing environment with ISO13485 & FDA would be highly advantageous
• Good communication and problem-solving skills
• Medical product experience and Quality Management System exposure would be highly advantageous

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

As a Senior Package Design Engineering (PDE) Central Engineering System and Analytics (CESA) Engineer, you will develop integrated solutions to empower Backend Operations to make data-driven and heuristics-based decisions. You will work across Global Operations and sites to improve Cost, Scale, Quality, and Cycle Time by defining and designing data architecture and collaborating with key partners.

Responsibilities

• Yield Enhancement (YE) lots analysisLead YE lot analysis including reconstructing fuse identififaction (FID) for traceability, statistic comparison for different group
  
• Yield modelling / pareto benchmarkingIdentify actionable opportunities from YE lots
  Develop and improve Yield Models for HBM
  Periodically improve models based on actual performance
  
• Best Known Methods (BKM) DeploymentDevelop BKM’s for YE and drive implementation
  Identify/align BKMs and monitor implementation
  Works with different teams in the identification of critical metrics

Requirements:

• PhD/Masters/Bachelors in Statistics, Mathematics, or a related field; advanced degree preferred.
• Minimum of 3 years of experience in semiconductor manufacturing or related fields
• Preferably with experienced in Package Design Engineering and Yield Enhancement
• Strong understanding and knowledge of semiconductor manufacturing processes and technologies.
• Proficiency in statistical/machine learning and statistical techniques skills will be additional advantageous;
• Experience in MRDA will be a plus
• Proven ability to make decisions, multi-task, and solve problems and address root causes.
• Exhibit critical thinking to see opportunities.
• Effective communication skills in verbal/written.
• Self-motivated. Able to work independently with minimal supervision.
• Able to travel as required to support department and company objectives.

Job Responsibilities:

• Schematic capture, optimization and simulation.
• Develop efficient circuit designs and digital STD cell library meeting performance, power and area target.
• Study and invent new digital STD cell circuit architecture.
• Work with a layout designer to implement the layout of circuit.

Requirements:

• Bachelor's degree or above in Electronics, Computer Science, or related fields.
• Experience on high performance and low-power analog design.
• Experience on deep sub-micron process technology (12nm and below) taped outs.
• Excellent interpersonal and communication skills.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

ROLE:

A*Star-IME is currently working on establishing a hybrid fabrication platform for 150mm and 200mm Silicon Carbide (SiC) power MOSFETs as a new pillar on Singapore"s Future of Microlectronics in wide-bandgap. The main objective of this SiC RnD program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, specifically focusing on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this role to be successful include the development and integration of several process modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, and ohmic contact formation. We are actively looking for individuals with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• Lead develop process technology for SiC power MOSFETs and ensure it meets the requirements for prototyping manufacturing

• Collaborate with advanced process module development team to establish a process flow for fabricating specific MOS devices

• Responsible to develop and improve test structures that enable fast and rigorous characterization of process

• Accountable to improve device performance and yield through the design, execution, and analysis of experiments for each specific device and product

• Work with cross-functional teams to minimize defects and address technical and yield concerns

• Drive CIP (Continuous improvement plans) to deliver integrated process modules and specific device per project goals

• Make decisions regarding the delivery of process, active and passive devices to multiple customers

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device physics

• Proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and the physics of MOSFET devices

• Strong communication skills to effectively communicate information about module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data, coupled with strong presentation abilities

Job Description:

• Developing and optimizing thin film processes, such as Physical Vapour Deposition (PVD) and e-Beam Evaporation for Micro-Electro-Mechanical-Systems (MEMS), Wide-Band-Gap (WBG) and Photonics applications.
• Thin film property characterization and process issue troubleshooting.
• Develop film defect reduction and yield improvement strategies.
• Act as a subject matter expert and resource for colleagues in integration teams.
• Work with Fab team in establishing statistical process control for thin film module.
• Generate and present reports to both internal and external customers.

Job Requirements:

• Bachelors/Masters in Materials Science and Engineering, Physics, Electrical Engineering, or closely related fields are welcome to apply.
• 3+ years direct industry experience in PVD and evaporation is preferred.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Understanding of thin film tool hardware, especially PVD and evaporation, is advantageous.
• Knowledge and prior hands-on experience on basic process characterization techniques such as SEM/TEM, EDX, SIMS, FTIR, XPS, ellipsometry is advantageous.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.

Job Description:

• Developing and optimizing thin film processes, such as Physical Vapour Deposition (PVD) and e-Beam Evaporation for Micro-Electro-Mechanical-Systems (MEMS), Wide-Band-Gap (WBG) and Photonics applications.
• Thin film property characterization and process issue troubleshooting.
• Develop film defect reduction and yield improvement strategies.
• Act as a subject matter expert and resource for colleagues in integration teams.
• Work with Fab team in establishing statistical process control for thin film module.
• Generate and present reports to both internal and external customers.

Job Requirements:

• Bachelors/Masters in Materials Science and Engineering, Physics, Electrical Engineering, or closely related fields are welcome to apply.
• 3+ years direct industry experience in PVD and evaporation is preferred.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Understanding of thin film tool hardware, especially PVD and evaporation, is advantageous.
• Knowledge and prior hands-on experience on basic process characterization techniques such as SEM/TEM, EDX, SIMS, FTIR, XPS, ellipsometry is advantageous.
• Good understanding of thin film deposition techniques, defect reduction methodologies, yield improvement and thin film property characterization is desired.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.

As the Research Engineer (Equipment/Operations), you are directly involved in tool installation activities for semiconductor process tools. You would need to work proactively to coordinate with the contractor on the ground for the execution and take corrective and preventive actions of lessons learned, due diligently to prevent reoccurrence. You are responsible for performing utilities turn-on after installation is completed. You must perform the activities per ASTAR site procedure and safety policies to ensure all tool-install-related activities are completed, meeting safety, quality, schedule and budget requirements. You will also be required to perform other activities such as operations for the different semiconductor modules (Diffusion, Litho, Dry/Wet Etch, Thin Film, Implant, etc).

Responsibilities:

• Coordinate with all tool-install base contractors to execute equipment hookup for new tools, to meet the high-quality standards, dynamic schedule, and forecasted budget.
• Coordinate with the Project owner (NGTC/APM) to facilitate utility release as per the planned schedule and update tool release status timely
• Follow all safety and environmental procedures to ensure compliance with EHS-related regulations, risk assessment, safe work procedures, and permit-to-work system.
• Play an active role in safety, actively participating in safety discussions and safe work practices.
• Establish regular area walks to identify opportunities for improved safety, cleanliness, housekeeping and efficiency
• Establish regular, working interaction with peers as well as vendors in tool installation & facilitation, communicating clearly and respectfully all relevant information.
• Keep the reporting officer informed regarding the progress of assigned work and any abnormalities observed in your area.
• Demonstrate ability to understand drawing and highlighting discrepancies
• Follow area-specific procedures and documentation
• Prioritize work tasks to meet schedule and expectations, minimum guidance
• Perform tool tool-relativities and cleanroom systems troubleshooting during the hookup phase
• To perform equipment trouble-shooting of the equipments in NGTC when the need arises
• To perform utility-on after installation completion and to work closely with LCAM for complete closure
• To perform tests balancing of exhaust for new tools whenever necessary
• To perform measures for tool consumption during the hookup phase and to work closely with LCAM
• Use methods to organize, calculate, and display data accurately for utility and flowrate measurement
• Perform site activities in accordance to the Discipline

Requirements:

• Degree/Diploma in Mechanical/Electrical/Chemical engineering or equivalent
• Semiconductor experience (Equipment & Process)
• Facilities field or Wafer Fab Manufacturing equipment background will be an advantage.
• AutoCAD

Job Description

1. Perform research in the following areas:

a. Global performance analysis, and/or

b. Global structural response analysis

2. Assist in conducting physical model tests, field experiments and numerical simulations to support the development of integrated physical-numerical modelling and simulations.

3. Collaborate with industry partners, affiliated research institutes and other relevant stakeholders to contribute to grant proposals for research funding consistent with the strategic goals of TCOMS.

4. Any other duties as assigned by supervisor.

Job Requirements

· Bachelor's/Master's Degree in Civil Engineering, Mechanical Engineering, Marine Engineering, Naval Architecture, Applied Mathematics or other related disciplines.

· Preferably having relevant research/industry experience with competent knowledge in some of the following areas: Offshore engineering, marine engineering, hydrodynamics, naval architecture and ocean engineering.

· At least 5 years of experience

· Prior knowledge in the following numerical methods/software/programming languages will be an advantage:

o CAD software such as SolidWorks, Rhino, AutoCAD

o Engineering tools such as WAMIT, SESAM and OrcaFlex

o Finite Element analysis tools such as SESAM, ABAQUS, Ansys

o Programming codes such as FORTRAN, Python, MATLAB, C++ or equivalent.

· Good interpersonal and communications skills.

· Ability to adapt and work effectively as members of a team.

· Good command of written and spoken language.

· Resourceful and self-driven with a high degree of professional integrity.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Responsibility:

1. Collect and summarize product demand, participate in product demand assessment and optimization;
2. Competitor information collection& analysis;
3. Planning product promotion according to R&D and marketing research;
4. Provide customer support and product solutions training;
5. Participate in important project product selection, solution providing, bidding scheme and implementation plan evaluation;

Requirement:

1. Bachelor degree or above, major in computer, communications, electronics or related
2. More than 5 years working experience in security industry, 1 year experience in product or pre-sale
3. Good communication ability, can work under pressure

Unified Communications (UC) Engineer/Analyst

Job Description:

• Primary handling voice incidents escalations
• Configuring and troubleshooting of CUCM, CME, Cisco Unity Connection, Cisco Unified CCX, Cisco IP Phones, Cisco IP Communicator, Cisco Jabber, Cisco Voice Gateways (SIP, H323, MGCP)
• Configuring Cisco IP Phones, Expansion Modules, Extension Mobility Profiles, Voicemail, Cisco Jabber, Cisco IP Communicator.
• Upgrading IP Phone firmware in CUCM and CME to fix vulnerabilities.
• Monitoring alerts, collecting traces and debugs for voice incidents involving call flow issues.
• Remediating all endpoints, gateways and servers and making sure all are 100% compliant.
• Engaging Cisco TAC and working along with them to resolve complex incidents.

Job Requirements:

• Degree / Diploma in computer or Electronics Engineering
• CCNP Cisco Collaboration certification
• Minimum of 14+ years of related IP telephony / Unified Collaboration /Telepresence implementation or Administration experience including some of the following:

-Knowledge with TELISCA Call Recording troubleshooting

-Setup & maintenance of Cisco Collaboration and meeting products such as CUCM, CUC, IMP, CMS, TMS.

-Capable to install, integrate, maintain, modify, improve, enhance and upgrade the hardware and software of the Cisco Collaboration products

-Experience in administration of Cisco UC servers in Cisco UCS platform

-Experience in setup & troubleshooting of H323, SIP Trunks, SCCP, MGCP Voice Gateways, etc

-Experience in Cisco IP Phones

-Experience in integration with AD, DNS, LDAP etc…

-Experience in Single Sign-On (SSO) setup and troubleshooting.

-Knowledge in Routing, Switching and Security

-Knowledge in Server, Local and Group Policy, User management, Services, etc

It would be appreciated if you can share with me your interest on the same.

Have a friend or family member who may be interested in taking the next step in their career? Help them out by referring them to Ennovatez.

You can email your resume to us at [email protected]

About NSING:

As part of Nations Technologies Group, NSING was founded in 2018 in Singapore bringing high-performance semiconductor products and solutions to global semiconductor industry. Our products includes General and Secure MCU, Secure IC for TPM (Trusted Platform Module), Bluetooth Low Energy BLE and BMS (Battery Management System). When you join NSING, you will be part of a talented team in the Singapore R&D Center where we develop high performance MCU targeting for Industrial and Edge AI applications.

Your Role:

As a SoC Design Verification Engineer, you will be you would be part of a passionate team developing and deploying state-of-the-art verification methodologies in ever-increasing design complexities, from UVM, C co-simulation, to mixed-signal simulation and formal verification. You will be part of the Singapore team in developing high performance MCU chips.

• Develop detailed verification plans based on design specifications and architectural requirements.
• Create and maintain test benches for complex digital designs using System Verilog and UVM (Universal Verification Methodology).
• Write, debug, and execute test cases to verify functionality, performance, and power consumption of our SoC products.
• Collaborate with design engineers to identify, analyze, and resolve design issues.
• Conduct coverage analysis and drive verification closure to ensure all functional requirements are met.
• Mentor junior verification engineers, providing technical guidance and support.
• Continuously improve verification processes and methodologies to enhance efficiency and effectiveness.
• Participate in design and verification reviews, providing constructive feedback and recommendations.
• Stay updated with the latest industry trends and advancements in verification techniques and tools.

Your Skills and Experiences:

• Education：Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
• Experience: 5 years+ prior industry experience of design verification including significant System Verilog and UVM usage.
• Technical skills:

-Deep knowledge of digital logic design, SOC architecture and microarchitecture

- Proficient in simulation-based verification methodologies and languages such as UVM and System Verilog

- Skilled in developing and maintaining test benches, test cases, and verification environments

- Experience across the full verification cycle from initial planning to final tape out

• Preferred skills:

- Knowledge of low-power design techniques and verification methodologies.

- Knowledge of hardware-software co-simulation mixed-signal verification techniques.

- Knowledge of gate level simulation methodologies.

Other Skills:

• Strong analytical and problem-solving skills, with a keen attention to detail.
• Excellent communication and teamwork skills, with the ability to collaborate effectively in a cross-functional environment.
• Flexibility and adaptability and demonstrates ability to manage multiple tasks and projects, prioritizing effectively to meet deadlines.

JOB DESCRIPTION

We are looking for highly-motivated and skilled programmers to join us in Biomed DAR (BII A*Star), to work on a new initiative in the development and deployment of software tools for data management support systems/biomedical data repository. Our work supports BMRC-wide research programmes and industry collaborations.

Successful candidates will work with a team of data scientists, data engineers and UI designers to program a web-application stack for automated data integrity checks, data curation, data annotation, and data imputation for structured data generated by research programmes. Successful candidates will have the opportunity to tap into a large pool of biomedical data from different disciplines and to interact with the companies/researchers to understand their real data needs.

JOB REQUIREMENT

· Minimum bachelor’s degree or diploma in the field of computer science, computer engineering, or other web programming intensive course. With expertise in at least one of the following areas: creating, maintaining, implementing APIs, front-end development, microservices architecture

· Possess minimum 2 - 3 years or more of relevant work experience.

· Ability to work independently to translate design templates and ideas into programs with efficient coding.

· Basic knowledge in data analytics and proficient in Python, Node.js, React, SQL

· Prior industry experience with engineering, financial services, healthcare is a plus.

· Able to deliver under tight schedule.

· Good team player with understanding of best practices and cybersecurity.

· Good interpersonal and communication skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

JOB DESCRIPTION

We are looking for highly-motivated and skilled programmers to join us in Biomed DAR (BII A*Star), to work on a new initiative in the development and deployment of software tools for data management support systems/biomedical data repository. Our work supports BMRC-wide research programmes and industry collaborations.

Successful candidates will work with a team of data scientists, data engineers and UI designers to program a web-application stack for automated data integrity checks, data curation, data annotation, and data imputation for structured data generated by research programmes. Successful candidates will have the opportunity to tap into a large pool of biomedical data from different disciplines and to interact with the companies/researchers to understand their real data needs.

JOB REQUIREMENT

· Minimum bachelor’s degree or diploma in the field of computer science, computer engineering, or other web programming intensive course. With expertise in at least one of the following areas: creating, maintaining, implementing APIs, front-end development, microservices architecture

· Possess minimum 5 years or more of relevant work experience.

· Ability to work independently to translate design templates and ideas into programs with efficient coding.

· Basic knowledge in data analytics and proficient in Python, Node.js, React, SQL

· Prior industry experience with engineering, financial services, healthcare is a plus.

· Able to deliver under tight schedule.

· Good team player with understanding of best practices and cybersecurity.

· Good interpersonal and communication skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

What you will do

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek:

• Scan chain insertion & ATPG pattern generation
• Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.)
• Diagnosis to help manufacture process improvement

2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC:

• PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation
• Develop & integrate DFT-related RTL design modules to test chip

What you will bring

1. Master's Degree in EEE/ EE/ CE
2. Expertise in Synopsys and/or Mentor DFT tools, and HDL simulators like Synopsys VCS
3. Fluency in script language including but not limited to TCL/Perl/Python
4. Experience about MBIST with state-of-the-art SRAM structure & EDA tools is big plus
5. Skill for RTL design & integration, and physical failure analysis(PFA) will also be plus
6. Ability to think and work independently with different teams
7. Interest in understanding more details in entire design flow
8. Ability to use English for discussing technical details
9. More than 4-year industrial work experience is preferred

Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

Job Description

The job holders are to work with PI and the research team to process air quality data and study small-scale dispersion of airborne pollutants in urban environment.

Qualifications

One or more of (but not limited to) the following:

• Bachelor Degree in Engineering or relevant field
• Experiences of (small-scale) simulations of air pollutant dispersion, meteorology modelling, data processing
• Demonstrating as a fast learner of conducting literature study and literature summary
• Experiences of handling big data via R, Python, Matlab, etc.
• Experience with UNIX-based operating systems and bash script or similar
• Strong interests in applying machine learning models and applications to atmospheric research
• Proactive in assisting and contributing to quality scientific research publications
• Proficient in technical presentation, slide making, report writing, etc.
• Proven rounded and effective team player with strong initiative and ownership of the research project

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.