Staff Flipchip Engineer, BGA
Job Responsibilities:
- Support process and efficiency improvement activities
- Responsible to source new material for internal R&D activities
- Align with factories on product improvement and enhancement
- Initiate new product prototype with new innovative process, material and methodology
- Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Flipchip or Leadframe, Laminates, etc.;
- Contribute to developing advanced power module processes, output process files;
- Support product development team to transfer advanced packaging processes to HQ;
- Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
- Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process
Qualifications:
- Minimum of 5 years working experience in the same leadership capacity with similar semiconductor manufacturing
- Preferably with experience in bringing a product from R&D to low volume manufacturing
- Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
- A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
- Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
- Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines
Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.
