- Responsible the package design integration activities by working with cross-functional team and partners for package technology development, including material development, process development, DOEs, and related activities.
- Work with a cross-functional team across several geographies to create package design databases such as package stack-up, wire-bond fanout, route-study, substrate layout, wire bond/Die placement diagrams, and other design documentation.
- Work with Business Unit Package Design Lead and cross-functional team to establish a Packaging Roadmap.
- Contribute to package design rules and system development.
- Participate in packaging IP development activates and industry benchmarking.
- Work with Substrate and PCB (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements with packaging solutions.
Requirements:
- Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 7 years of experience in semiconductor packaging industry.
- Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures and die stack-up.
- Excellent communication skills, both oral and written in English.
- Excellent problem solving and analytic skills.
- Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
- Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
- Ability to work independently, prioritize and manage numerous projects with minimum supervision.
- A global perspective and the ability to work in a multicultural environment.
