Job Description
- As part of the CNC Machinist group, this position involves development of new manufacturing processes and lean manufacturing practices.
- The role also involves Design tools and fixtures with Autocad and CNC Programming
- To Operate of high Vacuum and Sinter HIP furnace, CNC, Dicing Saw and Precision Waterjet. Support the training of staff and line operators on manufacturing processes.
- Inspection with wide variety of measuring devices, gages, optical equipment as well as develop quality procedures to ensure robust processes.
- Perform preventive maintenance of machines and ensure Work Health and Safety in all processes
Roles & Responsibilities
- Support processes to deposit conductive (metal) films by Plating, PVD Sputtering and Vacuum Evaporation.
- Support film characterization techniques for metrology and inspection
- Perform day-to-day operations of deposition tools - tool and process monitoring,post PM process qualification, troubleshooting
- Work closely with integration and test teams on developing critical to quality (CTQ) metrics, root cause analysis (RCA) and corrective actions for yield improvements
Requirements
- Min. ITE-NTEC/Diploma/Degree level PE/ME/Mfg/Mechatronics or related displicine.
- Min. 2 years of experience leading manufacturing processes in at least one of the following fields: semiconductor front or back end such as wafer bumping, dicing, mask design, plating and thin film process development.
- Good analytical, verbal, written and interpersonal skills
- Hands on fabrication: mechanical assembly, mechanical design and manufacturing and mask design.
- Experience working around delicate high-tech equipment.
- Experience in statistical analysis methods and tools, design of experiment
- Understanding of materials characterization and FA techniques
- Good communication and teamwork skills.
Benefits
- Company transport will be provided at mrt.
- Transport allowance will be given.
- Additional company holidays shutdown per year will be given.
- Other staff welfare benefits.
