Introduction
We are looking for Equipment Engineer with experience in Advanced Packaging, in this role you will provide technical leadership to startup of next generation of Fanout packaging equipment, optimize equipment capability, quality, and utilization through CIP to meet company's goals.
Responsibilities
- Have an in-depth understanding of how Photo lithography Stepper and Coat & Dev process equipment working principle and how critical parameters will impact Photo process and to work together with process counterpart to resolve complex integration issues.
- Manage and plan new equipment start-up to support production
- Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality, cost, and productivity.
- Liaise with vendors to resolve equipment issues and improve equipment performance
- Identify and assess any safety and product risks, recommends risk eliminations, and control risk through mitigations and safe work procedures.
- Work on continuous improvement projects to improve equipment efficiency and address issues
- Setup tracking system to monitor expenditures
- Provide feedback, guidance and training to AEs
- Familiar and follow up on SPSR, MRB, 8D, TECN, ECN ISO9001/QS9000/TQM documentation for closure of issues / setup system.
- Familiar and update specifications to meet company Quality Standard requirements
- Familiar with SPC, DOE, FDC, ECMS and all the statistical analysis tools to help optimizing equipment robustness.
- Establish and maintain essential spare parts stock inventory
Requirements
- Minimum Bachelor's Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
- Minimum 3 years of relevant experience in equipment engineering, preferably in a semiconductor/LCD/Electronics/Electrical industry
- Hands-on experience in equipment maintenance or troubleshooting.
- Self-driven leader and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem-solving skills, and positive attitude.
- Candidates with no prior experience will be considered for junior position
- Proven ability to identify, assess and solve problems
Preferred Qualifications
- Prior experience in Advanced Packaging/LCD/foundry or similar industry background with ASML/NIKON/RUDOLPH/TEL/SUSS/ experience will be an added advantage
- Strong analytical with good interpersonal skills and Integrity
- Ability to work under pressure & in a Dynamic Environment
