Job Description:
- Develop, optimize, and maintain wet or plating processes, including cleaning, etching, and electroplating.
- Ensure robust, repeatable wet or plating processes that meet quality and reliability standards in collaboration with cross-functional teams.
- Integrate wet or plating techniques into the overall manufacturing workflow.
- Support New Product Introduction (NPI) by validating wet or plating processes for new products.
- Oversee setup, operation, and maintenance of wet or plating process equipment, including chemical baths, etchers, and plating tools.
- Work with vendors to troubleshoot issues, implement upgrades, and drive continuous improvement in wet or plating equipment performance.
- Monitor key process parameters to ensure consistent product quality and utilize SPC for process control and improvement.
- Lead root cause analysis and corrective actions for issues related to wet or plating processes.
- Provide technical support to production teams to resolve process deviations and improve yield.
- Maintain process documentation and present findings to senior management.
Qualifications:
- Bachelor’s Degree in Chemical Engineering, Materials Science, Electrical Engineering, or related field; advanced degrees are a plus.
- 3-5 years of semiconductor manufacturing experience focused on wet or plating processes.
- Hands-on experience with wet or plating process equipment in a high-volume environment.
- In-depth knowledge of wet or plating processing, including safety protocols.
- Strong problem-solving skills with expertise in SPC and DOE methodologies.
If you are interested in the position, please include your availability, expected salary and reason for leaving current jobWe regret that only shortlisted candidates will be contacted
EA: 94C3609 / Reg: R1325913