Job Responsibilities:
- Design and develop modules for high-speed Flip Chip Bonder.
- To be able to design and develop Bond heads and/or Wafer Modules with high-speed ejection system and/or High-Speed Pick and Place modules.
- Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
- Planning, Scheduling and Costing of Machines and Mechanical Modules
- Working closely with Electrical, Vision and Software Engineers.
- Work extended hours in critical phases of project execution.
- Travel for Machine Installations and Buy Off
Job Requirements:
- Diploma or Degree in Mechanical Engineering or related technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines. Especially Flip Chip or Die Attach. Experience on SMT machines is a plus.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines is a must.
- Strong fundamentals in mechanical concepts and problem-solving skills, including knowledge in stack tolerance.
- Knowledge of high-speed Valves and High-Speed Electronics is a definite plus
- Proficiency with Creo is a definite advantage.
- Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage.
- Self-motivated individual who is action/results oriented, independent, and flexible, with a passion for developing technical excellence products.
- Willingness to get hands-on during development cycle.
- Excellent communication skills, with cross-cultural awareness and understanding.
- Able to work under tight schedules.
