Job Description
- Perform mechanical & thermal analysis and characterization of advanced IC packages
- Build up new mechanical & thermal capabilities with latest simulation and characterization technologies
- Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
- Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
- Conduct IC packaging technology development together with other teams
- Carry out mechanical, thermal and reliability test and correlate with mechanical & thermal simulation for validation
Requirements
- Degree / Master in Mechanical Engineering or related field
- Solid knowledge on FEM & mechanics of material
- Mechanical modeling experience for IC package’s stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must
- Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
- Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
- Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable
- Team player with good interpersonal and communication skills
- Keen for R&D activities in IC packaging technology development, package’s mechanical & thermal analysis/ design/ optimization/ characterization
