Job Responsibilities
- Advanced process development tasks SEM CD, OCD or other metrology techniques in 3D NAND technology.
- Identify and provide solutions for inline detection in collaboration with process engineer and process integration.
- Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe
- Collaborate with US TD Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements.
- Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.
- Influence vendor equipment roadmap to enable new technology development in Micron
Requirements:
- Masters/PhD in Engineering would be advantageous
- Experience with semiconductor inspection equipment is preferred.
- Data Science and Data Manipulation skills: Ready to learn and apply basic scripting, coding, or programming.
- Preference for metrology or inspection experience: Especially related to data analysis and root cause investigation.
- Capable of international travel up to 3-5 months
- Good communication skills (verbal and written)
