Total 8 job vacancies by Rich Star International Pte. Ltd.

Salary negotiable if candidate with excellent conditions

Work location in China

Job Responsibilities

1. Responsible for the development of thin film technology, formulate development plans and implement them.

2. Responsible for the stability of thin film technology and CPK improvement;

3. Troubleshooting of abnormal conditions of thin film process equipment and uptime improvement.

Qualifications

1. Master degree or above, major in microelectronics, physics, chemistry, materials, electrical engineering and other science and engineering related majors, with relevant knowledge reserves of semiconductor physics and device physics, integrated circuit manufacturing, etc.

2. More than 5 years of thin film process R&D and mass production experience in 12-inch integrated circuit foundry, familiar with the basic knowledge of semiconductor manufacturing and thin film related processes.

3. Familiar with the industry's mainstream thin film equipment and its performance (various types of CVD\PVD\ALD, etc.), deeply understand the correlation between equipment parameters and processes, and successfully complete at least one new product and new process R&D.

4. Have strong ability to discover and solve problems, and have the hands-on ability to actively solve process and equipment problems at work.

5. Good conduct, rigorous work, good organization, communication and coordination skills, strong pressure resistance, strong professionalism and sense of responsibility.

Salary negotiable if candidate with excellent conditions

Work location in China

Job Responsibilities

1. Responsible for the development of advanced node wet process, formulate development plan and implement it.

2. Responsible for the stability of wet process and CPK improvement.

3. Troubleshooting of abnormal conditions of wet process equipment and uptime improvement.

Qualifications

1. Master degree or above, major in microelectronics, physics, chemistry, materials, electrical engineering and other science and engineering related majors, with relevant knowledge reserves of semiconductor physics, device physics, integrated circuit manufacturing, etc.

2. More than 5 years of wet process R&D and mass production experience in 12-inch integrated circuit foundry, familiar with the basic knowledge of semiconductor manufacturing and wet process related processes.

3. Familiar with the mainstream single-wafer/tank cleaning and electroplating equipment in the industry and their performance, deeply understand the correlation between equipment parameters and processes, and successfully complete at least one new product and new process R&D.

4. Have strong ability to discover and solve problems, and have the hands-on ability to actively solve process and equipment problems at work.

5. Good conduct, rigorous work, good organization, communication and coordination skills, strong pressure resistance, strong professionalism and sense of responsibility.

Candidates with excellent qualifications can negotiate salary

Work location in China

Job Responsibilities

1. Responsible for the development of advanced node implant/diffusion process, formulate development plan and implement it.

2. Responsible for the stability of implant/diffusion process and CPK improvement.

3. Troubleshooting of abnormal conditions of implant/diffusion equipment and uptime improvement.

Qualifications

1. Master degree or above, major in microelectronics, physics, chemistry, materials, electrical engineering and other science and engineering related majors, with relevant knowledge reserves of semiconductor physics and device physics, integrated circuit manufacturing, etc.

2. More than 5 years of experience in implant/diffusion process R&D and mass production in 12-inch integrated circuit foundry, familiar with the basic knowledge of semiconductor manufacturing and implant/diffusion related processes.

3. Familiar with the mainstream implantation, diffusion, annealing equipment and their performance in the industry, have a deep understanding of the correlation between equipment parameters and processes, and have successfully completed the development of at least one new product and new process.

4. Have strong ability to discover and solve problems, and have the hands-on ability to actively solve process and equipment problems at work.

5. Good conduct, rigorous work, good organization, communication and coordination skills, strong pressure resistance, strong professionalism and sense of responsibility.

Work location in China

Job Responsibilities

1. Responsible for optical film new technology research and development;

2. Responsible for optical film (device) design and process development;

3. Capable of carrying out scientific research independently.

Qualifications

1. With Master's degree or above, major in optics, physics, materials science, optical engineering or other relevant academic background.

2. Experience in optical film technology research, laser film device or X-ray multilayer film device research is preferred.

3. Good conduct, rigorous working attitute, good organization, communication and coordination skills, strong professionalism and sense of responsibility.

Salary negotiable if candidate with excellent conditions

Work location in China

Job Responsibilities

1. Responsible for the development of advanced node dry etching process, formulate development plan and implement it.

2. Responsible for the stability of dry etching process and CPK improvement.

3. Troubleshooting of abnormal conditions of dry etching process equipment and uptime improvement.

Qualifications

1. Master degree or above, major in microelectronics, physics, chemistry, materials, electrical engineering and other science and engineering related majors, with relevant knowledge reserves of semiconductor physics, device physics, integrated circuit manufacturing, etc.

2. More than 5 years of dry etching process R&D and mass production experience in 12-inch integrated circuit foundry, familiar with the basic knowledge of semiconductor manufacturing and etching related processes.

3. Familiar with the mainstream ICP/CCP/RIE equipment and its performance in the industry, deeply understand the correlation between equipment parameters and processes, and successfully complete the development of at least one new product and new process.

4. Have strong ability to discover and solve problems, and have the hands-on ability to actively solve process and equipment problems at work.

5. Good conduct, rigorous work, good organization, communication and coordination skills, strong pressure resistance, strong professionalism and sense of responsibility.

Salary negotiable if candidate with excellent conditions

Work location in China

Job Responsibilities

1.Responsible for the overall architecture and design of precision optical equipment.

2.Decompose performance requirements and specifications at various levels, propose optimized balanced system solutions, and specify subsystem performance requirements.

3.Design and optimize the overall workflow of the equipment based on functional requirements and hardware configuration.

4.Assist the team in the preparation of comprehensive R&D documentation.

Qualifications

1.Degree in opto-mechanical engineering or related field, master's degree or higher, with more than two years of work experience.

2.Familiar with the architecture of precision optical equipment in the semiconductor field.

3.Decompose performance requirements and specifications at various levels, propose optimized balanced system solutions, and specify subsystem performance requirements.

4.Ethical and meticulous in work, with good organizational, communication, and coordination skills, and a strong sense of commitment and responsibility.

Salary can be negotiated for talents who meet the requirements

Work location in China

Job Responsibilities

1. Establish advanced node process flow, preparation of documents and data for each stage of process certification, design process experiments, track process progress and verification.

2. Be responsible for coordinating the treatment of process problems in each process, optimizing technology and control.

3. Continuously improve process parameters, be responsible for monitoring and analyzing process stability, and improve process stability.

Qualifications

1. Master degree or above, major in microelectronics, physics, chemistry, materials, electrical engineering and other science and engineering related majors, with relevant knowledge of semiconductor physics and device physics, microelectronic devices, integrated circuit manufacturing, etc.

2. More than 5 years of advanced process TD PIE experience in foundry with 12-inch wafer.

3. As a senior TD PIE, have led and completed more than one advanced process research and development.

4. Familiar with advanced integrated circuit manufacturing equipment and processes, familiar with the entire advanced process flow, and have a deep understanding of the single process of advanced process (litho, etch, thin film, diffusion, wet, etc.) and process integration.

5. Have strong ability to discover and solve problems, and have the hands-on ability to actively solve process and equipment problems.

6. Good conduct, rigorous work, good organization, communication and coordination skills, strong pressure resistance, strong professionalism and sense of responsibility.

Salary negotiable if candidate with excellent conditions

Work location in China

Job Responsibilities

1. Responsible for the development of CMP process for advanced nodes, formulate development plans and implement them.

2. Responsible for the stability of CMP process and CPK improvement.

3. Troubleshooting of abnormal conditions of CMP process equipment and uptime improvement .

Qualifications

1. Master degree or above, major in microelectronics, physics, chemistry, materials, electrical engineering and other science and engineering related majors, with relevant knowledge reserves of semiconductor physics, device physics, integrated circuit manufacturing, etc.

2. More than 5 years of CMP process R&D and mass production experience in 12-inch integrated circuit foundry, familiar with the basic knowledge of semiconductor manufacturing and CMP related processes.

3. Familiar with the mainstream CMP equipment and its performance in the industry, deeply understand the correlation between equipment parameters and processes, and successfully complete the development of at least one new product and new process.

4. Have strong ability to discover and solve problems, and have the hands-on ability to actively solve process and equipment problems at work.

5. Good conduct, rigorous work, good organization, communication and coordination skills, strong pressure resistance, strong professionalism and sense of responsibility.