Total 29 sales advisor job vacancies in Singapore

• Create ATE (Advantest SmarTest PS1600 & EXA Scale) test program and integrate various test functions in test flow to support First Silicon bring up for wafer and package in NPI phase.
• Perform design validation/characterization/experiment on ATE across process, voltage, frequency and temperature. Evaluate test and product margins, debug and communicate result/yield/analysis to various teams.
• Utilize ATE test tools and other test instrument to debug and analyze the test, design and product issue.
• Support ATE test hardware design (Including build instruction, SI/PI...etc.) and debug.
• Support test time reduction.
• Support proto demands/qualification for IP owner and customer requests.
• Complete test development, test program transfer and product release at respective milestones.
• Initiate, plan and execute multiple projects to achieve target.
• Good knowledge of product engineering, failure analysis and manufacturing test process.
• Interest in learning, researching, sharing and implementing new technology and test methodology.
• Good written/Oral communication skills.
• Result orientated and team work.

We have an exciting position in the explosive growth area of Data Center Enterprise Storage. In this role you will be responsible for
developing the most advanced semiconductor devices to support stringent high capacity storage needs across all the top tier service
providers. Our IC R&D team is looking for an experienced physical design engineer to develop high speed custom analog/mixed signal
products for the storage industry. A qualified applicant would work closely with circuit design engineers to lay out high-speed custom analog
designs and develop mask layouts for customer products, as well as printed circuit board designs. You will join a cross-functional team
responsible for developing leading edge high-speed custom IC products that ultimately achieve high volume production.

Job Responsibilities
- Lay out high speed, high performance analog/mixed-signal custom integrated circuits
- Work directly with a team of engineers to determine floor plan, routing and I/O requirements
- Perform IC design rule and connectivity verification and drive products through mask release flows.
- Contribute to methodology improvements to increase layout and verification efficiency.
- Create reticle layouts, documentation, and PO’s to release products for mask build.
- Complete PCB layouts for test hardware.

Requirements/Qualifications should be:
- Bachelor's degree in Electrical Engineering (or related field)
- 5 years experience in custom analog IC physical design
- Experience with schematic-driven layout, floor planning, chip level routing, design for manufacturing and design rule and connectivity
verification is preferred
- Experience using Cadence Virtuoso XL preferred
- Experience with Cadence Allegro for PCB layout preferred
- Familiarity with both analog and digital layout tools and flows, circuit design concepts and IC manufacturing processes desired
- Strong communication skills
- Understanding of silicon process technologies (CMOS and Bipolar) and device physics would be a plus.
- Proven analytical skills (application of math and physics to solve problems)
- Must be meticulous and demonstrate attention to detail.

• You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
• You will work closely with package design & technology, test & product engg, production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes.
• Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams.
• Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction.

Qualifications:

• PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes.
• Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc.
• Good team player, result oriented individual, experienced in project management, failure analysis tools, techniques and TQM. Good analytical, problem-solving skills. Flexible and agile.
• Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment.
• Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice.
• Experienced AutoCAD user. Knowledge of silicon & PCB fabrication, board assembly processes, are an added advantage

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS in Electrical or Computer Engineering and > 5 years of related experience

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

• Requires a BS in Electrical or Computer Engineering
• Some years of relevant experience is preferable
• Fresh graduates are encouraged to apply

Skills and responsibilities:

• Utilize commercial and in-house EDA tools (e.g. Synopsys, Cadence, Siemens) for the design and implementation of 100 ~ 400 million gate integrated circuits in 7nm/5nm/3nm/2nm process technologies.
• Proficient with a full Netlist/Gates to GDS flow, inclusive of all construction stages (e.g. RTL synthesis, placement, clock tree synthesis, detailed routing, physical verification, formal verification and timing analysis) for complex digital blocks of up to 12Mgates/3M instances with embedded macros. Ability to handle multiple block assignments in parallel is required.
• Proficiency in UNIX/Linux and scripting languages is advantageous.

Required Qualifications:

• Degree, Masters or PhD in Electrical/Electronics/Computer engineering.
• Minimum of 5 years or more experience in a relevant field.

• Develop ATE test program, test hardware and bench evaluation board for analog, digital and power semiconductor devices.
• Research new test methodology for better test coverage and test time reduction.
• Work with multi-functional team to meet new product release schedule
• Proficiency in C++ Programming
• Degree in Electrical/Electronics Engineering
• Fresh graduates with good academic result are welcome to apply.

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

• Requires a BS in Electrical or Computer Engineering
• Some years of relevant experience is preferable
• Fresh graduates are encouraged to apply

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS in Electrical or Computer Engineering and > 5 years of related experience

Be part of a worldwide R&D team in designing leading edge optocoupler products from Broadcom.

• Design analog and mixed signal ICs for industrial and automotive applications.
• Work with marketing and project team in defining specifications and system architecture to meet customer requirements.
• Perform circuit analysis, simulation and design verification with Cadence tools.
• Test and troubleshoot circuit problems to fix bugs.
• Customer support on IC failure analysis.
• Support reliability and manufacturing tests for product qualification.

Requirements

• Knowledge and experience in analog and mixed signal IC design.
• Familiarity with sigma delta converter, switched capacitor filter, bandgap reference, PLL/DLL, optical transceiver and power management design will be added
• advantages.
• Bachelors and 7+ years of related experience or Masters degree and 5+ years of related experience or PhD and 3+ years of related experience
• Master's or Bachelor's degree in electrical engineering

Skills and responsibilities:

• Utilize commercial and in-house EDA tools (e.g. Synopsys, Cadence, Siemens) for the design and implementation of 100 ~ 400 million gate integrated circuits in 7nm/5nm/3nm/2nm process technologies.
• Proficient with a full Netlist/Gates to GDS flow, inclusive of all construction stages (e.g. RTL synthesis, placement, clock tree synthesis, detailed routing, physical verification, formal verification and timing analysis) for complex digital blocks of up to 12Mgates/3M instances with embedded macros. Ability to handle multiple block assignments in parallel is required.
• Proficiency in UNIX/Linux and scripting languages is advantageous.

Required Qualifications:

• Degree, Masters or PhD in Electrical/Electronics/Computer engineering.
• Minimum of 2 years or more experience in a relevant field.

Minimum qualifications:

• Bachelor’s degree in electrical engineering, or an engineering field.
• 10 years of experience as a Semiconductor IC, Quality, Reliability or Product Engineer.
• Experience in a technical team and/or people management.
• Experience with quality control, test coverage, and IC qualification.

Preferred qualifications:

• Over 10 years of experience in quality/reliability and semiconductor IC technology.
• Experience with semiconductor suppliers and manufacturing and supply chain processes.
• Experience in troubleshooting on different failure mode and root cause analysis.
• Experience with IC qualification, data review, and production release.
• Technical expertise of materials and processes for semiconductor ICs.

Background:

• Good understanding of materials, physical failure analysis and measurement techniques.
• Familiar with ISO 9001 or other quality management standards
• Able to work in a diverse team, use proactive approach, self-reliant & excellent decision-making skills.
• Capable of supplier, customer, and stakeholder management.

Responsibilities:

• Quality and reliability expert with a track record of improving the quality of semiconductor ICs during New Product Introduction (NPI) as well as the product life-cycle.
• Establish and be responsible for the quality and reliability throughout the product/IC life cycle.
• Work with cross-functional teams to define and ensure processes in place to provide the data required to manage quality and reliability.
• Interface with suppliers on a regular basis to track and drive root cause, resolve issues, track return material authorizations, corrective actions (OCAPs), and failure analysis.
• Work with suppliers and SMEs to provide material waivers including assessment, documentation, and protocols.
• Drive supplier process audits, product audits, 8D reports and summarize results for Exec Management as well as Global Operations team.
• Technical support of Global operations team for continuous improvement initiatives, as well as qualification and application of ICs.
• Travel up to 25%.

The descriptions are for layout engineers for our Library Group. Library Group is a part of Central Engineering Group.

In Library Group, we focus on circuit design for memory, I/O (Input/Output), and Standard Cells.

Requirements:

• Strong layout knowledge with a minimum of 3 to 4 years of experience
• Skills include Cadence layout, Cadence schematic capture, using CALIBRE & Hercules verification tools.
• Strong layout knowledge in submicron process, e.g. 16nm, 7nm, 5nm, 3nm etc
• Experienced in digital (standard cell, memory, I/O) layout
• Experienced in analog layout is also a plus

Job Description:

• Responsible to understand and apply all necessary layout guidelines (standard cells, I/O memories), new process rules and other technical requirements for quality layout
• Schedule time-line & layout floor-planning
• Complete quality layout and verification within planned schedule (without supervision for experienced engineer)
• Get up to speed quickly for new methodologies, open to new ideas and communicate well with others in the library team

Skill Set (Mem):

• Strong experience in memory layout design and physical verifications includes LVS, DRC, ERC, Antenna, Electro Migration in CMOS process.
• Experienced in Cadence Layout tools VIRTUOSO (XL,VXL or EXL), and CALIBRE verification tools.
• Good experience in Floor-planning, hierarchy layout and chip integration.
• Knowledge of Script Programming and SKILL Programming would be a plus.
• Able to lead or train a team of junior engineers
• Good knowledge on memory layout topology.
• Experience in memory compiler will be a plus.
• Ability to lead on new technology reviews to compile documentation of layout methodology, layout flow and guidelines.
• Self-reliant, with ability to work independently as well as a team.
• Good leadership quality on project management.

The descriptions are for layout engineers for our Library Group. Library Group is a part of Central Engineering Group.

In Library Group, we focus on circuit design for memory, I/O (Input/Output), and Standard Cells.

Requirements:

• Strong layout knowledge with a minimum of 5 years of experience
• Skills include Cadence layout, Cadence schematic capture, using CALIBRE & Hercules verification tools.
• Strong layout knowledge in submicron process, e.g. 16nm, 7nm, 5nm, 3nm etc
• Experienced in digital (standard cell, memory, I/O) layout
• Experienced in analog layout is also a plus

Job Description:

• Responsible to understand and apply all necessary layout guidelines (standard cells, I/O memories), new process rules and other technical requirements for quality layout
• Schedule time-line & layout floor-planning
• Complete quality layout and verification within planned schedule (without supervision for experienced engineer)
• Get up to speed quickly for new methodologies, open to new ideas and communicate well with others in the library team

Skill Set (Mem):

• Strong experience in memory layout design and physical verifications includes LVS, DRC, ERC, Antenna, Electro Migration in CMOS process.
• Experienced in Cadence Layout tools VIRTUOSO (XL,VXL or EXL), and CALIBRE verification tools.
• Good experience in Floor-planning, hierarchy layout and chip integration.
• Knowledge of Script Programming and SKILL Programming would be a plus.
• Able to lead or train a team of junior engineers
• Good knowledge on memory layout topology.
• Experience in memory compiler will be a plus.
• Ability to lead on new technology reviews to compile documentation of layout methodology, layout flow and guidelines.
• Self-reliant, with ability to work independently as well as a team.
• Good leadership quality on project management.

• Create ATE (Advantest SmarTest PS1600) test program and integrate various test functions in test flow to support First Silicon bring up for wafer and package in NPI phase.
• Perform design validation/characterization/experiment on ATE across process, voltage, frequency and temperature. Evaluate test and product margins, debug and communicate result/yield/analysis to various teams.
• Utilize ATE test tools and other test instrument to debug and analyze the test, design and product issue.
• Support ATE test hardware design/debug and test time reduction.
• Support proto demands/qualification for IP owner and customer requests.
• Complete test development, test program transfer and product release at respective milestones.
• Initiate, plan and execute multiple projects to achieve target.

Requirements

• Bachelor or Master’s degree in Electronics, Electrical, Computer Engineering or relevant disciplines.
• Minimum 3 years of hands-on experience in ATE test program development i.e. Teradyne UP1600 or Advantest PS1600.
• Self-motivated. Able to plan, execute and deliver within given timeline.
• Strong team player with creativity, critical thinking, problem-solving ability and excellent communication skills.
• Good knowledge of product engineering, failure analysis and manufacturing test process.
• Interest in learning, researching, sharing and implementing new technology and test methodology.
• Good written/Oral communication skills.
• Result orientated and team work.

Job Description

Foundation IP Design Engineer

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS degree in Electrical or Computer Engineering

Foundation IP Design Engineer

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS degree in Electrical or Computer Engineering with 2 years of related experience

Foundation IP Design Engineer

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS in Electrical or Computer Engineering and 5 years of related experience

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

• Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
• Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, etc.
• Schedule, prioritize, & track your work across multiple projects simultaneously
• General flip-chip BGA package design & engineering

EDUCATION/EXPERIENCE & REQUIREMENTS:

• B.Eng (EE/EEE) or similar field and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
• M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
• Knowledge of package-level signal integrity and power integrity, to apply to package designs
• Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.
• Good organizational and task management skills to manage multiple package design projects.

PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:

• B.Eng (EE/EEE) or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.
• M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

- BS degree in Electrical or Computer Engineering

R&D engineer position available in design and physical implementation of high performance System-On-Chip ASICs.

• Key competencies required are: Working experience leading team in physical design implementation of large ASICs (100 to 400 million gates complexity).
• Demonstrated ability in providing technical support to customers and managing customer working relationship.
• Demonstrated strong technical hands-on competency in using leading edge physical design EDA tools in projects.
• In-depth CPU architecture/algorithm working knowledge and related physical design implementation knowledge highly advantageous.

Utilize commercial and in-house EDA tools for the design and implementation of 100 ~ 400 million gate integrated circuits in 7nm/5nm/3nm process technologies.

Opportunity to participate in innovation, design flow and methodology development to address challenges of designing into deep submicron processes and state-of-the-art ASIC design for computing and networking products

Qualifications / Requirements

• Degree, Masters or PhD in Electrical/Electronics/Computer engineering with 5 years or more experience in a relevant field.
• Familiarity with one or more VLSI design tools for Place&Route, Verilog Simulation, DRC/LVS Physical Verification, Static Timing Analysis and Power Integrity
• Experience in Perl & Tcl Scripting languages 3. Proficiency in UNIX/Linux is advantageous.

• Create ATE (Advantest SmarTest PS1600) test program and integrate various test functions in test flow to support First Silicon bring up for wafer and package in NPI phase.
• Complete test development, test program transfer and product release at respective milestones.
• Perform design validation/characterization/experiment on ATE across process, voltage, frequency and temperature. Evaluate test and product margins, debug and communicate result/yield/analysis to various teams.
• Support proto demands/ramp, qualification IP owner and customer requests.
• Utilize ATE test tools and other test instrument to debug and analyze the test, design and product issue.
• Support ATE test hardware design/debug and test time reduction.
• Initiate, plan and execute multiple projects to achieve target.
• Good knowledge of product engineering, failure analysis and manufacturing test process.
• Interest in learning, researching, sharing and implementing new technology and test methodology.
• Good written/Oral communication skills.
• Result orientated and team work.

• Product engineering for VCSEL products
• Maintaining and improving VCSEL performance, yield, and reliability with extensive data analysis
• Ph.D. in physics, electrical engineering, material science or equivalent
• Experience in crystal defect study of semiconductor material with TEM a plus
• Successful candidate must be willing to work in Depot Road

Distribution Business Manager, End User Computing Division of Broadcom

The End User Computing (EUC) division is looking for an experienced and motivated Distribution Business Manager to join our Global Partner Ecosystem team. As a Distribution Business Manager, you will be responsible for the successful design and implementation of the go-to-market strategy, processes, and priorities within your territory’s distribution channel. You will work with our strategic distributors to ensure that they have the competency and skills required to expand and grow while ensuring execution across our strategic business priorities. The ideal candidate will possess a strong ability to engage across internal and external stakeholders, working cross-functionally to manage and own key growth strategy with Distribution Partners.

Success in the Role: What are the performance outcomes over the first 6-12 months you will work toward completing?

Making an impact early will rely on your ability to establish relationships with colleagues and senior leadership across your partners; building solid knowledge and understanding of our technologies; and navigating the internal & external processes and best practices within the teams. Your success will come from great communication skills, effective planning and delivery, and a relentless curiosity for learning and developing. You will be responsible for developing a regular business cadence and managing partner opportunities, in collaboration with your extended teams at distribution, to build and sustain a pipeline and identify new areas for expansion. Within your first 12 months, you should have established a significant presence with key stakeholders across your distribution partners and driving impact across business processes and growth opportunities.

The Work: What type of work will you be doing? What assignments, requirements, or skills will you be performing on a regular basis?

A successful Distribution Business Manager will be strong business leader with strong financial acumen and industry expertise in driving sales strategy and execution within distribution. You will be instrumental in supporting distributors develop best-in-class End User Computing sales, consulting, deployment, and managed services practices, to help their partners and customers in their workplace transformation journey. Your core responsibilities will include:

• Meeting and exceeding Quarterly Partner Sales Targets
• Leading regular cadence for engagement with the range of stakeholders, including quarterly reviews, account planning, and executive briefings.
• Building strategic relationships with senior leadership and act as both an influencer and advocate for growth opportunities
• Building actionable relationships with the distributors’ leaders across all functions including sales, pre-sales, technical, services, and marketing departments.
• Creating annual plans that address short-term tactical opportunities as well as long-term strategic roadmaps, inclusive of marketing, enablement, and sales activities.
• Collaborating across the broader End User Computing team, Partner Community, as well as collaborating with our Go-To-Market and Ecosystem team to accelerate key programs and initiatives.

Required skills include:

• Depth of experience in distribution sales, management and / or business development from a technology vendor or from working at a distributor. Minimum of ten years of channel / distribution experience is expected.
• A strong sales background with demonstrated track record of strategic planning and/or sales ecosystem partners, distributors, and aggregators
• Experience in designing/driving complex projects, programs to achieve set objectives and ROI targets. Proven experience leading projects from strategy to execution.
• Excellent communication skills and thoughtful subtlety especially around communicating financial trends
• The successful candidate should expect to work flexible hours including being able to travel approx. 25-50% the time.

What is the leadership like for this role? What is the structure and culture of the team like?

The hiring manager is the Worldwide End User Computing Partner Sales and Ecosystem leader, Al Irizarry. Al has over 25 years of experience in technology sales across hardware, software, and connectivity solutions. His leadership style is open, direct, and performance driven. He is straight to the point, accessible and focused on results. He fosters a culture of empowerment and collaboration where accomplishments are acknowledged and celebrated. The team prides itself on working together to solve problems with its charter to simplify and execute, while helping deliver the best partner experience to support our mutual customers achieve their business outcomes.

• You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
• You will work closely with package design & technology, test & product engg, production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes.
• Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams.
• Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction.

•Qualifications:

• PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes.
• Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc.
• Good team player, result oriented individual, experienced in project management, failure analysis tools, techniques and TQM. Good analytical, problem-solving skills. Flexible and agile.
• Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment.
• Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice.
• Experienced AutoCAD user. Knowledge of silicon & PCB fabrication, board assembly processes, are an added advantage