Total 55 Senior Executive process improvement manager job vacancies in d18 tampines pasir ris

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.

At SSMC, every career journey is unique and rewarding. We're looking for innovative, passionate, and talented people like you to join our team.

We’re searching for a Engineer/ Senior Engineer to be part of our Photo Process department diverse team of talent. You will be responsible to sustain and improve all metrology tools and recipe indices to meet operations goals

What you will be working on:

• Optimize process capability to meet operation needs
• Perform Shift duties to support production
• Implement projects to upkeep process capabilities and reliabilities
• Troubleshoot process issues, establish Best known methods for future reference.
• Monitor and control process performance indices such as Cpk
• Work as a team with both equipment and manufacturing Engineers to meet module objectives
• Start-up new equipment processes which involves process characterization and development
• Establish and maintain a good audit system for both internal and QA audit on process documentation.
• Troubleshoot out-of-control situations and decide on the lot disposition in an out-of-spec situation.

More About You:

• Bachelor Degree in Engineering, Science or equivalent
• 1-3 years experience in semiconductor manufacturing environment. Fresh graduates with keen interest to develop a career in semiconductor manufacturing environment are welcome to apply.
• Basic engineering knowledge, which may include semiconductor devices theory, electronics, digital principle and wafer fabrication processes.
• Good communication and presentation skills
• Proficient in Microsoft business applications
• Good problem solving skills
• Posses logical thinking skills
• Team Player
• Strong sense of responsibility
• Positive learning attitude
• Able to take pressure under time-constrained situations
• Detail-oriented

SSMC is committed to equal employment opportunities and abides by the Tripartite Guidelines on Fair Employment Practices (TGFEP). All qualified applicants will receive non-discriminatory consideration for employment on the basis of merit and regardless of age, race, gender, religion, marital status and family responsibilities, or disability, or any other attributes as protected by the relevant laws.

The key functions of Process Engineer is to:

1. Applies Engineering principles and techniques to optimise production process in the fab to meet department and organization goals and objectives

2. Analyse and troubleshoots process engineering, manufacturing, and maintenance issues, and recommend engineering solutions or developed work instructions for out of control processes

3. Leads production and manufacturing systems, improvement projects and develop operation plans in accordance with department and organization objectives alighn with regulatory requirements.

Tasks:

• Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
• Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN. Provide guidance to junior Engineers.
• Setup and troubleshoot issues in recipes/ job files in all metrology tools within the Module.
• Analyze data from passed down to identify chronic process issues, establish improvement programs and lead engineers to resolve them. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Work as a team with both Equipment and Manufacturing Engineers to meet Module objectives. Drive team to meet key indices of Uptime and OEE as per the goals set for these indices.
• Take on leadership roles to drive a small cross functional task team to address yield improvement/ excursion issues.
• Facilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements.
• Resolve complex technical issues in own Module or yield related issues
• Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self audit and update specifications / documentation to meet TS16949 Quality Standard requirements.

Requirements:

• Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics / Material Sciences / Mechanical
• Min 5 years of relevant work experience in Thin Film CMP Process
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

Responsibilities:

Carry out activities to addresss & resolve Non-Quality Events (NQEs)

Monitors & carry out activities to resolve NQEs at various product / production lines

• Monitors & records NQEs from the production line
• Reviews, analyses & validates NQE contents
• Executes immediate containment actions for NQE e.g., hold lot in Manufacturing Execution System (MES), etc.
• Prepares and consolidates quality issue review topics (to share on the progress of follow ups on NQEs / MRBs) prior to daily meeting with Yield Dept
• Prepares information package required for MRB (e.g. event chronology, preliminary investigation and analysis results, etc.); Facilitates MRB meetings
• Records, follow ups and reports Quality Engineering activities (e.g. NQE, MRB, etc.) on Quality Activities Tracker
• Issues & drives 8Ds for NQE issues

Monitor product thru Quality Gate

Applies Quality Gate (QG)

• Monitors & records QGs results from the production line
• Performs lab analysis (e.g., SEM / EDX) on QG failed parts
• Participates in task forces (defect analysis, risk assessments)

Following the detection of QG failed lots, proposes short-term actions to ensure integrity of the quality of products and / or processes (i.e., equipment shutdown, etc.)

Others

Data Analysis: Pulls, plots capability & trend and analyses data from JMP & Klarity

Reports: Updates & presents various Quality Engineering reports & KPIs

Others: Performs audits and other tasks as may be assigned

Requirements:

Educational Qualifications :

Diploma – Minimum 2 years of relevant experience in a manufacturing environment

Higher NITEC – Minimum 3 years relevant experience

NITEC – Minimum 6 years relevant experience

Technical / job knowledge :

• Knowledge in Quality tools and methods (SPC/MSA/FMEA, Problem-Solving & Audit skills) is an advantage
• Knowedge in statistical tools (e.g. JMP, Klarity, etc.) is an added advantage
• Knowledge and skills in lab (SEM/EDX, etc.) is an added advantage
• Knowledge of semiconductor products & manufacturing processes

Personal capabilities :

• Meticulous and with a sense of initiative, responsibility & urgency
• Team player with positive attitude and willingness to learn

Others :

• Able to work on normal swing shift (Sunday - Thurs), 8.30am to 6pm

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Job requirement:

• Ability to perform first level investigation out of control situation and line excursions, abnormal lot/tool judgement due to inline OOC and OOS from SPC Chart.
• Process condition optimization.
• Work closely with equipment and production to ensure key module objectives are met.
• Evaluation to improve process margin.
• Cost reduction projects.
• Ensure safety, discipline and housekeeping compliance by all personnel.
• Analyze different types of defects and provide clear problem description with maintenance counterparts on troubleshooting.

Job requirement:

• Diploma in Electrical/Electronics/Chemistry/Microelectronics/Engineering or equivalent.
• Relevant working experience in Photo Process semiconductor front-end industry
• Willing to work in cleanroom environment.
• Able to perform 12-hour rotating shift
• An excellent team player with good interpersonal skill
• Strong logical thinking capability and good analytical skill
• Highly committed with good ownership and accountability
• Passion for the semiconductor / manufacturing industry
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

Job Description:

• Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices
• Monitor critical SPC charts daily. Perform process window study and provide improvement plan to reduce OOC and improve CPK
• Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
• Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
• Upload recipe, check recipe and ensure recipe content compliance using RMS.
• Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN.
• Setup and troubleshoot in recipes/ job files in all metrology tools within the Module.
• Follow up on passdown to troubleshoot process issues. Establish CAS / procedures to be followed and work with other departments for resolution if required.
• Startup and qualify new process and new equipment within scheduled timeline. Work closely with the Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run.
• Work on reducing process constraint so that Mfg can have more flexibility.
• Perform process matching between equipments to reduce variation and analysis / DOE to find factors for better tool matching.
• Participate in CIP programs to optimize process window, cost, yield, and productivity.
• Work as a team with both Equipment and Mfg Engineers to meet Module objectives. Work to meet the key indices of Uptime and OEE goals.
• Represent own Module to attend cross-functional task team to address yield improvement/ excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
• Self audit and update specifications/ documentation to meet TS16949 Quality Standard requirements.
• Follow good housekeeping and safety rules in office and FAB.
• Provide coaching, guidance, feedback and training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment.

Requirements:

• Degree in Electrical / Electronics / Microelectronics / Chemical Process / Chemistry / Physics
• Min 3 years of relevant work experience in Etch Process or BEOL
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

Job Description:

Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of IME to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in operations support in clean room to make sure projects are completed successfully and delivered on time.

This position is based in Singapore.

Responsibilities:

• Operate semiconductor equipment to perform processes, measurement, and inspection of wafers. (Include equipment setup, loading and unloading of wafers)
• Monitor basic equipment/process errors and perform recovery.
• Work with internal and external parties to align for tool time, execute process sequence and collect data to feedback to integration owner.
• Logistically transport wafer lots between equipment within cleanroom and between worksites.
• Identify and address potential areas for improvements such as cycle time, utilization, and cost.
• Perform chemical change/ top-up for equipment under supervision.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
• The candidate may be required to perform shift work (Mon-Fri).

Experience:

• NITEC/ Diploma in Electrical/Mechanical/Chemical Engineering
• Basic understanding on semiconductor process is preferred
• 1-3 years of experience in semiconductor processes (Litho, Etch, CVD, PVD, Plating, Metrology etc.) will be added advantages

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.

At SSMC, every career journey is unique and rewarding. We're looking for innovative, passionate, and talented people like you to join our team.

We’re searching for a Senior/ Associate Engineer to be part of our Integration Department diverse team of talent. You will be responsible fab yield excursions and improvements.

What you will be working on:

• Assist Integration engineers in 7*24 support of Fab Yield Improvement
• Handle fab yield excursions
• Handle all Integration signals
• Analyze and issue excursion notice to the organisation
• Perform and support root cause analysis
• Monitor and report fab baseline yield performance
• Create Yield and SPC reports
• Support baseline excursion recovery
• Support Engineering activities
• Receive and follow Engineering Requests
• Report and hand over results

More About You:

• Diploma in Electrical/ Electronics Engineering or equivalent
• 3 - 5 years' relevant fab experience
• Willing to perform 12 hours shift
• Good interpersonal and communication skills
• Good team player

SSMC is committed to equal employment opportunities and abides by the Tripartite Guidelines on Fair Employment Practices (TGFEP). All qualified applicants will receive non-discriminatory consideration for employment on the basis of merit and regardless of age, race, gender, religion, marital status and family responsibilities, or disability, or any other attributes as protected by the relevant laws.

Role & Responsibilities:

• Responsibilities include diagnosing appropriate levels of metal/metal-alloy contaminations by oxygen and other contaminants; determining the root cause of contaminants, and establishing protocols for characterizations.
• Hands-on providing support for onsite metal PVD, including creating, running, and characterizing recipes to achieve the lowest resistances.
• Collaborates closely with equipment vendors and device engineers to optimize the metal-stack for device performances and robustness/reliability, from low to high temperatures.
• Lead data analysis related to implant-induced defects and cleaning issues on metal contacts with solutions development.
• Examines the work-functions of metal/metal-alloys suitable for Ohmic contact on SiC.
• Responsible for designing experiments for Ohmic contact on various SiC substrates with different doping types, determining their impact, and resolving issues to achieve the lowest specific contact resistances.
• Designing cleaning processes to obtain ideal Schottky diode using various metal/metal-alloys on SiC for high-performance applications.
• Work closely with cross-departmental and integration teams and in 3-5 years’ time develop a WBG backend process integration team of at least 4 persons.

Requirements:

• PhD Degree in Material Science, Physics, Electrical Engineering or related field.
• >8 years related industrial experience inclusing backend process module integration.
• Extensive hands-on experience in PVD (Physical Vapor Deposition) processing for metal depositions and interface tuning.
• Strong understanding of metal-semiconductor contact physics.
• Expertise in work-function tunings of metal and metal-alloy.
• Proficiency in modulating electron affinity through implantation or surface treatments of semiconductors.
• Familiarity with wide band-gap semiconductor materials and their interaction with metal/metal-alloys at various temperatures.
• Thorough fundamentals in Ohmic contact and Schottky diode physics, as well as the impact of defects and contaminations on electrical properties.
• Skilled at mentoring and transferring knowledge to junior staff members.
• Excellent communication skills to effectively address customers' needs, concerns, and solution requirements.

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Job requirement:

• Ability to perform first level investigation out of control situation and line excursions, abnormal lot/tool judgement due to inline OOC and OOS from SPC Chart.
• Process condition optimization.
• Work closely with equipment and production to ensure key module objectives are met.
• Evaluation to improve process margin.
• Cost reduction projects.
• Ensure safety, discipline and housekeeping compliance by all personnel.
• Analyze different types of defects and provide clear problem description with maintenance counterparts on troubleshooting.

Job requirement:

• Diploma in Electrical/Electronics/Chemistry/Microelectronics/Engineering or equivalent.
• Relevant working experience in Photo Process semiconductor front-end industry
• Willing to work in cleanroom environment.
• Able to perform 12-hour rotating shift
• An excellent team player with good interpersonal skill
• Strong logical thinking capability and good analytical skill
• Highly committed with good ownership and accountability
• Passion for the semiconductor / manufacturing industry
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

Role & Responsibilities:

• Responsibilities include diagnosing appropriate levels of metal/metal-alloy contaminations by oxygen and other contaminants; determining the root cause of contaminants, and establishing protocols for characterizations.
• Hands-on providing support for onsite metal PVD, including creating, running, and characterizing recipes to achieve the lowest resistances.
• Collaborates closely with equipment vendors and device engineers to optimize the metal-stack for device performances and robustness/reliability, from low to high temperatures.
• Lead data analysis related to implant-induced defects and cleaning issues on metal contacts with solutions development.
• Examines the work-functions of metal/metal-alloys suitable for Ohmic contact on SiC.
• Responsible for designing experiments for Ohmic contact on various SiC substrates with different doping types, determining their impact, and resolving issues to achieve the lowest specific contact resistances.
• Designing cleaning processes to obtain ideal Schottky diode using various metal/metal-alloys on SiC for high-performance applications.
• Work closely with cross-departmental and integration teams and in 3-5 years’ time develop a WBG backend process integration team of at least 4 persons.

Requirements:

• PhD Degree in Material Science, Physics, Electrical Engineering or related field.
• >8 years related industrial experience inclusing backend process module integration.
• Extensive hands-on experience in PVD (Physical Vapor Deposition) processing for metal depositions and interface tuning.
• Strong understanding of metal-semiconductor contact physics.
• Expertise in work-function tunings of metal and metal-alloy.
• Proficiency in modulating electron affinity through implantation or surface treatments of semiconductors.
• Familiarity with wide band-gap semiconductor materials and their interaction with metal/metal-alloys at various temperatures.
• Thorough fundamentals in Ohmic contact and Schottky diode physics, as well as the impact of defects and contaminations on electrical properties.
• Skilled at mentoring and transferring knowledge to junior staff members.
• Excellent communication skills to effectively address customers' needs, concerns, and solution requirements.

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

Job Summary

Responsible for the execution of process design involving preparation of calculations and review of process design drawings in accordance to customer specifications, applicable codes, standards and other generally accepted practices in the design of industrial plants such as petrochemical and oil refineries.

Duties & Responsibilities

• Lead a process team to carry out process design engineering work in feasibility studies, Front End Engineering Design (FEED) and detail engineering design.
• Act as Key Person to execute tender preparation, actual EPC/EPCm project execution.
• Generate project specifications, design philosophy, PFDs, P&IDs, calculations, operation manuals to comply with clients’ requirement.
• Carry out process simulations and develop heat and material balances.
• Carry out process design for reactors, columns, drums, heat exchangers, tanks and develop respective process datasheets.
• Carry out hydraulic design for pumps, compressors, blowers and develop respective process datasheets.
• Conduct and/or attend P&ID design reviews, HAZOP, IPF, SIL studies, 3D model reviews.
• Check design outputs, datasheets and drawings prepared by Process Engineers to ensure accuracy and completeness to design requirements and concepts.
• Support construction and commissioning activities at site.
• Coordinate with client, Project Team and other engineering departments and vendors.
• Monitor manhours and schedule for Process work and deliverables.
• Perform other functions that may be assigned by Department Manager.

Requirements

• Bachelor’s degree in Chemical Engineering.
• Minimum 10 years’ of experience.

Skill Requirements

• Ability to use computer equipment and peripherals to carry out routine computing tasks.
• Good knowledge in PRO/II, HYSYS, HTRI, AUTOCAD and Microsoft Office.
• Possess good communication and technical skills.
• Strong leadership qualities and analytical and reasoning abilities.
• Ability to read, analyze, and interpret common technical information, contracts reports, international codes and standards.

Interested parties, please send in your detailed resume.

Role & Responsibilities:

• Responsibilities include diagnosing appropriate levels of metal/metal-alloy contaminations by oxygen and other contaminants; determining the root cause of contaminants, and establishing protocols for characterizations.
• Hands-on providing support for onsite metal PVD, including creating, running, and characterizing recipes to achieve the lowest resistances.
• Collaborates closely with equipment vendors and device engineers to optimize the metal-stack for device performances and robustness/reliability, from low to high temperatures.
• Lead data analysis related to implant-induced defects and cleaning issues on metal contacts with solutions development.
• Examines the work-functions of metal/metal-alloys suitable for Ohmic contact on SiC.
• Responsible for designing experiments for Ohmic contact on various SiC substrates with different doping types, determining their impact, and resolving issues to achieve the lowest specific contact resistances.
• Designing cleaning processes to obtain ideal Schottky diode using various metal/metal-alloys on SiC for high-performance applications.
• Work closely with cross-departmental and integration teams and in 3-5 years’ time develop a WBG backend process integration team of at least 4 persons.

Requirements:

• PhD Degree in Material Science, Physics, Electrical Engineering or related field.
• >8 years related industrial experience inclusing backend process module integration.
• Extensive hands-on experience in PVD (Physical Vapor Deposition) processing for metal depositions and interface tuning.
• Strong understanding of metal-semiconductor contact physics.
• Expertise in work-function tunings of metal and metal-alloy.
• Proficiency in modulating electron affinity through implantation or surface treatments of semiconductors.
• Familiarity with wide band-gap semiconductor materials and their interaction with metal/metal-alloys at various temperatures.
• Thorough fundamentals in Ohmic contact and Schottky diode physics, as well as the impact of defects and contaminations on electrical properties.
• Skilled at mentoring and transferring knowledge to junior staff members.
• Excellent communication skills to effectively address customers' needs, concerns, and solution requirements.

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.

At SSMC, every career journey is unique and rewarding. We're looking for innovative, passionate, and talented people like you to join our team.

We’re searching for an Senior Engineer to be part of our Diffusion CMP Department diverse team of talent. You will be responsible to sustain and improve process capability indices to meet operations goals

What you will be working on:

• Monitor process performance indices on qualified processes and establish good controls to maintain process performance
• Optimize process capability to meet operation needs
• Perform Shift duties to support production
• Implement projects to upkeep process capabilities and reliabilities
• Troubleshoot out-of-control situations and process issues and put corrective actions in place
• Start-up new equipment processes which involves process characterization and development
• Work with both internal and external customers to improve yield and quality
• Organize training for AEs/Technicians to upgrade their technical skills to perform tasks assigned and maximize their effectiveness
• Ensure productivity improvement through process optimization through the use of quality improvements tools
• Liaise and work with vendors on process related problem solving, as well as performance improvements
• Establish and maintain a good audit system for both internal and QA audit on process documentation

More about you:

• Bachelor's degree in Electronics / Microelectronics Engineering / Chemical / Physics / Material Science or equivalent
• 3-5 years experience in the semiconductor manufacturing environment

SSMC is committed to equal employment opportunities and abides by the Tripartite Guidelines on Fair Employment Practices (TGFEP). All qualified applicants will receive non-discriminatory consideration for employment on the basis of merit and regardless of age, race, gender, religion, marital status and family responsibilities, or disability, or any other attributes as protected by the relevant laws.

Duties and Responsibilities:

• To assist end-to-end payroll and claim processing promptly and accurately in accordance with the stipulated policies and guidelines.
• Conduct exit interviews, compile and analyse the reason of attrition.
• Responsible for full recruitment process and participate in the selection to ensure best job-to-person match.
• Conducts orientation programmes for new recruits and ensures proper induction is given.
• Organize and coordinate the training and development plan and ensure that appropriate competencies are delivered and maintained in compliance with statutory requirements.
• Work closely with site Managers, Supervisors and management team to deliver HR initiatives and operational support.
• Assist in maintaining the document management system in accordance to the company’s ISO policies and procedures.
• Process of Group Insurance administration for staff and ensure compliance with the Act
• Assist the HRM in annual performance assessment and salary review cycles.
• Assist in resolving complex employee relations issue and address grievance.
• Assist in organising corporate social responsibility and welfare activities.
• Other ad-hoc administrative duties when assigned.

Requirements:

• Diploma/Degree in a HR-related discipline
• Good team player
• Able to work independently
• Meticulous, careful and positive
• Resourceful and enjoy challenges

Job Overview

In today's information-centric world, the core of information technology lies in the semiconductor industry. UMC is a leading global semiconductor foundry company and we are sincerely inviting process engineers to join us. You have the opportunity to develop your expertise in the semiconductor industry and improve the conditions for advanced technologies through design and development experiments to provide a more stable process at lower cost and higher yield! Learn to establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.

Responsibilities

• Day to Day monitoring and ownership to timely address in-line SPC/defect/Equipment abnormality, handling and disposition
• Manage projects in productivity improvement, particularly for new processes, using process characteristic analytical tool to improve process condition and technology
• Establish process parameters for a variety of semiconductor equipment to ensure line stability
• Evaluation and development of new equipment/materials/process

Qualifications

• Minimum requirement of a Bachelor's Degree in Electronic Engineering , Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering and Physics
• Demonstrated experience of at least 5 years in semiconductor foundry module process
• 22/28 nanometer and below advance technology nodes experience is highly desirable
• Strong understanding of process development, optimization and troubleshooting.
• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
• Ability to analyze complex process issues, identify root causes, and implement effective solutions
• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred
• Able to commit shift work

Job Overview

In today's information-centric world, the core of information technology lies in the semiconductor industry. UMC is a leading global semiconductor foundry company and we are sincerely inviting process engineers to join us. You have the opportunity to develop your expertise in the semiconductor industry and improve the conditions for advanced technologies through design and development experiments to provide a more stable process at lower cost and higher yield! Learn to establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.

Responsibilities

• Day to Day monitoring and ownership to timely address in-line SPC/defect/Equipment abnormality, handling and disposition
• Manage projects in productivity improvement, particularly for new processes, using process characteristic analytical tool to improve process condition and technology
• Establish process parameters for a variety of semiconductor equipment to ensure line stability
• Evaluation and development of new equipment/materials/process

Qualifications

• Minimum requirement of a Bachelor's Degree in Electronic Engineering , Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering and Physics
• Demonstrated experience of at least 5 years in semiconductor foundry module process
• 22/28 nanometer and below advance technology nodes experience is highly desirable
• Strong understanding of process development, optimization and troubleshooting.
• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
• Ability to analyze complex process issues, identify root causes, and implement effective solutions
• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred
• Able to commit shift work