You are responsible for, but are not limited to, the following:

• Develop and optimize unit processes to meet the yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Dry Etch team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to our demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Description

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS modules. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration, device physics and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

Experience:

* 3 - 5 Years of Experience in BIM Software (Revit, BENTLEY & CAD)/Domain Experience ( Piping Design - Process Systems )

* Possess Excellent Communication & Interpersonal skill.

Qualification:

* Equivalent Diploma or B.E/B.Tech Degree (Mechanical/Electrical/Electronics & Communication/Instrumentation)

Skill Set:

* Support BIM Coordinator at all type of 3D BIM Modelling and assigned tasks.

* Parametric family creation & LookupTable edit/ Manage knowledge is Mandatory.

* Process Knowledge is Mandatory.

* Must have extensive knowledge in creating various kinds of Revit Families.

* Hands-on experience in Revit & Navisworks.

* Preparing all kinds of 2D and 3D drawings from the Revit model.

* Clash detection and co-ordination using Navisworks.

* Able to handle all types of 2D CAD Drafting Works

Experience:

* 3 - 5 Years of Experience in BIM Software (Revit, BENTLEY & CAD)/Domain Experience ( Piping Design - Process Systems )

* Possess Excellent Communication & Interpersonal skill.

Qualification:

* Equivalent Diploma or B.E/B.Tech Degree (Mechanical/Electrical/Electronics & Communication/Instrumentation)

Skill Set:

* Support BIM Coordinator at all type of 3D BIM Modelling and assigned tasks.

* Parametric family creation & LookupTable edit/ Manage knowledge is Mandatory.

* Process Knowledge is Mandatory.

* Must have extensive knowledge in creating various kinds of Revit Families.

* Hands-on experience in Revit & Navisworks.

* Preparing all kinds of 2D and 3D drawings from the Revit model.

* Clash detection and co-ordination using Navisworks.

* Able to handle all types of 2D CAD Drafting Works

Position Summary

We are looking for an assistant fermentation engineer who wants to join us on our journey to create sustainable flavours in F&B applications. The role is responsible for the day-to-day operations of our commercial pilot facility. This includes supporting the lead fermentation engineer in their work; operating fermentation equipment in scaled-up processes; executing manufacturing steps in accordance with safety, hygiene, and quality protocols; and ensuring the quality and safety of the product. The ideal candidate will have experience in fermentation, such as in beer brewing or food manufacturing.

Responsibilities

● Operate fermentation equipment in scaled-up processes (100 to 500 L)

● Run pre- and post-processing steps, including drying, roasting, mixing, milling

● Collect and analyse data to ensure the quality and safety of the product

● Work with team members and stakeholders to run the facility

● Comply with all safety and regulatory requirements

Responsibilities

• Perform basic network troubleshooting
• Supports the service team on the commissioning, preventive maintenance and testing of equipment as well as to provide continual technical support to customers
• Develop and design surveillance or network system with project leader
• Deliver projects according to schedule, client’s satisfaction and installation standards
• Carry out testing and commissioning of CCTV, Access Control, Intercom, Fire Alarm, AV, Public Address and other Security & Communication systems
• Provide support to Project Team on the implementation of new projects
• To troubleshoot any technical problems and provide support to users
• Analyse equipment failures to determine cause and recommend/take corrective actions
• Provide support to projects during DLP period to ensure all rectification works are completed before handover.
• Designing layout and schematic diagrams with AUTOCAD or Microsoft Visio

Requirements

• Diploma or Degree in IT Networking / Electronics & Electrical / IT Engineering / Computer Science / Telecommunication Engineering
• Minimum 3 years of related working experience in Security / CCTV industry
• Experience in IP network-based video surveillance, door access control and intrusion system design and setup
• Experience in router setup and configuration
• A good team player, independent and able to work under pressure
• Bilingual in English and Mandarin to liaise with mandarin speaking associates
• Able to handle stress; Love challenging tasks
• Love to explore new technologies

We are looking for a skilled mechanical engineer to join our team. You will be responsible for working on all stages of our production cycles, from research and design to manufacturing, installation, and evaluation.

To be successful as a mechanical engineer, you should be a highly creative individual who can develop innovative solutions to our clients' problems. The top candidate will also be able to communicate their technical ideas clearly, both visually and verbally.

Mechanical Engineer Responsibilities:

• Manufacturing, installing and evaluating components that fulfill requirements.
• Analyzing problems or deficiencies and developing solutions to resolve them.
• Conducting experiments and evaluations to improve and innovate product designs.
• Creating plans and designs using CAD technology.
• Estimating budgets and time scopes for each project.
• Writing technical documentation for machine operators.
• Ensuring that products meet compliance regulations.
• Collaborating with other engineers in our team.

Mechanical Engineer Requirements:

• Bachelor's degree in mechanical engineering (master's preferred).
• Licensed as a professional engineer.
• Experience working in the mechanical engineering field.
• Superior computer skills, with solid experience in CAD, CAM, and Matlab/LabView programs.
• Ability to run simulations and analyze test data.
• Ability to write clear and comprehensive technical documentation.
• Highly analytical mind, with exceptional problem-solving skills and attention to detail.

Essential Duties and Responsibilities:

1. Quality Assurance and Control:

• Develop, implement, and maintain quality assurance plans, procedures, and control measures.
• Monitor and analyse production processes to detect and resolve quality issues.
• Ensure compliance with relevant regulatory requirements, including FDA, ISO 13485, and other applicable standards.
• Support internal and external audits and regulatory inspections.
• Investigate and resolve product-related issues, deviations, and non-conformities, with the authority to recommend corrective and preventive actions.
• Ensure the non-conformance or quality issue is resolved and complete in a timely manner.
• Participate in new product introductions to ensure quality is built into all products early in their life cycle
• Support validation processes including IQ, OQ, PQ, process validation and test method validation.

2. Process Improvement

• Identify opportunities for process improvements to enhance product quality and manufacturing efficiency.
• Lead and drive QA initiatives across the product areas
• Lead or participate in root cause analysis and corrective action planning.
• Support and drive cost improvement project

3. Customer Interaction:

• Address customer complaints and feedback related to product quality.
• Work closely with customers to understand their quality requirements and ensure that products meet their specifications.
• Communicated on any potential change request of the processes to customer.
• Provide technical support and quality-related information to customers.

4. Documentation and Reporting:

• Maintain comprehensive records of quality control activities, inspection results, and non-conformance reports.
• Prepare and support monthly / annual quality reports to management and other stakeholders.
• Ensure proper documentation and traceability throughout the manufacturing process.

5. Training and Development:

• Train manufacturing staff on quality standards, procedures, and best practices.
• Promote a culture of quality and continuous improvement within the organization.

Education/Experience and Qualifications:

• Degree in Engineering or science, with 2 - 5 years of progressive Quality responsibility, preferably in medical device / pharmaceutical manufacturing.
• Diploma holders in Engineering or science with more than 5 years' experience in Quality are welcomed to apply
• Knowledge of regulatory requirements and quality standards, including FDA regulations and ISO 13485 standards.
• Strong analytical and problem-solving skills, with the ability to troubleshoot complex issues.

Job Description
As a BIM Engineer, you will report to the Senior Design Engineer and be responsible for the successful implementation and management of BIM processes in the construction field, specifically focusing on Building Services, Airconditioning, and Mechanical (M&E, ACMV) works. You will collaborate closely with the design department to ensure compliance with engineering and safety requirements and coordinate with stakeholders to maintain the integrity and accuracy of the BIM model throughout the project lifecycle.

Key Responsibilities

1. Construct and manage Building Information Models (BIM) with precision, ensuring the integrity and accuracy of all models. Ensure timely coordination and completion of tasks as assigned by the immediate superior.
2. Ensure all BIM models comply with project specifications and requirements.
3. Maintain and update the model library for all ongoing projects, ensuring that all data remains secure and is treated as company property.
4. Collaborate with project teams to collect site information for updating project BIM models.
5. Work closely with the Quantity Surveying department to provide drawings and information required for tendering, cost estimation, monitoring, and scheduling.
6. Coordinate with the BIM department to validate and confirm the accuracy of BIM designs.
7. Maintain, update, and manage hardware and software essential for the operation of BIM.
8. Assist in the creation of 2D AutoCAD drawings and ensure seamless integration between 2D and BIM models, bridging the gap between office and site operations.
9. Ensure all work conforms to the company’s ISO standards.
10. Support the submission of Operation, Maintenance, and Monitoring (OMM) manuals and media presentations using BIM models.
11. Follow the company's responsibility and authority matrix in the execution of duties.
12. Participate in the conceptualization and detailed design of ACMV/HVAC systems, ensuring compliance with local codes and standards, such as Singapore Code of Practice (CP13), SS553, and the Fire Code.
13. Utilize design software to perform thermal load calculations, energy modelling, and system sizing.
14. Prepare design documents including system layouts, schematics, and specifications.

Preferred Experience Areas:

• Hospitals, Labs, Operating Theatres
• Commercial or Industrial Buildings (Warehouses, Factories)
• Government Projects
• Data Centers

Requirements

• Education: Degree in Mechanical Engineering or a related field. Candidates with a degree in Sustainable Infrastructure are welcome to apply. Fresh graduates are encouraged to apply.
• Experience: Must have project ACMV experience.
• Certifications: Safety certification, minimum Bizsafe Level 2. Training will be provided if not already certified.
• Skills:Proficient in English, both written and spoken.
  Strong independence and leadership in a teamwork environment.
  Knowledge in BIM is an added advantage. Inexperienced candidates must be willing to learn, with training provided.
  Ability to move across various local sites.
• Soft Skills: Excellent communication, collaboration, and problem-solving skills.

Advantages & Benefits:

• 5-day work week.
• Progression-centric career development.
• AWS and Variable Performance Bonus included.
• Annual Incentive Trip.
• Sponsorships for further learning/education.
• Flexible working hours and work-from-home options.
• Comprehensive medical benefits.

JOB DESCRIPTION

Department: Passive component Department

Report to: Regional Product Manager – Passive component

Functional Relationships with:

Co-create with ASEAN/INDIA/OCEANIA business development related members like Products Marketing/Engineering team, Business Development team, Sales team and with related Products Departments in Japan HQ.

POSITION PROFILE:

Based in: Singapore.

The product engineer is responsible for business creation/pre-sale of assigned products to expand ASEAN, India & Oceania business, and support local sales for design wins. Regional travel is required.

Key Duties & Responsibilities:

• Initiate product marketing and promotion activity of assigned product to expand the business regionally and globally.

• Technical support to get design wins for immediate opportunities and solve technical troubleshooting to maintain business.

• Closely work with internal stage holder and HQ to align goals and build a strategy (solution) to achieve.

• Manage marketing & promotion activity by PDCA system and analyze both success-case and un-success-case, then adjust strategy to achieve the goal.

• Coordinate necessary training for Murata sales and distributors.

• Enhance promotion activity for long tail customers by Digital marketing approach and Exhibition collaborating with MARCOM.

• Proactively investigate regional unique inquiry and develop new business/product with key stakeholders.

• Market analysis, capture ecosystem, identify key players & competitors, create hypothesis of customer's pain point in a selected market, and make an idea to solve customer's pain & how to win with Murata solution against competitors.

• Collaboration project involving bundle promotion, product Q&A, product training with Regional Strategic Marketing section.

Ability / Competency Required:

• Bachelor’s degree in Electrical or Electronics Engineering is preferred; Applicants with other engineering degrees are welcome to apply.

• Basic Knowledge of electronics, device and market ecosystem, and good market analysis skills.

• Proactive, strong communication, Interpersonal and organizational skills.

• Positive attitude in challenging work environments.

• Available for Travel within the ASEAN, India, Oceania, and Japan region.

• Disposition of Fab lots affected by planned or unplanned deviations (including those from Special Work Requests and Fab Conversions, or from Quality Deviations and Excursions).
• Work closely with Fab partners to identify and contain excursion material. Initiate and lead multi-functional MRB (Material Review Board) to conduct risk assessment and decide upon disposition of excursion material.
• Review and analyze proposed process conversion changes to ensure that the proposed manufacturing changes conform to current business standards, improve Micron’s competitiveness in terms of wafer yields and costs, and protect Micron’s product quality.
• Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products.
• Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations.
• Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when necessary.
• Ensures that established manufacturing inspection, sampling and statistical process control procedures are followed.
• May assure compliance to in-house and/or external specifications and standards, such as GMPs and ISO regulations.
• Evaluates and analyzes the efforts in organizing, documenting, and interpreting inspection support documents and records.

Requirements

• Bachelor's Degree in Electrical or Chemical Engineering, Material Science, Physics and 3+ years of semiconductor industry experience
• Knowledge of Electrical and Physical Failure analysis of semiconductors
• Knowledge of semiconductor memory product and reliability testing
• Strong understanding of NAND FLASH operation and structure
• Intermediate understanding of wafer fab manufacturing process steps, functional probe and parametric testing methodologies
• Excellent statistical data analysis, troubleshooting and decision making skills
• Proven track record to work effectively in both an independent role and in team environments
• Excellent multi-tasking and problem solving skills
• Intermediate PC skills including MS Office Word, Excel and PowerPoint
• Ability to clearly communicate data and findings both verbally and in writing.

You are responsible for, but are not limited to, the following:

• Develop and optimize unit processes to meet the yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Dry Etch team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Relevant experience in Dry Etch Process Development is a plus
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to our demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Job Responsibilities

• Advanced process development tasks such as developing SEM, OCD, or other metrology related equipment, driving the understanding of new metrology technology and measurement techniques in 3D NAND technology.
• Own applications and develop processes of new nodes, including supporting Fab4 in the development of recipes/models of wafers running in Fab4.
• Identify and provide solutions for inline detection in collaboration with process engineer and process integration.
• Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe
• Collaborate with US TD Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements.
• Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.
• Influence vendor equipment roadmap to enable new technology development in Micron

Requirements:

• Bachelor’s/ Masters in Electrical, Material Science Engineering would be advantageous.
• Relevant experience (>2 year) in Metrology Process Development is a plus
• Fresh Graduate are welcomed to apply
• Capable of international travel up to 3-5 months
• Good communication skills (verbal and written)

Job Description

As a Senior or Principal NAND Device Engineer in the Device Technology Development group at Singapore site of Micron Technology Inc., you will be responsible for analyzing the cell device characteristics, engineering memory device/array operation, and developing novel solutions for next generation NAND technologies in order to meet the required cell and array performance within project timelines. You will have an exciting opportunity to be front and center in the development of the most cutting-edge NAND technologies and products in the world!

Your responsibilities will include, but are not limited to:

• Contribute to the device technology development of state of the art NAND cell, in particular by providing expertise in NAND Cell device physics and NAND memory array operation.
• Perform electrical characterization of NAND cell arrays and test structures to identify device improvement directions.
• Contributing to the cell improvement effort (performance, reliability) by providing feedback to the Process Integration and Cell teams in Singapore and in Boise on process experiments and possible interactions with array operation.
• Trim and waveform/algo engineering in order to improve Vt placement, performance and reliability. Utilize first principles device knowledge to develop novel array solutions.
• Strong collaboration is required with product engineers and probe engineers.

Requirements:

Successful candidates for this position will have:

• Ph.D or Master’s degree in Electrical engineering with focus on Semiconductor devices
• A strong understanding and experience with nonvolatile memories and in particular, NAND device physics.
• A strong understanding of semiconductor devices and processes.
• Experience with NAND cell trim and algo development is preferred.
• A strong understanding of statistics.
• Solid communication and reporting abilities.
• The ability to be highly skilled at driving for results.

Your responsibilities will include, but are not limited to, the following:

• Discover yield issues in NAND development and identify unique metric or combination of metrics, such as wafer/dice/tile shading, ECATS or other custom metric for issues quantification.
• Interact with process area, process integration, yield, failure analysis, product engineering, design, and layout teams to drive clear definition of yield, cell, CMOS, qual, and reliability issues and pareto and derive improvement actions needed across tech-nodes and designs.
• Own and drive non-standard deep dive statistical analysis of inline, probe, cell, and other critical metrics to define issues/problems, enable early inline detection, and improve the product yield and quality. Quantify and track progress on the issue hit hate, line impact, gap to program goal. Quantify yield improvement/downside seen based on process/probe changes.
• Initiate data mining and correlation study on new issue seen. Initiate PFA request to identify root cause of yield issue. Perform inline correlation study to establish inline prediction to yield issue. Make yield projections based on expected improvement/downside. Conduct yield trend analysis, identify root causes in process step, conversion, algorithm change, and design, for yield shift.
• Continuously develop/re-define inline detection in collaboration with metrology and RDA team.
• Identify and define gaps with current test and co-develop (with product, probe, param engineering) unique parametric/probe bins to detect new fail modes as well as validate new program release.
• Collaborate with module owners to identify, quantify key module deficiencies/technology gaps, and drive cross-functional teams to address. Optimize existing layout, conceptualize, and develop innovative solutions to meet product requirements and manufacturability.
• Develop and innovate techniques in extracting data from different databases through various query languages and automate through scripting to improve work efficiency.
• Assist and support the transfer documentation of layout/architecture fundamentals of new technology from R&D to manufacturing fab.

Successful candidates for this position will have:

• Minimum of 3-5 years of experience in the semiconductor industry in the areas of Process Integration, Yield Enhancement, Failure Analysis, Data Science, or Unit Process.
• Ability to develop a strong holistic end to end understanding of PI module on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with nonvolatile memories along with good understanding of the process flow, interaction of process & device, common yield & reliability issues are desirable.
• Curiosity and natural tendency of learning new things independently.
• Exposure to R&D and transfer/manufacturing is desirable.
• Deep understanding of layout and architecture of NAND product.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection is desirable.
• Fluency in Python, JavaScript, C or C++ is desirable.
• Ability to be self-motivated and self-governing with proven ability to work in a demanding and dynamic environment.
• Ability to drive and coordinate cross-functional teams to achieve various goals.
• Solid analysis, communication and reporting abilities with demonstrated presentation abilities.
• Ability to travel for extended periods of time to the US or other fabs for collaborative R&D work.

Education:

BS, MS/PhD in Electrical Engineering, Microelectronics, Data Science, Computer Science or related field.

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS Front end/interconnect module. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration, device physics and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

Position Summary:

The Staff Engineer, Operations Planning role will focus on strategies development to ensure that Singapore Instrument Operations’ organization structure, operating model, financial model, resources deployment, systems and processes, are aligned to support Illumina’s business growth. This role will also support Global Instrument Platform Operations to drive alignment on global manufacturing strategies.

Position Responsibilities:

• Drive effective deployment of Singapore Instrument Operations resources to meet organizational strategy and goals including linkage between strategy, operational plans, projects, and key metrics.
• Develop, deploy and refine strategies and playbooks for NPI engagement, On-market Platform management, CM and Field management.
• Develop and deploy operating models to drive cost savings, resource utilization and productivity.
• Lead and drive department goals definition, alignment, and deployment.
• Track projects, deliverables, critical issues, and action items; follow up to ensure completion to schedule.
• Coordinate and report operations deliverables for quarterly operational health reviews, dashboard reports, budgeting, etc.
• Lead and drive bi-annual workplan meetings with talent reviews, ensuring meetings are actionable and decision oriented.
• Drive communications on behalf of the Singapore Instrument Operations leadership team around operational plans, key initiatives, and important activities.
• Partner and collaborate with Global Instrument Platform Operations to drive alignment on global manufacturing strategies, KPIs, tools, systems and processes.
• Establish framework to leverage cross-sites’ capabilities and resources.
• Partner with Program Management Office in sPAC reporting, projects and resources tracking.
• Partner with Finance in cost savings, budget planning, resource utilization and productivity related activities.

Listed responsibilities are an essential, but not exhaustive list, of the usual duties associated with the position. Changes to individual responsibilities may occur due to business needs.

Position Requirements:

• Experience working with cross-functional teams comprising various internal organizations.
• Ability to influence across the organization at all levels.
• Experience in managing projects and driving metrics. Proven track record establishing and implementing business processes.
• Strong problem solving and analytical skills, ability to solve complex and diverse business problems.
• Ability to work in a highly collaborative and fast-paced environment.
• Ability to work independently and collaboratively across disciplines required.
• A self-organized, self-starter, highly motivated individual capable of multi-tasking.
• Effective and strong communication skills – both written and verbal. Able to articulate and discuss ideas and persuade others to achieve common outcomes.
• Ability to read and write Chinese Language fluently is preferred, as this role will be managing the China market and local stakeholders.
• Experience in FDA/IVD/Med Device industry is a plus.
• Requires deep understanding of operations activities.

All listed requirements are deemed as essential functions to this position; however, business conditions may require reasonable accommodations for additional task and responsibilities.

Preferred Experience/Education/Skills:

• Bachelor’s Degree or equivalent in Engineering required. Graduate (Master’s) Degree preferred.
• 10+ years working experience with 5-7 years of relevant experience.

NTI NAND Senior/Principal Process Integration Engineer

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position,

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
• Ability to travel for extended periods to the US for collaborative R&D work

Prefered to have Skills / Experiences as below:

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement.
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Exposure to R&D and transfer/manufacturing is desirable.

Education:

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.

Job Descriptions:

• To plan, coordinate and execute quality assurance and quality control of project
• To ensure all products are executed in accordance to contract specifications
• To liaise and coordinates with suppliers / sub-contractors to ensure quality control
• To plan and arrange of transportation for delivery of materials to site
• Facilitate in monitoring material status updates and traceability records while maintaining scheduled workload
• Facilitate on off-site inspection/ sampling / testing and submission of materials
• Maintains safe, secure, and healthy work environment and aiming for zero accident
• Making sure sites meet legal guidelines, and health and safety requirements
• Any other ad-hoc duties as and when assigned

Job Requirements:

• Degree/Diploma in Civil Engineering or related field.
• Min 3 years of QA/QC experience in the construction industry, preferably in structural steelwork
• Familiar with CONQUAS and QMA scheme
• Knowlege in quality control documentation.
• With welding inspection certificate (CSWIP 3.1) an advantage

Responsibilities:

• Define Product Architecture, Conceptualize and Prototype new designs based on specifications
• Participate in Design and Development of baseband analog/logic/digital circuit for wireless audio products.
• Perform circuit integration, schematic generation and circuit/system levels testing and optimization.
• Ensure design processes and documentation meets company requirements
• Work with a team of engineers and/or designers through different phases of the product development.
• Willing to travel overseas to support prototype builds and customers reviews

Requirement:

• Degree in Electrical/Electronics/Communication Engineering.
• Min 3 years experience in baseband design and Development
• Hands-on experience in design and test of Baseband/Audio/Power management is required.
• Knowledge of baseband system integration for audio, power, battery, memory and processor components are desired.
• Experience in audio/wireless hardware system design is an advantage.
• Analytical, independent, highly energized, good interpersonal skills, excellent communication skills and good leadership qualities.
• Excellent teamwork skills, flexibility, and ability to handle multiple tasks.

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

Interested candidates may also apply or write in to CS Chua, EA 12C6130/ R1548619 [email protected]. Shortlisted candidates will be contacted for a discussion.

Responsibilities:

• Design, development, testing and support of firmware/embedded software applications for microcontroller based wireless systems.
• Develop software communication protocols for wireless communication systems
• Drive technology/development projects in all phrases from specification to release.
• Read or understand electronics schematic and system design.
• Work closely with cross functional teams to ensure project delivery on time.
• Define and create product software specification including software architecture, feature descriptions and applications notes of the system
• Research technical issues and/or opportunities and provide recommendations.
• Participate in ad hoc software projects and assignments as required

Requirements:

• Degree in Electronic/Electrical/Computer Engineering/Computer Science, Software Engineering or related fields.
• Minimum 3-5 years of experience in real time embedded system
• Must process strong knowledge of C/C++ language
• Experience with Arm, Cortex based microcontroller is required
• Strong Knowledge of the communication transport protocol like I2C, SPI, UART and USB
• Understanding of the Bluetooth protocol and stack is a plus.
• Familiarity with DSP programming is an added advantage
• Excellent teamwork skills, flexibility, and ability to handle multiple tasks.
• Able to manage one's own time efficiently

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

Interested candidates may also apply or write in to CS Chua, EA 12C6130/ R1548619 [email protected]. Shortlisted candidates will be contacted for a discussion.

Provide technical support and assist Manager in project planning and coordination of all site activities.

• Prepare and revise engineering documents, drawings, risk assessments, method statements, safe work procedures, operations and maintenance manuals for all necessary works.

• Coordinate and supervise construction teams and subcontractors for the erection, testing and commissioning of installation of equipment to the required specification and quality.

• Liaise with consultants, owners and relevant authorities on their engineering request.

• Plan and schedule work activities at sites in accordance to master program and ensure work is conducted in a timely and safe manner.

• Ad-hoc duties assigned by the Management from time to time.

Responsibilities:

• Software development in Embedded Linux including development of the design, and implementation and customisation of solutions using Linux OS
• Tune up/Optimise system performance and improve system stability using the strong background in embedded system, OS, and multi-thread programming.
• Be involved in system architecture and design and Systems Requirement definitions
• Participate in requirements gathering, driving solutions, testing, deployment, maintenance and enhancement embedded implementations
• Interpret and evaluate designs and assist in Firmware problem solving.
• Conduct design reviews and incorporating knowledge of real-time embedded Linux firmware

Requirements:

• Degree in Electronic/Electrical/Computer Engineering/Computer Science, Software Engineering or related fields.
• Good understanding of embedded Linux architecture.
• Minimum 8 years of hands-on experience with the embedded Linux operating system, frameworks development, and C/C++.
• Minimum 5 years of hands-on experience with Linux bootloader and kernel.
• Must be able to develop solutions in both the Linux device driver/HAL layers.
• Able to develop in Android Framework layers is an advantage.
• Experience working in a collaborative and distributive team environment.
• Skilled in debug tools (ADB, JTAG, Kernel debug) as applied to areas like power management, tasking control, and memory management, and other complex debug situations.
• Excellent teamwork skills, flexibility, and ability to handle multiple tasks.
• Able to manage one's own time efficiently.

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

Interested candidates may also apply or write in to CS Chua, EA 12C6130/ R1548619 [email protected]. Shortlisted candidates will be contacted for a discussion.

Provide technical support and assist Manager in project planning and coordination of all site activities.

• Prepare and revise engineering documents, drawings, risk assessments, method statements, safe work procedures, operations and maintenance manuals for all necessary works.

• Coordinate and supervise construction teams and subcontractors for the erection, testing and commissioning of installation of equipment to the required specification and quality.

• Liaise with consultants, owners and relevant authorities on their engineering request.

• Plan and schedule work activities at sites in accordance to master program and ensure work is conducted in a timely and safe manner.

Japanese MNC

Salary $2800-$3500

Location: Yishun

Industry: Semiconductor

Monday to Friday 8.30am to 5.30pm

Key Responsibilities:

• Handle sales/marketing functions, including quotations, sales reports, and forecasts.
• Prepare, analyse, and submit reports to superiors.
• Secure orders and ensure product delivery.
• Establish and maintain strong customer relationships.
• Service existing accounts and develop new business opportunities.
• Work with customers to customize products to their project objectives.
• Prepare and deliver technical presentations on products and services.
• Collaborate with customers and engineers to meet equipment requirements.
• Perform other related duties as required.

Qualifications/Requirements:

• University Degree or Polytechnic Diploma in engineering.
• 1-2 years of sales experience, preferably in the semiconductor industry.

Please submit your updated resume in MS format by using the APPLY NOW BUTTON.
Alternatively, you may also email your resume to us at [email protected]

Emily Fong
Senior Talent Specialist
Atomrecruit Pte. Ltd. | MOM EA License No.: 15C7443
EA Personnel Reg No.: R1768368