Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for FEOL area
- Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
- Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
- Work with equipment suppliers to develop new capability
- Actively participate in Package Development Engineering activities
- Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
- Create decision matrix for equipment and material selection
Installation and qualification of new equipment platform and handover to production group (pilot line setup)
- Plan/submit capital request to acquire new Equipment
- Create purchasing specification (Doc2) document
- Establish the new equipment qualification criteria and activities roadmap with respective functional team
- Establish project handover requirements and procedures upon machine qualification
- Prepare documentation for handing over with respective site owner
- Conduct data gathering for low volume production
- Conduct training for Site representatives/personnel
- Establish the feedback loop for Continuous Improvement after mass volume production
Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform
- Maintain and regularly update the TOR, with inputs from local or other assembly site
- Maintain general knowledge of process and material characteristics and translate to equipment design requirement
- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need
Collaborate with production group on upgrades of existing production equipment through continuous improvement projects
- Maintain knowledge of design constraints and weakness of existing platform
- Participate in the continuous improvement projects involving equipment improvement and upgrades
Job Requirements/ Qualifications:
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Basic knowledge in semiconductor manufacturing assembly & wafer bumping packaging technologies & techniques
- Minimum 2 years’ experience in related semiconductor industry
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology
- Advantage packaging technology and Front end of line background will be preferable and plus point
- Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
- Fast learner, with initiative and independence (min supervision)
- Good team player, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication and presentation skills
- Understanding of business needs and customers’ requirement
- Strong project management skills to ensure execution to timelines
