Responsibilities:
- Lead engineers for Plasma Dicing Process Engineering Build Qualification and ramp-up support for WLCSP devices
- Provide engineering and technical support to assigned area of process (product SPC, recipe development, process FMEA, process specifications)
- Performs analysis on process related issues and provide solutions for improvement
- Provide disposition on hold lots and raw materials in production line
- Generate and maintain procedures and specifications for production reference and simplification
- Execute continuous improvement project or activities in Quality, Delivery and Cost
- Coordinate with Customer Focus Engineers for all improvement activities associated with specific customers for the process related issues and activities
Requirements
- Degree in Electrical/Electronics, Engineering, Manufacturing or equivalent
- Minimum 3 years’ experience in a semiconductor Plasma Dicing process
- Working experience in analysing product yield impact against machine and process parameters
- Have in-depth understanding of Plasma Dicing Process input parameters and output response to product yield, UPH, cost
- Strong DOE knowledge using JMP software for process optimization and characterization
