Total 80 quality control engineer job vacancies in Others category in Singapore

As the Facilities SmartFac & Control Engineer, you are required to lead engineering and maintenance works in the fields of SMART Fac and Control systems on site, with the necessary guidance and direction from Facilities organization, to achieve facilities department, site, facilities corporate and company goals.

• Lead on site Smart System transformation and on implementation of Smart FAC projects with AI-enabled detection and analytics in collaboration with other Micron Departments.
• Lead on Sustainability and Environmental Control system deployment with early detection and predictions, using Industry 4.0 system.
• Lead on labor productivity automation projects with innovative idea to improve facilities team efficiency.
• Plan, design and lead Control Automation engineering projects includes new construction, system upgrading and quality improvement.
• Lead troubleshooting and attend to abnormalities in support of Operations in a timely manner on system under Smart FAC & Control section when required.
• Lead on the planning and supervise Preventive and Corrective Maintenance work activities, priorities and reallocate resource when required.
• Perform capacity tracking and planning for Instrumentation and Control systems.
• Acquire estimated cost and raise purchase requisition for service or parts necessary for repair and maintenance purpose, when required.
• Utilize computer base software to document and analyze records of work order and equipment history.

Job Requirements:

• Bachelor Degree in Electrical/Electronics/Computer engineering or equivalent related field.
• Good knowledge on Python, Java, C/C++, C#, SQL, machine learning.
• Good knowledge in programming of programmable logic controller (PLC) and process automation PID control.
• Good knowledge of various handheld tool, portable and panel measuring device and equipment.
• Ability to understand and use schematic, single-line drawing and related equipment and system documentation
• Ability to work in a team environment with various professional level.

Responsibilities:

• Review and analyze experimental process flows: Identify defect anomalies and quarantine out-of-control process tools.
• Embrace continuous improvement: Seek ways to enhance operations
• Raise awareness of process anomalies: Recognize and communicate issues promptly.
• Leverage inline process signals: Drive process improvements using real-time data.
• Explore new inspection tools and strategies: Aim for earlier problem detection and source identification.
• Innovate with existing tools: Develop techniques to identify relevant process issues.
• Manage image classification models: Enable automated reporting systems.
• Collaborate with the global network to develop best-known methods and maintain alignment between sites.

Requirements:

• Bachelor’s/ Masters in Engineering would be advantageous
• Experience with semiconductor inspection equipment is preferred.
• Data Science and Data Manipulation skills: Ready to learn and apply basic scripting, coding, or programming.
• Preference for metrology or inspection experience: Especially related to data analysis and root cause investigation.
• Capable of international travel up to 3-5 months
• Good communication skills (verbal and written)

Job Responsibilities

• Advanced process development tasks SEM CD, OCD or other metrology techniques in 3D NAND technology.
• Identify and provide solutions for inline detection in collaboration with process engineer and process integration.
• Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe
• Collaborate with US TD Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements.
• Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.
• Influence vendor equipment roadmap to enable new technology development in Micron

Requirements:

• Bachelor’s/ Masters in Engineering would be advantageous
• Experience with semiconductor inspection equipment is preferred.
• Data Science and Data Manipulation skills: Ready to learn and apply basic scripting, coding, or programming.
• Preference for metrology or inspection experience: Especially related to data analysis and root cause investigation.
• Good communication skills (verbal and written)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities

• Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond.
• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes.
• Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability.
• Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts.
• Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Bachelors’ degree or higher in Materials Science, Chemical Engineering or Physics with minimum 2 years hands-on experiences in relevant regE process developments.
• Familiarity with regE process developments and yield improvements.
• Understanding of various integration and structural impacts and constraints related to wafer edge.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.

As a Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization/development to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with equipment/material suppliers to achieve yield, quality, cost and risk management objectives.

Micron’s NAND Technology Integration (NTI) Singapore R&D group is looking for process development engineer to support R&D activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND products.
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing CVD/PVD teams on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise R&D to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

Requirements

• Master degree or higher in Materials Science, Chemical/Microelectronic Engineering, or Physics with minimum 3 years hands-on experience in leading edge film deposition/implant technology work. Fresh PhD/Masters graduates in Materials Science, Chemical/Microelectronic Engineering or Physics are also welcome to apply.
• A deep understanding of chemical kinetics, thermodynamics, physical phenomena and their direct application to CVD/PVD deposition in various deposition methods.
• An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects.
• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise R&D for 4-6 months at a stretch to work on technology development.

As a NAND CMOS Device Engineer, you will help set the direction for current and future CMOS technology for Micron’s NAND Memory Technology Roadmap!

You will work with the Design Team to set electrical targets and define transistor structures to meet these targets. You will guide the device technology development and be in close relation with Process Integration, Design Engineering, Design, Design Rules, Reliability, Transistor Modeling, TCAD (Technology Computer-Aided Design), and Parametric Test, to name a few! In addition, you will ensure that the developed technology is manufacturable and highly yielding and that these considerations are designed into the technology from the start.

Together with your peers, you craft and implement our NAND-CMOS roadmap and make sure to align to product roadmaps

• You give directions on how to improve our device portfolio, both in performance and cost effectiveness
• You define, execute, and analyze silicon experiments for future device generations
• Interface with Design Engineers to define transistor targets, deliver transistor models, and optimize critical layout constrained Design Rules
• Work with TCAD simulation group to develop strategies for transistor structures to meet targets
• You strive to ensure that transistor models are correctly targeted to anticipate final silicon
• Define electrical test structures for transistors, isolation, design rule verification, and process monitoring
• Highly motivated to ensure transistors are developed meeting the required reliability standards
• You take initiative to collaborate with Manufacturing to ensure transistors are performing as expected and to debug yield/reliability issues
• You foster and enable a collaborative working style and team spirit by mentoring less experienced colleagues

Minimum Qualifications:

• MS/PhD in Electrical Engineering or related field, PhD in Semiconductor Device Technology preferred
• 5 plus years industry experience in the field of CMOS device design, simulation, characterization
• Experience in developing advanced logic transistor technologies
• Experience in developing Analog FETs operating at higher Voltages
• Preferred: Experience in the field of High Voltage applications, reliability, characterization, device development
• Understanding of analog design concepts
• Good presentation skills
• Excellent team and mentoring skills

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.

Your responsibilities will include, but not limited to:

FAB PROCESS KNOWLEDGE

• Proficient knowledge of wafer process and traveler flows for main products.
• Understands high-level factory limitations.
• Knowledge of capacity analysis and production planning. Knowledge about Sales and Operations Planning (SNOP) and MOR business processes.

PROJECT MANAGEMENT

• Demonstrates advanced ability to successfully define, plan, and handle the implementation of complicated projects.
• Appropriate and timely escalation of roadblocks to project sponsor.
• Developing delegation, risk/cost analysis, and project tracking skills.
• Regular communication of project progress to stakeholders, team members and sponsors.

PLANNING SYSTEMS, APPLICATIONS, COMPUTER, MICROSOFT OFFICE and PROGRAMMING SKILLS

• Understands the interaction of planning systems and associated applications used within Micron.
• Understanding of system interaction, adept at extracting data from various systems.
• Demonstrates ability to use Microsoft Office to develop presentations, handle projects and perform all other tasks in an effective manner.
• Advanced ability in Excel and proficient in using VBA Macros to enhance and automate tasks.
• Advanced ability in Programming / Data Automation programs, e.g. Python, Tableau, Power BI, etc. to automate tasks and support data analysis.

STRATEGIC OPERATIONS

• Provide planning support for Emerging Projects.
• Support capacity studies for Special Projects.
• Provide Business Planning support for various Capacity Options.
• Analyze Fab Capital Expenditure and Output Scenarios for Business Plan.
• Fab Mix optimization for various Capacity and Capital Expenditure Scenarios.
• Efficient management of Capital Expenditure scenarios and cash flows through scenarios comparison and optimization.
• Ability to provide and evaluate modeling options that enable lowest cost of operation.

FINANCIAL ANALYSES

• Partner with Finance team to complete a thorough financial analysis through various scenarios (Manufacturing Cost, return on investment/payback, Net Present Value NPV, Profit/Loss (P/L) analysis).
• Ability to provide and evaluate Scenario options to improve financial analysis.

Requirements :

• Bachelors’ Degree in Industrial Engineering or equivalent experience. Additional major/minor in Computer Science, or a Business-related or quantitative field (Finance, Economics or similar subject area), MBA or Master’s degree is a plus
• Proficient in Microsoft Office to develop presentations, handle projects and perform all other tasks in an effective manner.
• Advanced ability in Excel and proficient in using VBA Macros to enhance and automate tasks.
• Advanced ability in Programming / Data Automation programs, e.g. Python, Tableau, Power BI, etc. to automate tasks and support data analysis.
• Ability to turn complex and ambiguous problem statements into structured solution.
• Experience analyzing and interpreting data, drawing conclusions, defining recommended actions, and reporting results cross diverse technical and non-technical groups
• Experience working independently in teams, establishing and maintaining multi-functional relationships
• Experience in a combination of capacity analysis, business analysis or process analysis is advantageous

Working Locations :

1, North Coast Drive, Singapore 757432

As a member of the HIG HBM Media Health HVM team you will lead and develop a high-performing products driving Media Health Manufacturing and activities within the HBM Product and Systems Engineering Team. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.

Key Responsibilities

• Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.
• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.
• Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.
• Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.
• Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.
• Root Cause and Resolution of Qual and RMA Device Issues.
• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of NAND products, which are key components in many modern technologies.
• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelors/Masters Electrical Engineering Degree with at least 1 year of experience in the semiconductor industry.
• Experience in CMOS device design, simulation, characterization and development of Analog/CMOS transistors operating at higher Voltages.
• Programming skills/experience in Python; logic gate and transistor operation knowledge; circuit simulation or circuit debug skills/experience.
• Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
• Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Strong sense of responsibility and accountability towards assigned role with professional work ethic.
• Work on site in Singapore with international travel to USA, Taiwan and Japan.

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements

• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
• Create decision matrix for equipment and material selection

Evaluate and qualify new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

• Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

• Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
• Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
• Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support

Supplier Management & Engagement Program

• Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
• Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
• Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment
• Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication (verbal & written) and presentation skills (English speaking is must)
• Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements

• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
• Create decision matrix for equipment and material selection

Evaluate and qualify new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

• Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

• Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
• Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
• Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support

Supplier Management & Engagement Program

• Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
• Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
• Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment
• Experience with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication (verbal & written) and presentation skills (English speaking is must)
• Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines

We are looking for a Package-Silicon Integration Engineer in Micron's Package Development Engineering(PDE) Group, who will be responsible for driving advanced package development for next generation silicon and package technologies. You will collaborate with various functional teams such as silicon wafer design, package design, wafer fab to meet project requirements. You will drive the technology development through multiple phases of product maturity and contribute to Micron's strategic objectives of Technology leadership.

RESPONSIBILITIES include but are not limited to:

• Work with package design and development teams to complete chip package interaction risk assessment.
• Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules/FMEA.
• Work with die designers to enable design for manufacturing in area like die size, scribe width and pad size.
• Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relevant issues, and improve yield, quality and manufacturability.
• Contribute to development of new silicon and package technologies by engaging with Micron’s internal factories.
• Define test vehicles, plan DOEs, characterize enabling technologies, document best-known-process and hand-off to manufacturing.
• Identify technology, quality, business process gaps and develop solutions.

EDUCATION, EXPERIENCE & QUALIFICATION REQUIRED

• Masters or Bachelor’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical) or related field
• 5-7 years of semiconductor fab experience in Chip package interaction and integration
• Strong Project / Program management skills
• Possess sound methodology for organizing work, decision-making and setting priorities
• Strong analytical, problem solving, and organizational skills
• Proficiency in computer applications like Excel, Word, Power Point.
• Self-motivated and team-oriented.
• Strong interpersonal, oral and written communications-skills.

Keen on the role? Apply now!

As a Fab 10 Facilities Operations Transformation Engineer, you will play a pivotal role in redefining our Facilities Operations to support our advanced memory and AI applications. You will lead multiple exciting programs aimed at improving team productivity and ensuring an uninterrupted supply of plant utilities and facilities services, operating 24/7 to support Fab Production. Your innovative mentality and passion will drive continuous improvement through data, automation, and enhanced operational strategies. You will have opportunities to work with people from various backgrounds and different responsibilities.

Responsibilities and Tasks:

• Drive improvements to all existing and future Operations programs, coordinating with all Facilities system owners from all sites in Fab 10.
• Lead Post Incident Review (PIR) processes to prevent facilities supply interruptions and ensure smooth execution of critical work through the Site Incident Prevention Plan (SIPP).
• Spearhead labor productivity improvement projects, using business process improvement and automation in daily operations.
• Area Quality Coordinator (AQC), leading quality improvement programs, includes: problem-solving, quality champion, and human deviation reduction.
• Represent Fab 10 in Global Facilities AQC and Operational forums to handle, lead, and facilitate all Global Facilities operations and quality programs.
• Learn and drive improvement to Facilities daily operations, including but not limited to:
• Supervise and handle facilities equipment's and system through FMCS or equivalent, like Life safety system.
• Respond swiftly to abnormal condition affecting production or the site in general and raise it to relevant parties accordingly.
• Reponse and restore facilities services in a timely manner to minimize interruption to production or the site
• Support and implement operating procedures and risk assessments for all facilities systems and facilities-related work activities.
• Follow up on incidents or service interruptions with system owners.
• Coordinate and connect with internal and external parties for facilities operation-related activities.
• Support the shift operations ERT (Emergency Response Team).
• Support Facilities Operation meetings with the Facilities Operations Manager.
• Coordinate, handle, and improve the work permit system.
• Act as a backup for the Site Operations Manager’s functional scope if required.
• Prepare and consolidate operation reports.

Requirements:

• Bachelor in Engineering (Mechanical/Electrical/Controls and Instrumentation) or equivalent experience.
• Have experience with Facilities systems in Semiconductor Industry
• Experience and familiarity with data analytics/automation software such as: Tableau, Microsoft Excel, Python, SharePoint, Power BI, SQL.
• Ability to handle multiple tasks concurrently, prioritize and handle workload.
• Fluent digital literacy, including word processing, spreadsheet, database.
• Team player who enjoys working in a cross-functional environment and the ability to develop long term partnership across teams.
• Positive, energetic, and daring to innovate with the drive to actualize concept into plan.
• Excellent problem solving and analytical thinking!

Responsibilities and Tasks
• Provide engineering study is to include good design practice for state-of-the-art system designs, system capacity and capability analysis, planning for future requirements, as well as code compliance.
• Maintain engineering data bases in support of capacity tracking, capital equipment facilitation, and cash flow project management for assigned systems/areas.
• Provide support for start-up of new equipment and ensure that all equipment will properly interface to other mechanical and electrical systems.
• Specify critical components for design projects and is responsible for assuring designs meet all applicable codes and regulations. The applicable code review and analysis utilizing (but not limited to): IFC, IBC, NEC, NFPA, FM, CGA and Semi standards. This requires continual review and analysis of new and existing equipment, applications, and technology.
• Perform engineering study on emerging facilities technologies to support cutting edge semiconductor processes.
• Participate in mid to long term infrastructure planning for facilities in support of the overall company plan.
• Work with in-house TGCM contractor and ensure chemical and Gas Delivery system running smoothly.
• Review and improve Operation and Maintenance SOP and RA.
• Respond to system issues. Perform Trouble Shooting with in-house TGCM contactors and OEMs.
• Verify all works done by Chemical and Gas section are in accordance with company safety guidelines;
ensure safety features are engineered into designs; and maintain good communication with other engineering disciplines and customers throughout the organization.
• All team members are required to complete their learning items within the stipulated time frame.

For business process and/or QMS component that one is responsible or accountable for:
a. ensuring the QMS/business process that is effective and conforms to requirements.
b. ensuring that the processes are delivering their intended outputs.
c. reporting on QMS/business process performance and opportunities for improvement to management.
d. ensuring the promotion of internal and external customer focus throughout the organization.
e. ensuring the maintenance of the integrity of the QMS/ business process when changes are planned and implemented.
f. ensuring customer requirements are met.

• Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws
and regulations.
• Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings.
• Prepares bid sheets and contracts for construction and facilities acquisition.
• Reviews and estimates design costs including equipment, installation, labor, materials,preparation and other related costs.
• Inspects construction and installation progress for conformance to established drawings, specifications, and schedules.
• Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

Education

• Bachelor’s degree in Chemical Engineering or equivalent discipline.

Skills, Knowledge and Abilities

• Good team work and collaboration

• Excellent communication and presentation skills

• Strong problem solving and analytical skills

• Independent and able to work on own initiative

• Good organizational skills and ability to prioritize and schedule workload

• Good knowledge of Microsoft Office

Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations. Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings. Prepares bid sheets and contracts for construction and facilities acquisition. Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs. Inspects construction and installation progress for conformance to established drawings, specifications, and schedules. Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

Responsibilities and Tasks

• Provide engineering study is to include good design practice for state-of-the-art system designs, system capacity and capability analysis, planning for future requirements, as well as code compliance.
• Maintain engineering data bases in support of capacity tracking, capital equipment facilitation, and cash flow project management for assigned systems/areas.
• Provide support for start-up of new equipment and ensure that all equipment will properly interface to other mechanical and electrical systems.
• Specify critical components for design projects and is responsible for assuring designs meet all applicable codes and regulations. The applicable code review and analysis utilizing (but not limited to): IFC, IBC, NEC, NFPA, FM, CGA and Semi standards. This requires continual review and analysis of new and existing equipment, applications, and technology.
• Perform engineering study on emerging facilities technologies to support cutting edge semiconductor processes.
• Participate in mid to long term infrastructure planning for facilities in support of the overall company plan.
• Work with in-house TGCM contractor and ensure chemical and Gas Delivery system running smoothly.
• Review and improve Operation and Maintenance SOP and RA.
• Respond to system issues. Perform Trouble Shooting with in-house TGCM contactors and OEMs.
• Verify all works done by Chemical and Gas section are in accordance with company safety guidelines; ensure safety features are engineered into designs; and maintain good communication with other engineering disciplines and customers throughout the organization.
• All team members are required to complete their learning items within the stipulated time frame.

For business process and/or QMS component that one is responsible or accountable for:
a. ensuring the QMS/business process that is effective and conforms to requirements.
b. ensuring that the processes are delivering their intended outputs.
c. reporting on QMS/business process performance and opportunities for improvement to management.
d. ensuring the promotion of internal and external customer focus throughout the organization.
e. ensuring the maintenance of the integrity of the QMS/ business process when changes are planned and implemented.
f. ensuring customer requirements are met.

• Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations.

• Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings.

• Prepares bid sheets and contracts for construction and facilities acquisition.
Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs.

• Inspects construction and installation progress for conformance to established drawings, specifications, and schedules.

• Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

Education

• Bachelor’s degree in Chemical Engineering or equivalent discipline.

Skills, Knowledge and Abilities

​​ 3 to 5 years experience in relevant fields of Chemical and Gas system

• Good team work and collaboration

• Excellent communication and presentation skills

• Strong problem solving and analytical skills

• Independent and able to work on own initiative

• Good organizational skills and ability to prioritize and schedule workload

• Good knowledge of Microsoft Office applications

Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations. Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings. Prepares bid sheets and contracts for construction and facilities acquisition. Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs. Inspects construction and installation progress for conformance to established drawings, specifications, and schedules. Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

Probe Test Solutions Engineer will develop and maintain wafer level test programs to test functionality of NAND Flash products.

As a Probe Test Solutions Engineer, you will develop and maintain wafer level test programs to test functionality of NAND Flash products.

The general responsibilities of the position include but are not limited to the following:

• Develop and maintain wafer level functional test strategies and programs for semiconductor NAND Flash products
• Collaborate with various engineering and production groups to ensure test program, infrastructure and system readiness for new product introduction as well as high volume manufacturing
• Improve device yield, reliability and quality through test condition optimization, advanced redundancy analysis schemes, data analysis and test equipment hardware optimization
• Provide cost effective and innovative solutions for production test flow optimization with cutting-edge test time reduction methodologies
• Develop and release test programs to production in a timely manner
• Assist process and production teams by providing necessary engineering expertise to ensure smooth manufacturing operations

Requirement:

• Bachelors/ Masters in Electrical/Electronics/Computer Engineering or equivalent
• Showcases good programming skills and experience; Python/C/C++ knowledge
• Solid analytical problem-solving skills
• Excellent verbal and written communication skills
• Good understanding of semiconductor industry and semiconductor device physics
• Knowledge of Unix/Linux environment will be an added advantage
• Keen on semiconductor industry

Directs and coordinates engineering activities concerned with development, procurement, installation, and calibration of instruments, equipment and control devices. Determines conditions under which tests are to be conducted, and phases of test operations. Coordinates operational, functional and performance phases of tests. Analyzes and interprets test data. Prepares technical reports of for use by engineering personnel.

Responsibilities include, but not limited to:

• Responsible for in-depth data analysis to look for sighting that is detected from reliability testing on certain cell marginality.
• To work closely with cross functional team to drive for cause, cell mechanism understandings and mitigation plan (device and process) when sightings of cell marginality are noted.
• Look into volume reliability data to probe data correlation to look for signals for cell metrics/kill limit recommendation to guardband intrinsic reliability capability.
• Enable proactive methodology for cell reliability analytic study on both die and wafer level assessment using advanced product-dispo techniques.
• Enable proactive methodology for defectivity (DPM) reduction at wafer level using advanced product-dispo techniques.
• Develop state-of-art and advanced algorithms, encompassing advanced models to boost and enhance data-mining and pattern recognition for quality and yield improvement.
• Work with Product/Fab/Engineering teams on product issues (yield/cell/qualification/defectivity/RMA/deviations) in problem analysis, data-mining and modeling, to provide optimal disposition solution.
• Implement and validate product-dispo solution with minimal yield impact and to track effectiveness of solutions.
• Develop understanding of test flows and product-dispo framework and make use of big Data to highlight strength and weaknesses in production process and improve quality of material produced with lower cost and faster cycle time.

Minimum Qualifications:

• Bachelor in Electrical Engineering.
• Strong drive and excellent written and verbal communication skills, including ability to effectively communicate complex technical ideas/concepts.
• Knowledge of Python/MySQL/ C programming will be an added advantage.
• Strong analytical and problem-solving skills, with the ability to find creative solutions to difficult problems
• Effective communication skills in written and spoken English
• Good multitasking skills and ability to set priorities in a fast moving, dynamic environment
• Self-motivation and enthusiasm

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS Front end/interconnect module. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

As the Equipment Supplier Quality Principal Engineer, you will lead a global team to ensure the highest quality standards for equipment supplied to our company. You will be responsible for establishing and maintaining strong relationships with critical suppliers, managing supplier quality governance processes, and driving continuous improvement programs. This role requires collaboration with various departments, including development, engineering, manufacturing, and procurement, to meet the business needs and ensure supplier compliance with quality management systems.

Key Responsibilities:

• Lead and manage a global team of Supplier Quality Engineers to achieve best-in-class supplier quality performance.
• Establish and maintain close relationships with critical suppliers' management teams and internal stakeholders.
• Ensure consistent management and deployment of quality requirements and supplier quality governance processes.
• Drive continuous improvement programs with critical suppliers to enhance quality performance.
• Ensure suppliers deliver the highest possible quality materials and comply with Quality Management System (QMS) requirements, standards, and other quality safeguard programs.
• Conduct regular audits and assessments of supplier processes and quality systems.
• Develop and implement supplier quality metrics and performance monitoring systems.
• Collaborate with development, engineering, manufacturing, and procurement teams to resolve quality issues and implement corrective actions.
• Provide training and support to suppliers on quality standards and requirements.

Qualifications:

• Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
• Minimum of 8-10 years of experience in supplier quality management, preferably in the semiconductor or electronics industry.
• Strong knowledge of quality management systems, standards, and methodologies.
• Proven experience in leading and managing a global team.
• Excellent communication and interpersonal skills.
• Strong analytical and problem-solving abilities.
• Ability to work effectively in a fast-paced and dynamic environment.

Preferred Qualifications:

• Master's degree in a related field.
• Certification in quality management (e.g., Six Sigma, ISO 9001).
• Experience with supplier quality management in a multinational corporation.

As an Inline and Final Parametric test program development engineer, you will be responsible for developing, maintaining, and optimizing Parametric test programs and strategies for semiconductor NAND Flash products. You will work closely with various engineering teams to ensure the quality, reliability, and performance of the products. You will also provide innovative solutions for test time reduction and test flow optimization.

Job Responsibilities

• Develop and maintain parametric test strategies and programs for semiconductor NAND Flash products
• Collaborate with test development and production engineering groups to ensure test program, infrastructure and system readiness for new product introduction as well as high volume manufacturing
• Improve device yield, reliability and quality through test condition optimization and data analysis and test equipment hardware optimization
• Provide cost effective and innovative solutions for production test flow optimization with cutting-edge Parametric test time reduction methodologies.
• Assist process and production teams by providing necessary engineering expertise to ensure smooth manufacturing operations.
• Introduce innovative test time reduction solutions and release Parametric programs to production in a timely manner.

Job Requirements

• Bachelor’s or Master’s Degree in Electrical, Electronics, Computer Engineering, Computer Science or any related engineering field
• Strong programming skills; Perl, C/C++, Python knowledge will be an added advantage.
• Knowledge of Unix/Linux System environment
• Solid analytical problem-solving skills
• Excellent verbal and written communication skills
• Good understanding of semiconductor device physics will be an added advantage
• Fresh graduates are most welcome to apply

Working Location :

1, North Coast Drive, Singapore 757432

About Micron

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to demonstrate the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords: Singapore || North West (SG-03) || Singapore (SG) || Frontend Manufacturing || College || Regular || Manufacturing/Production Operations || #LI-ST1 || Tier 3 ||

Micron Packaging R&D group is looking for highly talented individual for Wire Bond Process to develop innovative solutions for the Multi Chip Memory IC Packages.

Job Responsibilities

• Provide leadership in wire bond technology, problem analysis and resolution
• Develop and Transfer wire bond process for IC Package process technology (Wire Bond) for multichip memory packages
• Process Development & Characterization, Qualification, and production pilot run
• Work with multi-functional team to characterize new Silicon technode and develop assembly packaging/recipe solution for products requirements
• Define, plan and implement technology roadmap to meet wire bond packaging roadmaps
• Qualify and transfer packaging technology to production site
• Collaborate with other functional groups both locally and globally to develop wire bond solutions to meet the packaging business needs
• Showcase and build organization reputation by publishing technical papers and submit invention disclosures.

Job Requirements

• PhD/Masters’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering
• At least 5 years of experience in semiconductor wire bond engineering
• Good analytical and problem-solving skills, such as using Design Of Experiment and structured problem solving tools
• Self-motivated, able to work independently and self-initiative personality
• Possesses good communication skills, interpersonal skills and ability to work with global multi-functional teams

Keen on the role? Apply with us now!

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

As a Central Planning Modeling Engineer (Analytics), you will be a central contact for the manufacturing network. You will be responsible for connecting many parts of the business in order to drive the execution of manufacturing and cost-saving processes, including supply change, finance, engineering, procurement, production, and planning. Innovation is highly valued at Micron, and you will have the opportunity to develop new tools to expedite, optimize and refine the planning and reporting processes used across the network. The ability to understand the challenges and effectively communicate and collaborate with peers across the network to develop solutions to address those challenges is essential. Attention to detail and ability to work in where information is ambiguous will be extremely valuable.

Your responsibilities will include, but are not limited to:

• Applying coding techniques (e.g., Python, VBA, SQL) to automate tasks, build and implement tools and dashboards in collaboration with partners to audit current planning processes and uncover cost reduction opportunities.
• Demonstrating strong project management skills to oversee, communicate, and coordinate the implementation of automated solutions, ensuring timely and successful completion of tasks.
• Driving benchmarking and alignment strategies to optimize planning processes across the network

Requirements:

• Experience in developing reports and solutions.
• Attention to detail and the ability to turn complex and ambiguous problem statements into structured solutions.
• Proven ability to analyze and interpret data, draw conclusions, identify issues, recommend actions, drive resolutions, and report results.

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements for FEOL area

- Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap

- Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements

- Work with equipment suppliers to develop new capability

- Engage in active participation in Package Development Engineering activities

- Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need

- Create decision matrix for equipment and material selection

Installation and qualification of new equipment platform and handover to production group (pilot line setup)

- Plan/submit capital request to acquire new Equipment

- Create purchasing specification (Doc2) document

- Establish the new equipment qualification criteria and activities roadmap with respective functional - team

- Establish project handover requirements and procedures upon machine qualification

- Prepare documentation for handing over with respective site owner

- Conduct data gathering for low volume production

- Conduct training for Site representatives

- Feedback loop for Continuous Improvement after mass volume production

Maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

- Maintain and regularly update the TOR, with inputs from local or other assembly site

- Maintain general knowledge of process and material characteristics and translate to equipment design requirement

- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

- Maintain knowledge of design constraints and weakness of existing platform

- Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Minimum 2 years’ experience in related semiconductor industry
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology
- Advantage packaging technology and Front end of line background will be preferable and plus point
- Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
- Fast learner, with initiative and independence (min supervision)
- Good teammate, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication and presentation skills
- Understanding of business needs and customers’ requirement
- Strong project management skills to ensure execution to timelines

Responsibilities and Tasks

• Identifying and communicating processing and design issues that limit wafer yield.
• Perform daily analysis of electrical data as well as electrical and visual characterization of failing devices.
• Writes clear and concise reports, and offers daily presentations and clear yield reports with explanation of yield deviations and limiters
• Use knowledge of semiconductor device physics, electronics and semiconductor manufacturing process to explain and resolve yield issues.
• Work with other internal YE groups and work to understand their constraints.
• Create/participate in multi-area focus teams to troubleshoot complex yield problems.
• Present data in large meetings.

Requirements

• Bachelors Degree in Electrical Engineering, Microelectronics or equivalent experience is preferred.
• Demonstrates a good understanding of Memory devices and function.
• Good verbal and written communication skills and the ability to present data in large meetings
• Demonstrated ability to be dynamic and proactive
• Strong interpersonal skills with the ability to work effectively with a variety of people
• Proven ability to work with minimal supervision, multi-task, prioritize and manage projects, and facilitate problem solving processes
• Excellent organizational skills with a strong attention to detail
• Good understanding of electrical testing and characterization and device physics
• Intermediate computer skills including Excel, PowerPoint, JMP, and UNIX

Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

What do we have to offer?

Our IT Team presents phenomenal opportunity for a highly motivated and results-oriented individual. Join us in the adventure to explore innovative technologies to run state of art, operationally efficient and secure datacenters.

Looking to advance your career?

Micron is the place for you to expand your caliber by working on major projects, developing the leader in you! We provide online learning opportunities and on-the-job training to upgrade your skills.

What’s more? We provide peer mentorship to guide you through the process of learning new systems.

AN ORDINARY DAY OF WORK WOULD INCLUDE THE FOLLOWING:

• Involving in the application lifecycle management for software systems in a highly automated semiconductor manufacturing environment.
• Working with partners to conduct user requirement analysis and collaborate with global IT team to implement and deliver IT solutions for Manufacturing operations.
• Planning and leading user training and acceptance testing/verification for new software to ensure a good quality software release to production.
• Performing applications software and hardware maintenance to ensure high uptime
• Supervising system performance actively to identify abnormalities and develop capabilities to prevent unscheduled downtime.

THIS JOB IS FOR YOU IF YOU:

• 0-2 years experience, Possess a Bachelor’s Degree in Electrical & Electronics/Computer Engineering, Computer Science
• Knowledge in any programming language such as C#/C++ programming, Java, Perl, HTML5 and SQL.
• Creative and have passion in implementing innovative IT solutions to tackle meaningful business problems.
• Good interpersonal and communication skills. Willing to work in a clean room work environment and dynamic team environment to achieve a common goal through effective collaboration and dedication.
• Able to provide 24/7 standby operation support.
• Able to travel when required.
• Applicant who have proven good software project management skill and had exposure to agile development methodology will be advantageous.

Responsibilities and Tasks:

You will work regularly with Micron’s Business Units to ensure solutions meet or exceed business requirements. You will be expected to suggest, promote, and leverage published standards to minimize environment complexity and ensure regulatory as well as license compliance. You will have the opportunity to travel to other Micron sites as well as technology conferences and trainings.

As part of your responsibilities, you will be required to:

• Supporting acquisition, installation, and administration of enterprise Data Storage & Backup environment.
• Solving, perform root cause analysis and identify data storage related problems
• Provisioning of data storage resources to servers and provide system security and access
• Providing data backup client installations & scheduling, backup policies setting, performance tuning, and fixing.
• Use management tools to analyze performance and identify bottlenecks or slowdowns and take appropriate action to resolve.
• Develop scripts to automate manual processes for operational improvement
• Planning, coordinating and upgrading components of the data storage as needed with software, hardware upgrades. Collaborating closely with vendors as needed in this process
• Provide engineering support for raised ServiceNow cases and drive closure within SLA.
• Upkeep service efficiency and end-user satisfaction levels through service SLA.
• Maintaining systems and update operational documentation to ensure that they are current.
• Provide regular and timely update of project status to the key business partners.
• Involving in projects to upkeep the computing environment to meet future demands.
• Participate in worldwide collaboration meetings to share on engineering efforts, technical challenges and breakthroughs
• Participate in 24/7 on-call rotation, major incidents and reviews (postmortems).
• Attend to level 2/3 user service requests and service restoration through ServiceNow (Incident Management)
• Work with vendors and team members to tackle issues related to the operations (Problem Management)
• Ensure assets are updated promptly in Asset Management system
• Ensure all changes to systems are recorded and accurately executed with approval (Organizational Change)
• Review the performance of systems and plan for lifecycle projects and future expansion (Capacity Management)
• Participate in Business Continuity Planning and DR strategy including detailing of DR procedures, and executing DR drills
• Maintain and review the DR documents on a periodic basis.

Requirements:
• Bachelor’s or Masters in Computer/ Electrical/Electronics Engineering/Computer Science/ Computing