Total 22 sales coordinator job vacancies in D27 Yishun, Sembawang

• Develop ATE test program, test hardware and bench evaluation board for analog, digital and power semiconductor devices.
• Research new test methodology for better test coverage and test time reduction.
• Work with multi-functional team to meet new product release schedule
• Proficiency in C++ Programming
• Degree in Electrical/Electronics Engineering
• Fresh graduates with good academic result are welcome to apply.

Skills and responsibilities:

• Utilize commercial and in-house EDA tools (e.g. Synopsys, Cadence, Siemens) for the design and implementation of 100 ~ 400 million gate integrated circuits in 7nm/5nm/3nm/2nm process technologies.
• Proficient with a full Netlist/Gates to GDS flow, inclusive of all construction stages (e.g. RTL synthesis, placement, clock tree synthesis, detailed routing, physical verification, formal verification and timing analysis) for complex digital blocks of up to 12Mgates/3M instances with embedded macros. Ability to handle multiple block assignments in parallel is required.
• Proficiency in UNIX/Linux and scripting languages is advantageous.

Required Qualifications:

• Degree, Masters or PhD in Electrical/Electronics/Computer engineering.
• Minimum of 5 years or more experience in a relevant field.

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS in Electrical or Computer Engineering and > 5 years of related experience

Be part of a worldwide R&D team in designing leading edge optocoupler products from Broadcom.

• Design analog and mixed signal ICs for industrial and automotive applications.
• Work with marketing and project team in defining specifications and system architecture to meet customer requirements.
• Perform circuit analysis, simulation and design verification with Cadence tools.
• Test and troubleshoot circuit problems to fix bugs.
• Customer support on IC failure analysis.
• Support reliability and manufacturing tests for product qualification.

Requirements

• Knowledge and experience in analog and mixed signal IC design.
• Familiarity with sigma delta converter, switched capacitor filter, bandgap reference, PLL/DLL, optical transceiver and power management design will be added
• advantages.
• Bachelors and 7+ years of related experience or Masters degree and 5+ years of related experience or PhD and 3+ years of related experience
• Master's or Bachelor's degree in electrical engineering

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

• Requires a BS in Electrical or Computer Engineering
• Some years of relevant experience is preferable
• Fresh graduates are encouraged to apply

Skills and responsibilities:

• Utilize commercial and in-house EDA tools (e.g. Synopsys, Cadence, Siemens) for the design and implementation of 100 ~ 400 million gate integrated circuits in 7nm/5nm/3nm/2nm process technologies.
• Proficient with a full Netlist/Gates to GDS flow, inclusive of all construction stages (e.g. RTL synthesis, placement, clock tree synthesis, detailed routing, physical verification, formal verification and timing analysis) for complex digital blocks of up to 12Mgates/3M instances with embedded macros. Ability to handle multiple block assignments in parallel is required.
• Proficiency in UNIX/Linux and scripting languages is advantageous.

Required Qualifications:

• Degree, Masters or PhD in Electrical/Electronics/Computer engineering.
• Minimum of 2 years or more experience in a relevant field.

Minimum qualifications:

• Bachelor’s degree in electrical engineering, or an engineering field.
• 10 years of experience as a Semiconductor IC, Quality, Reliability or Product Engineer.
• Experience in a technical team and/or people management.
• Experience with quality control, test coverage, and IC qualification.

Preferred qualifications:

• Over 10 years of experience in quality/reliability and semiconductor IC technology.
• Experience with semiconductor suppliers and manufacturing and supply chain processes.
• Experience in troubleshooting on different failure mode and root cause analysis.
• Experience with IC qualification, data review, and production release.
• Technical expertise of materials and processes for semiconductor ICs.

Background:

• Good understanding of materials, physical failure analysis and measurement techniques.
• Familiar with ISO 9001 or other quality management standards
• Able to work in a diverse team, use proactive approach, self-reliant & excellent decision-making skills.
• Capable of supplier, customer, and stakeholder management.

Responsibilities:

• Quality and reliability expert with a track record of improving the quality of semiconductor ICs during New Product Introduction (NPI) as well as the product life-cycle.
• Establish and be responsible for the quality and reliability throughout the product/IC life cycle.
• Work with cross-functional teams to define and ensure processes in place to provide the data required to manage quality and reliability.
• Interface with suppliers on a regular basis to track and drive root cause, resolve issues, track return material authorizations, corrective actions (OCAPs), and failure analysis.
• Work with suppliers and SMEs to provide material waivers including assessment, documentation, and protocols.
• Drive supplier process audits, product audits, 8D reports and summarize results for Exec Management as well as Global Operations team.
• Technical support of Global operations team for continuous improvement initiatives, as well as qualification and application of ICs.
• Travel up to 25%.

The descriptions are for layout engineers for our Library Group. Library Group is a part of Central Engineering Group.

In Library Group, we focus on circuit design for memory, I/O (Input/Output), and Standard Cells.

Requirements:

• Strong layout knowledge with a minimum of 3 to 4 years of experience
• Skills include Cadence layout, Cadence schematic capture, using CALIBRE & Hercules verification tools.
• Strong layout knowledge in submicron process, e.g. 16nm, 7nm, 5nm, 3nm etc
• Experienced in digital (standard cell, memory, I/O) layout
• Experienced in analog layout is also a plus

Job Description:

• Responsible to understand and apply all necessary layout guidelines (standard cells, I/O memories), new process rules and other technical requirements for quality layout
• Schedule time-line & layout floor-planning
• Complete quality layout and verification within planned schedule (without supervision for experienced engineer)
• Get up to speed quickly for new methodologies, open to new ideas and communicate well with others in the library team

Skill Set (Mem):

• Strong experience in memory layout design and physical verifications includes LVS, DRC, ERC, Antenna, Electro Migration in CMOS process.
• Experienced in Cadence Layout tools VIRTUOSO (XL,VXL or EXL), and CALIBRE verification tools.
• Good experience in Floor-planning, hierarchy layout and chip integration.
• Knowledge of Script Programming and SKILL Programming would be a plus.
• Able to lead or train a team of junior engineers
• Good knowledge on memory layout topology.
• Experience in memory compiler will be a plus.
• Ability to lead on new technology reviews to compile documentation of layout methodology, layout flow and guidelines.
• Self-reliant, with ability to work independently as well as a team.
• Good leadership quality on project management.

The descriptions are for layout engineers for our Library Group. Library Group is a part of Central Engineering Group.

In Library Group, we focus on circuit design for memory, I/O (Input/Output), and Standard Cells.

Requirements:

• Strong layout knowledge with a minimum of 5 years of experience
• Skills include Cadence layout, Cadence schematic capture, using CALIBRE & Hercules verification tools.
• Strong layout knowledge in submicron process, e.g. 16nm, 7nm, 5nm, 3nm etc
• Experienced in digital (standard cell, memory, I/O) layout
• Experienced in analog layout is also a plus

Job Description:

• Responsible to understand and apply all necessary layout guidelines (standard cells, I/O memories), new process rules and other technical requirements for quality layout
• Schedule time-line & layout floor-planning
• Complete quality layout and verification within planned schedule (without supervision for experienced engineer)
• Get up to speed quickly for new methodologies, open to new ideas and communicate well with others in the library team

Skill Set (Mem):

• Strong experience in memory layout design and physical verifications includes LVS, DRC, ERC, Antenna, Electro Migration in CMOS process.
• Experienced in Cadence Layout tools VIRTUOSO (XL,VXL or EXL), and CALIBRE verification tools.
• Good experience in Floor-planning, hierarchy layout and chip integration.
• Knowledge of Script Programming and SKILL Programming would be a plus.
• Able to lead or train a team of junior engineers
• Good knowledge on memory layout topology.
• Experience in memory compiler will be a plus.
• Ability to lead on new technology reviews to compile documentation of layout methodology, layout flow and guidelines.
• Self-reliant, with ability to work independently as well as a team.
• Good leadership quality on project management.

Foundation IP Design Engineer

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS in Electrical or Computer Engineering and 5 years of related experience

Job Description

Foundation IP Design Engineer

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS degree in Electrical or Computer Engineering

Foundation IP Design Engineer

We are looking for energetic and passionate design engineers to join our Central Engineering Group and be part of an elite team responsible for the development of foundation IP for AI products including memory compilers, logic cells and custom macros of all types on the bleeding edge of process technology. We have multiple positions at all experience levels.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

Requires a BS degree in Electrical or Computer Engineering with 2 years of related experience

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

• Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
• Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, etc.
• Schedule, prioritize, & track your work across multiple projects simultaneously
• General flip-chip BGA package design & engineering

EDUCATION/EXPERIENCE & REQUIREMENTS:

• B.Eng (EE/EEE) or similar field and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
• M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
• Knowledge of package-level signal integrity and power integrity, to apply to package designs
• Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.
• Good organizational and task management skills to manage multiple package design projects.

PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:

• B.Eng (EE/EEE) or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.
• M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.

Available Job Responsibilities

• Design and build memory or circuit blocks at the gate or transistor level
• Simulate and analyze the circuit design using transistor level simulators
• Extract the layout and perform post-layout simulations and verification
• Floorplan physical implementation and layout integration of design components
• Integrate characterization flow to extract timing and power information
• Develop scripts to automate characterization flow, simulations, and verification
• Specify and verify various behavioral and physical memory models
• Document the design specifications, behavioral description, and timing diagrams
• Help specify silicon test plan and correlate silicon to simulation data

Preferred Skills

• Good understanding of transistor level circuit behavior and device physics
• Good understanding of signal integrity analysis, EM/IR analysis, and reliability analysis
• Proficiency in running simulators, writing automation scripts, and are tools savvy
• Understanding of memory behavioral and physical models is a plus
• Expertise in memory circuit design is a plus
• Understanding of DFT schemes and chip level integration is a plus
• Good communication, interpersonal, and leadership skills
• Motivated, self-driven and good at multi-tasking
• Passion for solving complex problems and willingness to learn

Qualifications

- BS degree in Electrical or Computer Engineering

R&D engineer position available in design and physical implementation of high performance System-On-Chip ASICs.

• Key competencies required are: Working experience leading team in physical design implementation of large ASICs (100 to 400 million gates complexity).
• Demonstrated ability in providing technical support to customers and managing customer working relationship.
• Demonstrated strong technical hands-on competency in using leading edge physical design EDA tools in projects.
• In-depth CPU architecture/algorithm working knowledge and related physical design implementation knowledge highly advantageous.

Utilize commercial and in-house EDA tools for the design and implementation of 100 ~ 400 million gate integrated circuits in 7nm/5nm/3nm process technologies.

Opportunity to participate in innovation, design flow and methodology development to address challenges of designing into deep submicron processes and state-of-the-art ASIC design for computing and networking products

Qualifications / Requirements

• Degree, Masters or PhD in Electrical/Electronics/Computer engineering with 5 years or more experience in a relevant field.
• Familiarity with one or more VLSI design tools for Place&Route, Verilog Simulation, DRC/LVS Physical Verification, Static Timing Analysis and Power Integrity
• Experience in Perl & Tcl Scripting languages 3. Proficiency in UNIX/Linux is advantageous.

• Create ATE (Advantest SmarTest PS1600) test program and integrate various test functions in test flow to support First Silicon bring up for wafer and package in NPI phase.
• Complete test development, test program transfer and product release at respective milestones.
• Perform design validation/characterization/experiment on ATE across process, voltage, frequency and temperature. Evaluate test and product margins, debug and communicate result/yield/analysis to various teams.
• Support proto demands/ramp, qualification IP owner and customer requests.
• Utilize ATE test tools and other test instrument to debug and analyze the test, design and product issue.
• Support ATE test hardware design/debug and test time reduction.
• Initiate, plan and execute multiple projects to achieve target.
• Good knowledge of product engineering, failure analysis and manufacturing test process.
• Interest in learning, researching, sharing and implementing new technology and test methodology.
• Good written/Oral communication skills.
• Result orientated and team work.

• You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
• You will work closely with package design & technology, test & product engg, production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes.
• Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams.
• Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction.

•Qualifications:

• PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes.
• Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc.
• Good team player, result oriented individual, experienced in project management, failure analysis tools, techniques and TQM. Good analytical, problem-solving skills. Flexible and agile.
• Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment.
• Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice.
• Experienced AutoCAD user. Knowledge of silicon & PCB fabrication, board assembly processes, are an added advantage

Job Description

1) Accounting:

• Support Saudi Arabia, United Arab Emirates and APAC regions on Payroll Accounting activities as part of the APAC Payroll team
• Manage the month-end close process, prepares assigned entries, reconciles assigned accounts, runs financial schedules, prepares variance analysis and follows up/researches questions as needed
• Manage the payroll account reconciliations
• Manage monthly payroll accruals
• Monitor payroll suspense accounts and proper clearance therefrom
• Work closely with Treasury for cash forecasting and other payment analyses
• Partner with Finance to forecast payroll costs
• Collaborate with payroll operations on pay code mapping to general ledger accounts
• Work with cross functional teams on finance projects
• Collaborate with M&A integration team
• Provides support to the accounting team as needed
• Provides support for payroll accounting audits and reviews

2) Payroll:

• Prepare monthly payroll instructions for payroll third party vendors
• Audit payroll results received from third party vendors to ensure accuracy
• Assist with the monthly journal entries and the balance sheet reconciliation queries for payroll accounts
• Manage weekly/monthly/quarterly cash forecasting reporting and other reports for management review and to meet statutory requirements
• Familiarity with and follow SOX controls for the international payroll process
• Assist with payroll and statutory audits as needed
• Prepare year-end documentation as required
• Track new hires, terminations, and employee changes and audit accuracy for respective country payroll results
• Ensure direct deposit and tax details are established for new employees
• Manage payroll tickets for employees
• Prepare and maintain payroll process documentation

The International Payroll Analyst combines technical expertise, project management and employee relations all in one.

You will play a key role in preparing monthly payroll instructions to third party vendors and support internal payroll projects. Working closely with the greater International Payroll team, you will act as a trusted advisor to both third party vendors and internal stakeholders regarding integrated solutions and implementation projects.

The ideal candidate will have a passion for people, payroll, project management, implementation and problem solving. This role requires a self-motivated professional that consistently brings a high level of dedication to projects and the ability to strategically and tactically navigate the unique challenges that innovation brings.

Job scopes include, but are not limited to:

• Prepare monthly payroll instructions for international payroll third party vendors
• Audit payroll results received from third party vendors to ensure accuracy
• Prepare monthly journal entries and assist with balance sheet reconciliation queries for payroll accounts
• Manage weekly/monthly/quarterly cash forecasting reporting and other reports for management review and to meet statutory requirements
• Familiarity with and follow SOX controls for the international payroll process
• Assist with payroll and statutory audits as needed
• Prepare year-end documentation as required
• Track new hires, terminations, and employee changes and audit accuracy for respective country payroll results
• Ensure direct deposit and tax details are established for new employees
• Manage payroll tickets for international employees
• Prepare and maintain International payroll process documentation

• R&D engineer position available in design and physical implementation of high performance System-On-Chip ASICs.

1. Key competencies required are: Working experience leading team in physical design implementation of large ASICs (100 to 400 million gates complexity).
2. Demonstrated ability in providing technical support to customers and managing customer working relationship.
3. Demonstrated strong technical hands-on competency in using leading edge physical design EDA tools in projects.
4. In-depth CPU architecture/algorithm working knowledge and related physical design implementation knowledge highly advantageous.

• Utilize commercial and in-house EDA tools for the design and implementation of 100 ~ 400 million gate integrated circuits in 7nm/5nm/3nm process technologies.
• Opportunity to participate in innovation, design flow and methodology development to address challenges of designing into deep submicron processes and state-of-the-art ASIC design for computing and networking products

Qualifications :

• Degree, Masters or PhD in Electrical/Electronics/Computer engineering with 5 years or more experience in a relevant field.
• Familiarity with one or more VLSI design tools for Place&Route, Verilog Simulation, DRC/LVS Physical Verification, Static Timing Analysis and Power Integrity
• Experience in Perl & Tcl Scripting languages 3. Proficiency in UNIX/Linux is advantageous.

Broadcom Central Engineering is looking for a qualified individual who can provide best-in-class development and support for Analog/Mixed Signal tool flows focused on advanced FINFET process nodes. This individual will be hands-on, heavily involved in day-to-day design/layout issues and in addition, interact with EDA vendors, the PDK development and process technology teams to provide timely solutions, and develop, maintain, and support utilities to improve productivity. If hired, the candidate is expected to be physically located in Broadcom's Singapore facility.

Responsibilities:

The candidate's main responsibilities include the following:

• Support (50%), enhance, and maintain PDKs and various Analog/Mixed-Signal design tools
• Develop software for automation in Skill, Perl, Unix Shell scripting
• Create documentation and provide hands-on training for design and layout engineers
• Work with EDA vendors to track and resolve issues
• Work with Technology Foundry teams (external/internal) to facilitate debugging and proper characterization of all tool related issues.

Requirements:

• Master in Electrical Engineering or Computer Science + 5 years of EDA experience.
• Expertise in the following CAD Tools: Virtuoso Studio 23.1, Cadence ADE-L/XL, Maestro, Spectre, Virtuoso Layout, Quantus QRC, Voltus-Fi APS/EMIR, EMX, and Synopsys Hspice, Primesim, StarRC, Quickcap, and Mentor Calibre/PERC
• Solid background in programming skills, circuit design, and device physics knowledge to help solve circuit design, layout, physical verification, and post-layout extraction challenges and problems. Looking for domain expertise/specialists in RCX, EM/IR , Substrate-Noise/Crosstalk and Aging/SHE circuit-simulation.
• Experience in all phases of CAD tools from evaluation, QA, test, release, and user support to documentation
• Expert in Cadence Skill, Perl, Unix Shell and utilities
• Excellent interpersonal, communication, and presentation skills, along with strong multi-tasking skills, attention to detail, and the ability to work well in a team

• Create ATE (Advantest SmarTest PS1600) test program and integrate various test functions in test flow to support First Silicon bring up for wafer and package in NPI phase.
• Complete test development, test program transfer and product release at respective milestones.
• Perform design validation/characterization/experiment on ATE across process, voltage, frequency and temperature. Evaluate test and product margins, debug and communicate result/yield/analysis to various teams.
• Support proto demands/ramp, qualification IP owner and customer requests.
• Utilize ATE test tools and other test instrument to debug and analyze the test, design and product issue.
• Support ATE test hardware design/debug and test time reduction.
• Initiate, plan and execute multiple projects to achieve target.
• Good knowledge of product engineering, failure analysis and manufacturing test process.
• Interest in learning, researching, sharing and implementing new technology and test methodology.
• Good written/Oral communication skills.
• Result orientated and team work.