Total 288 purchasing engineer job vacancies in Singapore

As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will be managing and optimizing your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor or master’s in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 4 or more years of experience with proven track record of technical leadership in semiconductor manufacturing in Metro Real-Time Defect Analysis Process & Equipment Engineering. Experience in other Front-End areas, in Post Wafer Fabrication & High Bandwidth Memory technology
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill
• Excellent communication skills

Keen on the role? Apply now!

Responsibilities:

• Review, validate and monitor budgets, funds, expenditures, forecasts, and contingency drawdown for respective projects throughout the entire project lifecycle.
• Review cost estimates, develop and maintain forecasts, and cost control plans for assigned projects.
• Track and analyze project expenditures, identifying variances from budgets and recommending corrective actions.
• Conduct cost risk assessments and develop mitigation strategies to minimize budget deviations.
• Support to review and analyze material contracts and contractor subcontracts, ensuring alignment with project specifications and budget parameters.
• Manage and track change orders associated with material contracts and subcontracts, ensuring proper cost control carried out and approval processes is in accordance to Micron’s Construction Management of Change (CMOC)
• Support in reviewing estimate and justification for change according to Micron’s Change Management process.
• Collaborate with project teams across engineering, procurement, and construction disciplines to identify cost-saving opportunities.
• Analyze financial data to identify trends, discrepancies, and opportunities for cost savings, presenting findings to management and recommending actions.
• Monitor and verify project costs, including materials, labor, and equipment, ensuring accurate cost allocation based on Work Breakdown Structure (WBS) and financial reporting.
• Carry out regular updates to WBS dictionary and ensure standardization is effectively used throughout the project.
• Prepare comprehensive cost reports and presentations for project stakeholders. Maintain a strong understanding of cost control principles and best practices within the semiconductor industry.
• Utilize cost control software and tools to manage project financials effectively.
• Implement and oversee cost auditing processes to ensure compliance with company policies and financial regulations, identifying and resolving discrepancies.

Qualifications:

• Bachelor's degree in Engineering, Construction Management, Quantity Surveying, Finance, or a related field.
• 7 to 10 years of working experience in the Construction Industry
• Minimum 3+ years of experience in cost control, preferably within the semiconductor industry or a similar capital projects environment.
• Strong understanding of cost estimating, budgeting, and forecasting methodologies.
• Excellent analytical and problem-solving skills.
• Proficient in Microsoft Office Suite (Excel, Word, PowerPoint) and cost control software.
• Meticulous attention to detail and a strong work ethic.
• Excellent communication and interpersonal skills, with the ability to collaborate effectively with diverse teams.

Preferred Qualifications:

• Experience with Contingency Drawdown management and Quantitative Cost Risk Analysis (QCRA)
• Experience with Earned Value Management (EVM) principles.
• Knowledge of semiconductor manufacturing processes and equipment.

This is an exciting and fast-paced position! Our team Application Development & Support(ADS) delivers software solutions to leadership and engineers throughout Micron's global manufacturing network. As Operations Central Team (OCT) Software Development Engineer at Micron Technology, Inc., we have the chance to create and improve Micron systems and processes on a global scale.

We will collaborate with customers across departments and geographical sites to design, develop, innovate and support software throughout the development life cycle. Be part of the team to support efficient business processes by maintaining a focus on global alignment, and participating in efforts to research and influence technology roadmaps.

Responsibilities include, but not limited to:

• Demonstrate Micron core values People, Innovation, Tenacity, Collaboration, and Customer Focus
• Collecting requirements from customer requests
• Designing, developing, debugging, documenting, testing, and deploying applications
• Collaborating with other developers on the team
• Working closely with Business Operation Teams, Product and Application Development teams, and other internal customers during application development and deployment
• Training users on the use and maintenance of new applications

Project Description

• Join an agile team as one of the developers to develop a web solution for Micron globally including, but not limited to, API, ETL, and database
• Can be a new or existing running projects

Learning Outcomes

• Gain hands-on development experience in modern tools and pioneering tech stacks (Angular, OpenShift, Azure)
• Learn to work effectively in the IT agile development team to develop successful product with timely delivery
• Gain domain knowledge on semiconductor industry
• Learn problem-solving and analytical skills and good software engineering practices
• Develop communications, interpersonal, and other critical skills in the professional environments

Pre-requisites

• Proficient in Angular, .NET Core, C#, and SQL
• Knowledge of containerized deployment with Docker, Kubernetes, and OpenShift a plus.

Traits

• Strong analytical, problem solving, and interpersonal skills
• Motivated to work in dynamic and fast-paced environment
• Ambitious and driven to complete tasks independently while recognizing ways to improve processes
• Active team participation, partnership, and consensus-building skills
• Good verbal and written communication skills

Responsibilities

• Implements full software development process
• Collaborates multi-functionally with business users, project managers and other engineers to achieve elegant solutions.
• Develops high quality and innovative software design and solutions.
• Provides ongoing documentation, maintenance, support and improvements in existing systems and platforms.
• Provides 24x7 Support

Education Required

Bachelors Degree or equivalent experience in Computer Science or related field of study

Experience Required

3 years experience in 3 or more of the following:

• Experience in front-end web development (preferably Angular, ASP.NET)
• Proficiency in C# and Object Oriented Programming
• Proficiency in HTML, CSS, JavaScript
• Experience in RESTful Web API development (preferably ASP.NET Core, Node.js)
• Experience with Agile development methodologies
• Good understanding of one or more database technologies (MSSQL, ORACLE, Snowflake, MongoDB, CouchDB)
• Experience in SSIS, SSRS, Tableau, PowerBI or any Business Intelligence technologies Bonus if you have experience in Python and cloud programming, CICD (Azure), NiFi
• Knowledge of source code repositories (Git)
• Knowledge of SQA is a bonus

Working Location

1, North Coast Drive, Singpaore 757432

As Satellite Planning Engineer, you are responsible to work with the various central and site stakeholders to conduct strategic scenario and capital planning analysis. You will be closely involved in the Fab Scenario Optimization Study, Business Plan, Supply Chain and key processes such as Supply & Operation Planning (SnOP) and Model of Record (MOR).

This role requires flexibility and ability to maintain global relationship; good communication and presentation skills; and ability to provide clear and qualitative data analysis for the upper management to support decision making. You should possess detailed understanding on capacity planning, business process, and identifying opportunities to support scenario optimization.

Responsibilities and Tasks:

[Scenario]

• Apply optimization concept and technique to ensure optimal loading volume across horizon able to meet target bit (GB) and market share while considering new technode qual milestone and ramp planning.
• Apply industrial engineering concepts to model the capacity thresholds to support existing and future technology
• Ensure all the required scenario options are well analyzed. Call out opportunity and propose options for better return scenario
• Collaborate with Central teams to plan capacity requirements of future products and to quantify the impact on existing and future capital spend
• Using qualitative and quantitative analysis to explain scenario cause – effect relationship for tooling purchase and capital impact differences
• Provide yellow field cost of transition (CoT) for each technode and understand the correlation between theoretical CoT vs actual CoT
• Defining new technode CoT and understand the gap between budget vs actual technode capex
• Adhere to calendar requirements and agreements with respect to Business Planning Process
• Flexible and agile to changes in Business Planning
• Coordinate with all relevant stakeholders to ensure all the parameters updates are in-place so that can be utilized correctly for quarterly business plan study
• Create, Maintain and update Satellite Sharepoint
• Strive to streamline business efficiency and eliminate manual errors
• Manage complex projects across several different departments and sites
• Manage databases, scenario ownership and change control
• Analyze data to support financial decisions

​

[Capital]

• Perform baseline capital spend analysis to ensure overall cashflow across FY is kept neutral (unless driven by Scenario change)
• Improve capital spend forecast accuracy with site Planning/Procurement/Facilities
• Monitor actual spend performance vs projection for current and upcoming quarter with target variance of < +- 5%
• Monitor and understand with site stakeholders on the reasons for unexpected capital spend changes across fiscal year
• Work with site stakeholders to ensure accurate planning and supplier delivery date data inside Capital Asset Lifecycle Management (CALM
• Highlight any potential cashflow reduction or savings opportunities
• Keep track of the technode capex
• Work with site stakeholders to ensure actual scenario change bottoms up and eventual itemization is as per approved executive review targets
• Coordinate the CALM simulations with site stakeholders and ensure the simulations are able achieve net neutral and completed within committed timeline

Requirements:

• Master/Bachelor's degree in industrial engineering, manufacturing engineering, mechanical engineering, chemical engineering, computer Science
• Strong ability to perform data analysis and problem solving
• Strong data validation skills and reporting skills
• Ability to map relevant conclusions to support decisions making
• Ability to work closely and effectively with others in a team environment
• Strong verbal communication and presentation skills
• Exceptional customer focus
• Knowledge and practical application of statistics, data analysis and problem solving
• Independence and high determination to complete tasks in a timely manner

Probe Test Solutions Engineer will develop and maintain wafer level test programs to test functionality of NAND Flash products.

As a Probe Test Solutions Engineer, you will develop and maintain wafer level test programs to test functionality of NAND Flash products.

The general responsibilities of the position include but are not limited to the following:

• Develop and maintain wafer level functional test strategies and programs for semiconductor NAND Flash products
• Collaborate with various engineering and production groups to ensure test program, infrastructure and system readiness for new product introduction as well as high volume manufacturing
• Improve device yield, reliability and quality through test condition optimization, advanced redundancy analysis schemes, data analysis and test equipment hardware optimization
• Provide cost effective and innovative solutions for production test flow optimization with cutting-edge test time reduction methodologies
• Develop and release test programs to production in a timely manner
• Assist process and production teams by providing necessary engineering expertise to ensure smooth manufacturing operations

Requirement:

• Bachelors/ Masters in Electrical/Electronics/Computer Engineering or equivalent
• Showcases good programming skills and experience; Python/C/C++ knowledge
• Solid analytical problem-solving skills
• Excellent verbal and written communication skills
• Good understanding of semiconductor industry and semiconductor device physics
• Knowledge of Unix/Linux environment will be an added advantage
• Keen on semiconductor industry

Directs and coordinates engineering activities concerned with development, procurement, installation, and calibration of instruments, equipment and control devices. Determines conditions under which tests are to be conducted, and phases of test operations. Coordinates operational, functional and performance phases of tests. Analyzes and interprets test data. Prepares technical reports of for use by engineering personnel.

This role is within Package and Development Engineering (PDE) group of Micron. This is a global department with teams located in USA, Singapore, Malaysia, Taiwan, and India. As a PDPE (Package Device Product Engineer) in PDE, you will be responsible to prepare for new DRAM, NAND or MNAND products and coordinate resources, testing, and analysis over the lifecycle of the product. You will run data analysis and modelling, create, and maintain root cause analysis documentation, analyze parametric, probe level (Front End) and electrical test (Back End) data and respond to failures. In this role, you will work with various Technology Development (TD) & New Product Introduction (NPI) Engineering (Electrical Failure Analysis (EFA), Physical Failure Analysis (PFA), Assembly) and Manufacturing groups to find the root causes of the failed units.

Responsibilities and Tasks

• Enable new test signals in BE which would capture assembly related failures.
• Work with Test Solution Engineering (TSE) & Product Engineering (PE) to ensure standardize test coverages & chars. Define Char limits, and approval of any test related changes.
• Development of new out-of-control-action-plan (OCAP) and its sustenance
• Provide Lot disposition based on parametric data observation in case of out-of-control (OOC) trigger.
• Ensure that Silicon & assembly process meets Product expectations by extracting and analyzing Probe and BE test data.
• Participate in Phase Gate review meetings, presenting the data analysis and deciding on Phase Gate exits related to electrical Test data.
• Analyze test failures, coordinating EFA & PFA to identify the root cause. Implement fixes for fails (Fab process or Design or Assembly Process)
• Finding out the correlation of test failures to assembly process and updating the database with the signatures observed
• Support Global and Local material review board (MRB) in case of excursions and RMA related to package intrinsic design. This includes analyzing electrical test data for root cause analysis (RCA) and assessing the health of the contained material.

Requirements

• Bachelors/ Masters in Electronics, Device Physics, Applied Physics, Electrical
• Sound knowledge of device physics
• Knowledge in Engineering Statistics
• Experience in data (electrical) analysis and modelling (JMP, Spotfire is a plus)
• Experience in programming (Python or Perl)
• Effective communication skills in written and spoken English
• Good multitasking and organizational skills, able to make decisions in complex situations
• Excellent problem solving and analytical skills
• Experience in NAND / DRAM memory or related field
• Knowledge in semiconductor packaging assembly processes
• Experience in fabrication processes, electrical characterization techniques, metrology techniques

Job Description

As a Senior / Principle Engineer in PDE (Package Development Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will be managing and optimizing your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor / masters in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 4 or more years of experience in Semiconductor Manufacturing with proven track record of technical leadership in semiconductor manufacturing, preferably in MRDA Process & Equipment Engineering. Experience in other Front-End areas, in PWF & HBM technology is of greater advantage.
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Job Description:
As Frontend Central Product Integration Engineering (CPIE) team at Micron Technology, Inc., you will be responsible for leading new initiatives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with the highest quality and fastest speed through innovation and collaboration with mutli-functional teams. Your primary focuses include but not limited to:

• Initiate new data solutions and methodologies to:
1) identify process, test, and design improvement opportunities;
2) modeling, monitoring and aiming for tool performance benchmarking;
3) Process equipment prognostics and process integration optimization;
4) Identity test optimization opportunities for high product grade yield improvement.
• Collaborate with site Process & Equipment Engineering, Manufacturing(MFG), Product Integration Engineering (PIE) and Data Science (DS) team to establish feasibility of new initiatives, demonstrate business values, and prototype solution mock-ups;
• Partner with Global Quality (GQ), Product Engineering (PE), Central PEE(CPEE), Smart Mfg Artificial Intelligent (SMAI), Technology Development (TD), and Suppliers to deliver end to end solutions, implement BKM development and deployment to production.

Collaboration

• Partner closely with multi-functional teams to ensure successful communication and collaboration for project implementation.
• Detail oriented with the ability to work independently
• Dependability and able to work effectively in multi-functional teams.
• Facilitate and lead activities in redefining and optimizing current system, methods, tool, skill to be Best In industry.
• Manage priorities and enhancements to improve business processes and existing systems that are global in nature.
• Willingness to work during non-standard hours when needed to provide support to engineering teams at any Micron site.
• Strong growth mindset and willing to continue to learn, unlearn, relearn.

Communication

• Effective communication skills in verbal/written.
• Self-motivated. Able to work independently with minimal supervision.
• Able to travel as required to support department and company objectives.

Requirement and Technical Competency:

• Experience in PIE, Process & Equipment Engineering and Data Science. Understanding of Process/Product Integration will be advantageous;
• In depth knowledge of processes, equipment and control system;
• Proficiency in data analytical tools such as Y3, JMP, Python to perform numerical experiment. Proficiency in Statistical/Machine Learning will be additional advantageous;
• Proven track record to make decisions, multi-task, and solve problems and address root causes.
• Exhibit critical thinking to find opportunities.
• PhD/Masters/Bachelors with relevant course of study and experience

As a Senior Package Design Engineering (PDE) Central Engineering System and Analytics (CESA) Engineer, you will develop integrated solutions to empower Backend Operations to make data-driven and heuristics-based decisions. You will work across Global Operations and sites to improve Cost, Scale, Quality, and Cycle Time by defining and designing data architecture and collaborating with key partners.

Responsibilities

• Yield Enhancement (YE) lots analysisLead YE lot analysis including reconstructing fuse identififaction (FID) for traceability, statistic comparison for different group
  
• Yield modelling / pareto benchmarkingIdentify actionable opportunities from YE lots
  Develop and improve Yield Models for HBM
  Periodically improve models based on actual performance
  
• Best Known Methods (BKM) DeploymentDevelop BKM’s for YE and drive implementation
  Identify/align BKMs and monitor implementation
  Works with different teams in the identification of critical metrics

Requirements:

• PhD/Masters/Bachelors in Statistics, Mathematics, or a related field; advanced degree preferred.
• Minimum of 3 years of experience in semiconductor manufacturing or related fields
• Preferably with experienced in Package Design Engineering and Yield Enhancement
• Strong understanding and knowledge of semiconductor manufacturing processes and technologies.
• Proficiency in statistical/machine learning and statistical techniques skills will be additional advantageous;
• Experience in MRDA will be a plus
• Proven ability to make decisions, multi-task, and solve problems and address root causes.
• Exhibit critical thinking to see opportunities.
• Effective communication skills in verbal/written.
• Self-motivated. Able to work independently with minimal supervision.
• Able to travel as required to support department and company objectives.

Responsibilities include, but not limited to:

• Responsible for in-depth data analysis to look for sighting that is detected from reliability testing on certain cell marginality.
• To work closely with cross functional team to drive for cause, cell mechanism understandings and mitigation plan (device and process) when sightings of cell marginality are noted.
• Look into volume reliability data to probe data correlation to look for signals for cell metrics/kill limit recommendation to guardband intrinsic reliability capability.
• Enable proactive methodology for cell reliability analytic study on both die and wafer level assessment using advanced product-dispo techniques.
• Enable proactive methodology for defectivity (DPM) reduction at wafer level using advanced product-dispo techniques.
• Develop state-of-art and advanced algorithms, encompassing advanced models to boost and enhance data-mining and pattern recognition for quality and yield improvement.
• Work with Product/Fab/Engineering teams on product issues (yield/cell/qualification/defectivity/RMA/deviations) in problem analysis, data-mining and modeling, to provide optimal disposition solution.
• Implement and validate product-dispo solution with minimal yield impact and to track effectiveness of solutions.
• Develop understanding of test flows and product-dispo framework and make use of big Data to highlight strength and weaknesses in production process and improve quality of material produced with lower cost and faster cycle time.

Minimum Qualifications:

• Bachelor in Electrical Engineering.
• Strong drive and excellent written and verbal communication skills, including ability to effectively communicate complex technical ideas/concepts.
• Knowledge of Python/MySQL/ C programming will be an added advantage.
• Strong analytical and problem-solving skills, with the ability to find creative solutions to difficult problems
• Effective communication skills in written and spoken English
• Good multitasking skills and ability to set priorities in a fast moving, dynamic environment
• Self-motivation and enthusiasm

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS Front end/interconnect module. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

Product Integration Engineering team strives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with highest quality and fastest speed through innovation and collaboration with multi-functional team. With the diversity of technology in DRAM/NAND and geography (TD development sites – Boise/Japan, 5 manufacturing sites – US (F6), Taiwan (F11/F16), Japan (F15) and Singapore (F10)), Frontend Central PIE team will be responsible to identify best-known-method holistically, align best-known-method timely and implement improvement systematically across the network. As FE Central PIE Standardization & Metrics Senior Engineer you will be responsible to lead the the team on:

• Drive for alignment and standardization across various fabs on Best-Know-Methods (BKMs)
• Develop Metrics to measure the standardization, sustainability, scalability and synchronization of the BKMs.
• Identify gaps in current programs and use SMART metrics to drive effectiveness and efficiency on program deliverables.
• Transform yield SEAL and SWATs to achieve cPIE missions, improving network resource/talent leverage.
• Constantly drive productivity and eliminate inefficiency / ineffectiveness through metrics and reports automation, drive data to be accurate, accessible and comprehensive.
• Collaborate with various multi-functional teams on yield reports, develop business process to optimize current system with clear roles and responsibility.
• Promotes cPIE teams alignment and collaboration with crtical metrics /metrics definition.
• Collaborate with WFD to standardize network PIE training curriculum, connect with cPIE and network PIE to build training courses.
• Develop human resource strategies to attract, retain and reward talent and effectively deploy them to enhance every individual’s potential
• Engage team members and drive accountability, performance driven culture through clear communication, formal and informal feedback, goals and critical metric
• Drive diversity, equality, and inclusive working environment and foster teamwork and trust in the organization
• Effectively manage team’s internal and worldwide meeting structure. Ensure meetings are efficient, effective and targeted to achieve required outcomes.
• Maintain knowledge of equipment and materials safety concerns. Take a proactive approach to safety, and apply corporate and site safety resources for partner concern issues as appropriate.
• Maintain a strong and open relationship with peer group and managers in other functional areas within CPIE and outside organizations such as Fab, FE PMO/SIC/OCT and Global Quality.
• Travel to Micron sites as necessary for face to face collaboration.

Requirements:

• Bachelor’s Degree in Engineering and related field of study
• 2 years experience in engineering field
• Applicants must have a proven ability to collaborate globally and influence by indirect leadership to drive resourcing to critical projects across Micron
• Applicants must have a proven capability in dealing with complexity and an ability to use resources effectively to bring clarity to required actions
• Applicants must hold a record of performance excellence for current area of responsibility; and are recognized as having demonstrated successful leadership characteristics both in present and past jobs
• Applicants must have demonstrated the ability to solve problems across multi-functional groups, both within and outside their department/Site

Description

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Diffusion team on the key technology issues that need Technology Development (TD) breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise TD Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.
• Ownership of module business process

Requirements

• PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Physics are welcomed to apply.
• Minimum 4 years of relevant experience in Diffusion process development.
• A deep understanding of flow dynamics , thermodynamics, physical phenomena and their direct application to Diffusion deposition in various deposition methods.
• An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects.
• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 2 - 4 months at a stretch to work on technology development.

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide alignment

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

Requirements

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

Keen on the role? Apply now!

This is an exciting and fast-paced position! Our team Application Development & Support(ADS) delivers software solutions to leadership and engineers throughout Micron's global manufacturing network. As Operations Central Team (OCT) Software Development Engineer at Micron Technology, Inc., we have the chance to create and improve Micron systems and processes on a global scale.

We will collaborate with customers across departments and geographical sites to design, develop, innovate and support software throughout the development life cycle. Be part of the team to support efficient business processes by maintaining a focus on global alignment, and participating in efforts to research and influence technology roadmaps.

Responsibilities include, but not limited to:

• Demonstrate Micron core values People, Innovation, Tenacity, Collaboration, and Customer Focus
• Collecting requirements from customer requests
• Designing, developing, debugging, documenting, testing, and deploying applications
• Collaborating with other developers on the team
• Working closely with Business Operation Teams, Product and Application Development teams, and other internal customers during application development and deployment
• Training users on the use and maintenance of new applications

Project Description

• Join an agile team as one of the developers to develop a web solution for Micron globally including, but not limited to, API, ETL, and database
• Can be a new or existing running projects

Learning Outcomes

• Gain hands-on development experience in modern tools and pioneering tech stacks (Angular, OpenShift, Azure)
• Learn to work effectively in the IT agile development team to develop successful product with timely delivery
• Gain domain knowledge on semiconductor industry
• Learn problem-solving and analytical skills and good software engineering practices
• Develop communications, interpersonal, and other critical skills in the professional environments

Pre-requisites

• Proficient in Angular, .NET Core, C#, and SQL
• Knowledge of containerized deployment with Docker, Kubernetes, and OpenShift a plus.

Traits

• Strong analytical, problem solving, and interpersonal skills
• Motivated to work in dynamic and fast-paced environment
• Ambitious and driven to complete tasks independently while recognizing ways to improve processes
• Active team participation, partnership, and consensus-building skills
• Good verbal and written communication skills

Responsibilities

• Implements full software development process
• Collaborates multi-functionally with business users, project managers and other engineers to achieve elegant solutions.
• Develops high quality and innovative software design and solutions.
• Provides ongoing documentation, maintenance, support and improvements in existing systems and platforms.
• Provides 24x7 Support

Education Required

Bachelors Degree or equivalent experience in Computer Science or related field of study

Experience Required

3 years experience in 3 or more of the following:

• Experience in front-end web development (preferably Angular, ASP.NET)
• Proficiency in C# and Object Oriented Programming
• Proficiency in HTML, CSS, JavaScript
• Experience in RESTful Web API development (preferably ASP.NET Core, Node.js)
• Experience with Agile development methodologies
• Good understanding of one or more database technologies (MSSQL, ORACLE, Snowflake, MongoDB, CouchDB)
• Experience in SSIS, SSRS, Tableau, PowerBI or any Business Intelligence technologies Bonus if you have experience in Python and cloud programming, CICD (Azure), NiFi
• Knowledge of source code repositories (Git)
• Knowledge of SQA is a bonus

Working Location

1, North Coast Drive, Singpaore 757432

Project Description

• Join an agile team as one of the developers to develop a web solution for Micron globally including, but not limited to, API, ETL, and database
• Can be a new or existing running projects

Learning Outcomes

• Gain hands-on development experience in modern tools and cutting-edge tech stacks (Angular, OpenShift, Azure)
• Learn to work effectively in the IT agile development team to develop successful product with timely delivery
• Gain domain knowledge on semiconductor industry
• Learn problem-solving and analytical skills and good software engineering practices
• Develop communications, interpersonal, and other critical skills in the professional environments

Pre-requisites

• Proficient in Angular, .NET Core, C#, and SQL
• Knowledge of containerized deployment with Docker, Kubernetes, and OpenShift a plus.

Traits

• Strong analytical, problem solving, and interpersonal skills
• Motivated to work in dynamic and fast-paced environment
• Ambitious and driven to complete tasks independently while recognizing ways to improve processes
• Active team participation, partnership, and consensus-building skills
• Good verbal and written communication skills

As a Facilities Mechanical Engineer, you will be leading engineering and maintenance works in the fields of Mechanical equipment and system on site, to achieve continual improvement to system robustness, reliability and efficiency with the necessary guidance and direction from Facilities organization, to achieve facilities department, site, facilities corporate and company goals.

Job Responsibilities

• Plan and implement preventive and corrective maintenance programs for Facilities mechanical systems including HVAC, exhaust systems, scrubbers, process cooling water, chillers, boilers, cooling towers, compressed air systems, Fire protection system and cleanroom air systems to ensure maximum equipment uptime and reliability.
• Plan, design and lead mechanical system expansion projects to facilitate tool utilities demand of future technology of manufacturing equipment.
• Plan, design and lead mechanical engineering projects includes new construction, system upgrading and quality improvement.
• Respond and problem solving of system issues and production interruptions to mechanical related systems.
• Perform capacity tracking and planning for mechanical systems.
• Enforce to company’s environmental safety health policy and procedure, standard operating procedure with risk assessment, good housekeeping standard and quality policy when performing work.
• Apply computer base software to document and analyses records of maintenance work order, equipment history and project tracking.
• Maintain maintenance record for system fault history traceability.
• Proficient in quality tool such as 8D & 5 WHY analysis for troubleshooting or incidents.
• Initiate and lead energy savings & sustainability projects.

Job Requirements

• Bachelor’s degree in Mechanical engineering.
• Design and Engineering background of mechanical system such as HVAC system and Exhaust system will be of good advantage.
• Ability to understand and use schematic, single-line drawing and related equipment and system documentation.
• Ability to work in a team environment with various professional level.
• Considerable knowledge and application of problem solving and data analysis methodology.
• Considerable knowledge of maintenance practices and procedure and installation work.

As the Global FE Layout Senior Engineer at Micron Technology, Inc., you will be part of Micron’s Global Factory Automation team which is responsible for designing Micron’s next generation manufacturing facilities.

Your objective is to develop full factory tool layout models that will be the basis of design for industry leading manufacturing facilities across the globe. You will be part of a diverse group of highly skilled layout professionals who are responsible for tool layout design, construction design support, and the layout business process. In addition, you will partner with Micron’s Technology Development team to develop innovative semiconductor production tools that deliver word-class, trail blazing, capabilities that solidify Micron’s manufacturing leadership.

Primary Responsibilities

• Generate Layout models for Micron’s U.S. manufacturing sites that meet or exceed established critical metric targets.
• Establish Layout requirements during Micron’s quarterly business plan reviews.
• Collect and analyze Layout date for Micron’s manufacturing sites to find opportunities for improvement, recommend design changes, and identify new processes that will improve Micron’s overall manufacturing efficiency.
• Maintain a Layout data repository (SharePoint) that can be demonstrated for historical validation as well as information sharing across multiple departments.
• Collaborate with the Technology Development team to influence the design of future process equipment that enable improved space efficiency.
• Actively engage and contribute to Micron’s environmental sustainability projects.
• Present your layout designs and recommendations to Micron’s Senior Leaders and Executive team.

Requirements

• Bachelor’s Degree in related field or equivalent professional experience (MS Degree Preferred)
• Five years’ specific and confirmed experience
• Expert proficiency using AutoCad, BIM, Revit, Factory Design Utility and other similar Layout software applications.
• Direct experience with process equipment and facilities design.
• Fluent in English both verbal and written.

Working Location : Micron Fab10

As a Quality & Reliability Assurance Engineer in Global Quality, we are encouraged to conduct electrical failure analysis and data analysis of next-generation 3D NAND memory devices. To sustain and improve Micron's memory quality, and developing outgoing monitor strategies together with risk assessment and product disposition in deviation management in HVM (high volume manufacturing( environment.

Responsibilities and Tasks

• Develop outgoing quality and reliability monitor strategies of NAND products in production phase.
• Perform product failure analysis on rejects to identify the failure mode and mechanisms that will lead to successful corrective actions and/or preventive actions.
• Assist and consult on post qualification quality and reliability issues and assist in the analysis and disposition of these materials.
• Coordinate with Research and Development and Product Engineering teams to comprehend new reliability issues and how to test for and assess their impact to customer risk and reliability.

Requirements

• Excellent problem-solving and analytical skills with strong attention to details.
• Ability to communicate clearly and concisely both verbally and in writing is essential in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work optimally in cross-functional teams and handle pressure situations in a professional manner.
• Candidates with at least 2 years of experience in the semiconductor industry as QRA or Product Engineer are preferred but fresh graduates are welcomed to apply. Experience in flash memory debugging and failure analysis is a plus.
• Bachelor's or Master's degree Electrical Engineering, Electronics Engineering, or a related discipline.

Job Responsibilities

• Disposition of Fab lots affected by planned or unplanned deviations (including those from Special Work Requests and Fab Conversions, or from Quality Deviations and Excursions).
• Work closely with Fab partners to identify and contain excursion material. Initiate and lead multi-functional MRB (Material Review Board) to conduct risk assessment and decide upon disposition of excursion material.
• Review and analyze proposed process conversion changes to ensure that the proposed manufacturing changes conform to current business standards, improve Micron’s competitiveness in terms of wafer yields and costs, and protect Micron’s product quality.
• Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products.
• Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations.
• Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when necessary.
• Ensures that established manufacturing inspection, sampling and statistical process control procedures are followed.
• May assure compliance to in-house and/or external specifications and standards, such as GMPs and ISO regulations.
• Evaluates and analyzes the efforts in organizing, documenting, and interpreting inspection support documents and records.

Requirements

• Bachelor's Degree in Electrical or Chemical Engineering, Material Science, Physics and 3+ years of semiconductor industry experience
• Knowledge of Electrical and Physical Failure analysis of semiconductors
• Knowledge of semiconductor memory product and reliability testing
• Strong understanding of NAND FLASH operation and structure
• Intermediate understanding of wafer fab manufacturing process steps, functional probe and parametric testing methodologies
• Excellent statistical data analysis, troubleshooting and decision making skills
• Proven track record to work effectively in both an independent role and in team environments
• Excellent multi-tasking and problem solving skills
• Intermediate PC skills including MS Office Word, Excel and PowerPoint
• Ability to clearly communicate data and findings both verbally and in writing.

As a Senior DDQA (Development and Design Quality Assurance) CMOS Reliability Engineer, you will be primarily responsible for developing and optimizing quality and reliability criteria related to CMOS process for the next generation of Micron's memory parts. You will be partnering with Technology Development (TD) on latest products and technologies related to CMOS Front end/interconnect module and define quality and reliability fail modes especially NUDD (New, Unique, Different, Difficult) with goal to mitigate risk and achieve product qualification milestone successfully. You will also be required to identify, diagnose, and resolve CMOS related problems by applying failure analysis, FMEA or 8D methodology. In this position, you will be working in a highly collaborative atmosphere, interacting with various groups such as Technology Development (TD), Process Integration, electrical and physical failure analysis, Product Engineering, Quality Reliability Assurance Team to develop product that meets Quality and Reliability specs and requirements.

Responsibilities include, but not limited to:

• Drive new CMOS devices or modules for the future technology of NAND from Product Quality and Reliability perspective.
• Define & implement Reliability test methodology for validating the risk of new CMOS module for the next generation of Micron's memory parts.
• Provide insights and guidance to the Global Quality (GQ) management team on topics involving CMOS.
• Interact and collaborate with Design Team, TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Develop/re-define inline and electrical critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Characterize and validate new CMOS device, models, and test structures for developing future NAND products.
• Develop, establish new CMOS Param or optimize scribe design for CMOS parameters.
• Collaborate with various stakeholders and provide DDQA independent assessment on Quality & Reliability items in various technology development milestones (EPP, SVC, MSC, VME), escalate issues and collaborate for timely risk mitigation and resources, also provide inputs for Leaderships in making decision on passing the Qual milestone (Low Tier Qual/High Tier Qual/Auto Qual etc).
• Support technology transfer to production facilities (some international travel may be required).
• Partner with multiple stakeholders in Process Conversion Review Board Meeting (PCRB) to improve coverage from various aspects of product quality and reliability and prevent post qual escapes or excursion triggered by conversion.
• Identify gaps and drive initiatives/programs/business process to build margin around structural, electrical, and reliability performance.
• Build Product Fail Modes Repository based on NUDD (proactive) and previous issues (reactive), and work with key stakeholder to prevent issues or implement effective detections controls and containment.
• Deliver a new Product Fail Modes Repository and their Effective Detection Controls and Containment Document to meet technology development and Transfer timeline.
• Partner with Manufacturing (MFG) or Central Quality teams on current high-volume products to sustain and further develop the Product Fail Modes Repository through regular refresh meeting.

Minimum Qualifications:

• 4+ years’ experience in semiconductor related engineering.
• Hands-on experience on advanced CMOS engineering and device reliability, integration or characterization, specialized in Microelectronics and Semiconductor Device Physics is a requirement.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Understanding of Reliability items for CMOS and Array
• Understanding of electrical specifications, Probe and Param registers
• Knowledge of 3D NAND Fab processes, flow and common reliability and yield fail modes is preferred.
• Highly skilled at problem-solving activity and capability of leading cross functional team.
• Understanding on technical risk assessment, FMEA, and 8D methodology for root cause analysis and problem solving.
• Effective verbal and written communication skills in English.
• Good multitasking skills and ability to set priorities in a fast moving, dynamic environment.
• Ability to work independently, with minimal direction, and a focus on meeting commitments.
• Real passion for improving product quality to increase customer satisfaction.

Education and Experience:

• Bachelor’s degree or higher in electrical or electronics engineering, physics, chemistry, mechanical engineering, material science, or other applied engineering discipline.

As the Equipment Supplier Quality Principal Engineer, you will lead a global team to ensure the highest quality standards for equipment supplied to our company. You will be responsible for establishing and maintaining strong relationships with critical suppliers, managing supplier quality governance processes, and driving continuous improvement programs. This role requires collaboration with various departments, including development, engineering, manufacturing, and procurement, to meet the business needs and ensure supplier compliance with quality management systems.

Key Responsibilities:

• Lead and manage a global team of Supplier Quality Engineers to achieve best-in-class supplier quality performance.
• Establish and maintain close relationships with critical suppliers' management teams and internal stakeholders.
• Ensure consistent management and deployment of quality requirements and supplier quality governance processes.
• Drive continuous improvement programs with critical suppliers to enhance quality performance.
• Ensure suppliers deliver the highest possible quality materials and comply with Quality Management System (QMS) requirements, standards, and other quality safeguard programs.
• Conduct regular audits and assessments of supplier processes and quality systems.
• Develop and implement supplier quality metrics and performance monitoring systems.
• Collaborate with development, engineering, manufacturing, and procurement teams to resolve quality issues and implement corrective actions.
• Provide training and support to suppliers on quality standards and requirements.

Qualifications:

• Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
• Minimum of 8-10 years of experience in supplier quality management, preferably in the semiconductor or electronics industry.
• Strong knowledge of quality management systems, standards, and methodologies.
• Proven experience in leading and managing a global team.
• Excellent communication and interpersonal skills.
• Strong analytical and problem-solving abilities.
• Ability to work effectively in a fast-paced and dynamic environment.

Preferred Qualifications:

• Master's degree in a related field.
• Certification in quality management (e.g., Six Sigma, ISO 9001).
• Experience with supplier quality management in a multinational corporation.

As a FE Global PLN Strategic & Modeling Engineer at Micron, you will have a unique opportunity to contribute to Micron's strategic goals and company growth by providing business planning support and forming modeling approach to analyze strategic scenarios. You will collaborate closely with various teams including Network Planning, Market Intelligence, Supply Chain, Finance, Procurement, and TD to understand different information and metrics that affects our loading plan and translating them into structured model to support analysis and decision making.

Responsibilities:

• Understand high-level factory limitations and benchmarking to determine the most efficient capital utilization.
• Demonstrate expertise in computer, and Microsoft Office skills to extract data and develop executive presentations effectively. Expertise in planning systems and applications will be a plus.
• Support capacity studies for special projects such as site selections for future fab expansions and new emerging product deployments.
• Apply industrial engineering concepts to model the capacity thresholds to support existing and future technology
• Efficiently manage capital expenditure scenarios and cash flows through comparison and optimization.
• Collaborate with the finance team to perform comprehensive financial analysis across different scenarios, which includes evaluating manufacturing costs, payback period, Net Present Value (NPV), and Profit/Loss (P/L) analysis.
• Provide and evaluate scenario options to improve financial bottom line.

Requirements:

• Required: Bachelor's degree in Industrial Engineering, Production Operations Management, Information Systems, Computer Science, Process Engineering, or equivalent experience in the field.
• Minimal 2 years experiences in Semiconductor Industry, or other Industry planning modeling equivalent function experience.
• Knowledge and practical application of statistics, data analysis, and problem-solving.
• Knowledge of Manufacturing Science, including lean manufacturing, factory constraints, and other relevant factors.
• Experience working collaboratively in diverse teams.
• Strong focus on meeting the operational needs of the Fabs and effectively communicating those needs to different parties involved.
• Ability to influence decision making in various team meetings.
• Ability to communicate effectively through multiple levels of management and organizations.
• The ability to multi-task efficiently.
• Willingness to work flexible hours as required.
• Strong written and verbal communication skills.

As a Wet Chemical and Specialty Chemical Global Supplier Quality Engineer, you will be responsible to support the overall metrological alignment strategy, execution plans and excursion prevention programs to develop Suppliers through Continuous Improvement Programs to ensure advance metrology is constantly applied to materials procured materials/services to Micron. You will work in close partnership with key stakeholders such as Global Quality, Global Procurement, Global Manufacturing Central Team (MCT), Operations, Product Engineering and R&D to develop, execute and measure the effectiveness of Supplier Programs.

In addition, you will support Supplier Performance Reviews to ensure suppliers receive timely and accurate supplier performance feedback based on consistent metrics and that the expectation of continuous improvement is understood and realized. The position will be reporting to Principal Lead, Front End Supplier Engineer.

Role Responsibility and Tasks

1. Development Phase - Sourcing, Selection and Qualification Phase

• Drive Wet Chemical and Specialty Chemical Quality risk assessment and ensure all risks are mitigated to support Fabs qualification activities.
• Participate, support, and recommend from quality perspective on global sourcing and segmentation strategies, including business continuity, benchmarking, new markets, request for quotation (RFQ)/ request for information (RFI), sourcing, selection, cost savings and other analytics.
• Lead technical risk assessment audit for new supplier/ material engagement or qualification to assess their capability and readiness for High Volume Manufacturing (HVM).
• Set up, communicate, and ensure suppliers understood and comply with Micron Supplier Requirements Standards (SRS).
• Support cross fab technology transfer activities in terms of new technology Bill of Materials (BOM) and driving global specifications alignment.
• Collaborate with Suppliers on their outgoing analysis capability to align Best-In-Class (BIC) method detection.
• Align and guide Suppliers to aligned Fab’s advance technology needs which include but not limited to:Study BIC test analysis method and align with Supplier with the collaboration with site Chem Lab to support manufacturing needs (FOAK eval, routine quality monitoring, troubleshooting, improvements, etc.).
  Align, correlate, document with suppliers on lab methods / tools / practices and target to achieve low detection at ppq level contamination.
  To provide a platform for technical or knowledge sharing for SQE team.
  Conduct Regular Technical Meetings with Suppliers on metrology CIPs.
  Conduct constant look out of advance chemical analytical equipment and technology, work with internal site/supplier on results correlation and deploy into CIP with suppliers in compliance to advance technology
  Conduct research for ≤ 10nm particle detection and work with internal site/supplier on results correlation, and deploy into CIPs with suppliers in compliance to advance technology
  Lead Suppliers towards ISO17025 compliance.
  
• Set up, communicate, and ensure suppliers understood Micron metrology expectations.
• Support Category Strategy for Benchmark to/with Suppliers to ensure Controls and Preventive measures are in place to support Shift-Left-Strategy. Supplier/Material development programs.
• Participate and support test method benchmarking and analytics with Suppliers

2. HVM Phase - Supplier Development and Excursion Management

• Lead Wet Chemical and Specialty Chemical Global Material Specification definition and alignment activities with internal stakeholders and suppliers.
• Deploy Wet Chemical and Specialty Chemical category Quality programs, lessons learnt and benchmark to/ with suppliers to ensure controls and preventive measures are in place to support Shift-Left-Strategy.
• Host regular Quality and Technical Review (QTR) meetings with strategic and developing suppliers.
• Manage supplier and sub-supplier changes in Supplier Change Management (SCM).
• Work collaboratively with Global OCT MTE, Operations and Facility globally for deep dive root cause investigations, corrective and preventive actions to ensure no recurrence of related Quality issues.
• Define, manage, and monitor supplier monthly quality performance metrics and their compliance to Micron SRS.
• Enhance the supplier quality business processes to improve productivity and efficiency.
• Support Global Procurement on supplier performance rating on Quality related criteria.
• Lead and conduct supplier audit.

Required:

Bachelor's Degree on engineering or related field.

Desired:

Master's Degree on engineering or related field.

Experiences:

• Previous experience working in Chem lab, wet chemical and specialty chemical under semiconductor industry field is preferred
• Basic Knowledge of ISO9001, IATF16949 & ISO17025 requirements.
• Basic knowledge of Wet Chemical and Specialty Chemical applications and wafer manufacturing process.
• Strong analytical skills with experience in MSA and calibration, statistical methods, FMEA, problem solving methodology and quality management systems.
• Ability to interact effectively with internal and external interested parties, across all levels.
• Ability to collaborate effectively with cross-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.

Qualification:

• Minimum of 5 years’ in semiconductor field.

Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products. Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations. Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when necessary. Ensures that established manufacturing inspection, sampling and statistical process control procedures are followed. May assure compliance to in-house and/or external specifications and standards, such as GMPs and ISO regulations. Evaluates and analyzes the efforts in organizing, documenting, and interpreting inspection support documents and records.

As an Inline and Final Parametric test program development engineer, you will be responsible for developing, maintaining, and optimizing Parametric test programs and strategies for semiconductor NAND Flash products. You will work closely with various engineering teams to ensure the quality, reliability, and performance of the products. You will also provide innovative solutions for test time reduction and test flow optimization.

Job Responsibilities

• Develop and maintain parametric test strategies and programs for semiconductor NAND Flash products
• Collaborate with test development and production engineering groups to ensure test program, infrastructure and system readiness for new product introduction as well as high volume manufacturing
• Improve device yield, reliability and quality through test condition optimization and data analysis and test equipment hardware optimization
• Provide cost effective and innovative solutions for production test flow optimization with cutting-edge Parametric test time reduction methodologies.
• Assist process and production teams by providing necessary engineering expertise to ensure smooth manufacturing operations.
• Introduce innovative test time reduction solutions and release Parametric programs to production in a timely manner.

Job Requirements

• Bachelor’s or Master’s Degree in Electrical, Electronics, Computer Engineering, Computer Science or any related engineering field
• Strong programming skills; Perl, C/C++, Python knowledge will be an added advantage.
• Knowledge of Unix/Linux System environment
• Solid analytical problem-solving skills
• Excellent verbal and written communication skills
• Good understanding of semiconductor device physics will be an added advantage
• Fresh graduates are most welcome to apply

Working Location :

1, North Coast Drive, Singapore 757432

About Micron

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to demonstrate the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

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