Total 170 Senior Executive communications engineer job vacancies in toa payoh

As an Engineer of MSB Lean Manufacturing, you will manage the implementation of Lean transformation methodologies and tools in Assembly, Test and SSD manufacturing at MSB. You will collaborate closely with site functional teams to identify, explore and implement lean methodologies and tools to drive improvements in throughput, labor productivity, yield, and cycle time performance.

Responsibilities:

• Lead the adoption and implementation of Lean methodologies and tools across Assembly, Test, and SSD manufacturing.
• Facilitate continuous improvement events across different functional teams (e.g., Kaizen, Value Stream Mapping (VSM), Projects, Workshops).
• Develop and sustain programs and systems to foster a Lean culture.
• Conduct labor productivity analyses (e.g., Touch-time, MMR, spaghetti charts) to enhance operator and technician efficiency and reduce operational errors.
• Oversee Utilization/ Overall Equipment Effectiveness (OEE) to identify key sources of losses and improvement opportunities.
• Collaborate with functional experts to identify areas for improvement through the application of Lean methodologies and tools.
• Propose Lean approaches and initiatives, including Kaizen and Continuous Improvement Projects.
• Act as the key integrator between central and site functional teams, developing, driving, and communicating progress on critical Lean improvement initiatives.
• Develop an overall view of critical initiatives and their impact on key performance indicators.
• Provide visibility on program status, including key achievements with clear ownership.
• Trigger interventions to ensure programs stay on track towards targets.
• Support regular reporting and meetings with senior leadership, including deep dives for weekly/monthly reports and ad-hoc senior management updates.

Requirements

• Bachelor’s /master’s in Industrial and system engineering, engineering management, Production & Operation Management, or related field.
• > 2 years of experience in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals in the semiconductor industry
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations

Keen on the role? Apply now!

Responsibilities:

· Coordinating, planning and conducting the project plan

· Project formulation and monitoring progress and schedule

· Effective communication and co-ordination between project participants

· Attend site meeting, inspect, monitor and report project progress.

· Submit and update monthly project status

· Perform other duties or tasks as assigned by immediate superior or Project Manager

Requirements:

· Degree in Civil/Structural Engineering or its equivalent

· At least 3 years relevant working experience as Project Engineer in main contractor office

· Proficient in MS Office Word, Excel and Project Scheduling software

· Bilingual with good communication skills

Responsibilties

• Lead the engineering teams within the verticle
• Evaluating and analyzing existing processes and procedures to identify areas of improvements
• Oversee the projects by planning, prioritizing tasks, resource allocation, giving instructions, reviewing code and implementation
• Collaborate with Product Managers, Designers and other key stakeholders to deliver on key priorities
• Strategic thinking to deliver end-to-end user experience solutions with a focus on user needs and business goals

Requirements

• 6-10 years of software engineering experience
• Degree in computer science, information security, or a related subject
• Familiarity with backend development related technology stacks
• Experience leading design and implementation of a highly scalable web services
• Strong interpersonal and communication abilities work successfully with stakeholders
• Great time management skills while working under tight timeline
• Strong analytical and problem-solving skills
• Ability to communicate in mandarin with our stakeholders would be an added advantage

As a Package Design Engineer within the Package Development and Engineering (PDE) organization in Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a multi-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation. You will be ensure the completion of design activities within the project schedule and ensure that design outputs are within Assembly and vendor capability.

Responsibilities will include, but are not limited to:

• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Work closely with multi-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
• Interact with PDE assembly team and external assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Support package technology development, including material selection, process development, DOEs, and related activities
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program milestones to ensure timely development execution.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and contribute to the Global Design, Simulation and Substrate (GDSS) team on continuous improvement efforts such as:Global design alignment activities
  Continuous improvement efforts
  Package design rules
  Package roadmaps
  Competitive Analysis review

Requirements:

• Master (preferred) or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering with a minimum of 5 years of experience in semiconductor packaging industry OR PhD graduates in Electrical Engineering
• Candidates must possess a strong design knowledge of high-density (Wirebond + Flip-Chip) packaging architectures, die stack-up, packaging layout optimization.
• Excellent communication skills, both oral and written in English.
• Excellent problem solving and analytic skills.
• Experience with Cadence SIP, APD and AutoCAD software tools is preferred.
• Good understanding of Silicon IP, floorplan and Signal/Power Integrity is a plus.
• Ability to work independently, prioritize and manage numerous projects with minimum supervision.
• A global perspective and the ability to work in a multicultural environment.

Performs semiconductor design engineering assignments including engineering and designing packaging stack-up, layout checking, documenting specifications, modifying and evaluating packaging risk in the areas of electrical, thermal, mechanical and reliability. Reviews package design requirements, define the package stack-up and conduct final design review. Typically responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor Packaging.

• Knowledge of submicron semiconductor technology
• Familiar with digital ASIC/SOC design flow from RTL to silicon characterization
• Familiar with Synopsys and Cadence EDA tools for Simulation, Synthesis, Timing (STA), Formal and Assertion based verification, etc.
• Familiar with design and programming languages: Verilog, System Verilog, Python, Perl, C, C++, etc.
• Familiar with code base management method including subversion, git, GitHub, etc.
• Ability to apply analytical and problem-solving skills
• Strong written and verbal communication skills, ability to negotiate design features and options
• Knowledge of embedded system design, verification, and product development lifecycle
• Deep knowledge and domain know-hows in one or more areas below is a big plus.

(Only Singaporean will be considered)

Job Description:

The DevSecOps Engineer works along with the Project teams to onboard new squads in the DevOps environment. DevSecOps Engineers will guide them for continuous integration, continuous deployment and continuous testing. DevSecOps Engineer works closely with the development team and operation team to create DevOps strategy and toolset that suits the individual squads.

Responsibility:

• Work with the CI/CD engineers to build initial DevSecOps pipeline supporting squads when onboarded to the project
• Overall Support of the Pipeline (Build & Deploy) to ensure seamless deployment
• Customization of existing pipeline and template based on squad requirements
• Build and manage AWS cloud formation scripts to handle configuration management and ensure continuous deployment
• Ensure availability of infrastructure which includes troubleshooting underlying system if applicable
• Coordinate with the infrastructure team on standard updates and ensure those are reflected on a regular basis
• Facilitate induction programs to provide guidance when new squads onboard the project

Skills:

• At least 3 years hands-on experience in building and developing CI/CD pipeline and workflow (Gitlab CI/CD preferred)
• Good hands-on experience on using AWS Cloud Formation scripts for configuration management and application deployment
• At least 3 years experience with AWS platform (EC2, ELB, VPC) in general and tools such as Lambda, RDS, Dynamo DB
• At least 2 years experience in programming, and overall knowledge on one or more of the following programming language (Java, Spring Boot, Node JS, Angular JS, React Native)
• At least 1 year experience working closely with infrastructure. Experience in Linux, Windows, network troubleshooting is a plus
• Experience on working in an Agile environment, in a close collaboration with developers
• Knowledge on continuous integration, test automation, version control, and software configuration management

UEN: 201508072D

EA License: 22S1099

Personnel Registration Number: R22107983 (Zhen Shuyi)

As a Process Control System Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

As a PDE Network Engineering Process Control System (PCS) Engineer/Senior Engineer, we will be responsible to develop smart manufacturing solutions towards the Industry 4.0 standard. We will gain exposure and knowledge in many cutting-edge areas including Machine Learning, Advanced Control Solutions and Deep Learning. As a PDE PCS Engineer, we will have the opportunity to develop a complete solution that starts from requirements gathering, data analysis and modeling with big data platform, followed by system development and integration; and then network wide implementation. The work we do directly affects the bottom line of the entire company by providing scrap/excursion control, Statistical Process Control (SPC), Advanced Process Control (APC or Run-to-Run), Fault Detection and Classification (FDC), and overall enhanced process capability. We will meet regularly and team with Process areas to understand their tools, processes, and challenges and work with them to create process control models, strategies, and other methods for ensuring quality output.

Responsibilities

• We develop, implement and improve smart control solutions for optimum manufacturing performances.
• We provide technical oversight, guidance and support for process control implementation
• We conduct intensive data analysis and modeling to identify sources of variation in the process and translate it into control solutions.
• We support PDE KEG team in Classification, Characterization and Categorization and define Data Collection Requirements, Perform Integration and Setup Data Collection in E3 Environment.
• We define Analysis and setup Requirements and Setup Limits and OCAP and engage in periodic review with PCS team and network on BKM practices.
• We develop and deliver training on control systems and related topics.

Requirement

• PhD, Masters/Bachelor’s Degree in Electrical and Electronics Engineering/Computer Science/Statistics/ Mathematics/Physics
• At least 4 years of experience in semiconductor manufacturing advanced process control.
• Experience and knowledge in Programming and Data Analysis. Preferred experience in Python/R/SQL/Hadoop eco-system and/or in the development of web-based applications
• Familiar with Machine Learning.
• Good communication and interpersonal social skills.
• Excellent problem solving and analytical skills.
• Excellent verbal and written communications skills. Good interpersonal skill and a good teammate.
• Excellent Project management skills.
• Ambitious and ability to multi-task and balance dynamic priorities.
• Ability to participate in a multi-functional team environment.
• Willing and capable of international travel, as needed, to accomplish your objectives.

Keen on the role? Apply now!

As a standard cell design engineer in the Physical Design Group, you will develop your skills working on some of the most sophisticated process nodes targeting the largest foundries. You will contribute to designing our physical IP standard cell offerings for our internal and external customers at leading edge nodes including 5nm and beyond. Work with partners inside the company, as well as our partners in the EDA and foundry space.

Responsibilities:

· Design standard cell circuits and verify them for functionality, performance, and power

· Generate and validate EDA model views of standard cells

Required Skills and Experience :

· 5+ years of relevant circuit design experience (for BSEE)

· 3+ years of relevant circuit design experience (for MSEE)

· Experience with transistor level circuit design using Cadence Virtuoso and circuit simulators such as SPICE, SPECTRE

· An understanding of transistor level device physics and standard cell layout

· Knowledge of power, performance, and area tradeoffs

· An ability to learn a wide variety of industry standard view and modeling formats such as Liberty, Verilog, LEF, NDM, APL, GDS

· Scripting skills in either Tcl, PERL or Python

· Dedication to quality, collaboration, curiosity and continual improvement

Job description

• Experience in UVM verification methodology
• Experience in developing and deploying state-of-the-art verification methodologies in ever-increasing design complexities, from UVM, C/C++ co-simulation, system emulation to mixed-mode simulation & formal verification
• Disciplined, quality-minded, and highly driven for excellence,
• Excellent team player and good communication skills
• MSEE/BSEE in Electrical Engineering or Computer Engineering, with 3 years of relevant experience, but are open to fresh graduates with outstanding results
• Candidates with relevant experiences would be offered as Senior or Staff, taking on higher responsibilities

About Us:

Care Community Services Society (CCSS) is a non-profit organization dedicated to supporting vulnerable communities in Singapore by providing essential social services and programs. Through our wide range of initiatives, we aim to foster social integration, uplift individuals and families, and build a more caring and inclusive society.

Position Overview:
We are looking for a dynamic and highly motivated Executive in Corporate Communications to join our team. This role will involve overseeing all aspects of internal and external communications for CCSS, including managing corporate collaterals, content creation, and liaising with service providers. Additionally, this position will take on the responsibility of enhancing SG Cares Volunteer Centre’s branding strategies.

Roles & Responsibilities:

Corporate Communications

• Develop and implement communication strategies to strengthen CCSS's corporate identity and messaging across various platforms.
• Create and curate engaging content for internal and external communications, including newsletters, reports, social media, website content, and more.
• Vet and review content for clarity, tone, and consistency, ensuring alignment with CCSS's values and goals.
• Oversee the production of corporate collaterals such as brochures, annual reports, press releases, and promotional materials.
• Collaborate with design teams to ensure high-quality visual assets and artwork align with branding guidelines.

Brand Strategy for SG Cares Volunteer Centre

• Develop and execute branding strategies to enhance SG Cares Volunteer Centre’s visibility and engagement.
  • Ensure cohesive messaging for SG Cares initiatives across various platforms, collaborating with relevant stakeholders to promote volunteerism and community service.

Stakeholder Engagement

• Liaise with internal teams and external service providers to ensure smooth and effective communication flow.
• Build and maintain relationships with key media contacts, partners, and service providers to support communication efforts.

Requirements:

• Bachelor’s degree /Post Graduate Diploma/Professional Degree in Mass Communications, Public Relations, Marketing, or a related field.
• At least 2 years of experience in corporate communications, content creation, or branding.
• Strong written and verbal communication skills, with a keen eye for detail.
• Proven experience in content creation, copywriting, and managing corporate collaterals.
• Familiarity with design principles and working with design teams (knowledge of design software is a plus).
• Ability to handle multiple projects simultaneously and meet deadlines.
• Strong interpersonal skills and the ability to work collaboratively with cross-functional teams.
• Passion for social causes and community service is a plus.

Benefits:

• Comprehensive healthcare benefits
• Opportunities for professional development and training
• Meaningful work that makes a positive impact on community
• Supportive and collaborative work culture

How to Apply:
Interested candidates are invited to submit their resume, along with a cover letter and portfolio (if applicable), to [[email protected]] by [25 Nov 2024].

Join us in making a difference in the lives of those who need it most!

Key Responsibilities:

• System Development, Implementation and Support
• Evaluate requirements and analyze impact to the application
• Involve in design and development stage
• Involve in application setup and deployment
• Provide guidance towards testing phases
• Provide level 3 production support to relevant open systems applications 
• Coordinate with internal teams and vendors to resolve application and system issues
• Execute tasks related to project / change request / maintenance request

Key Requirements:

• Degree in Computer Science or equivalent
• 5 years of UNIX/LINUX/SQL/Korn Shell programming experience
• Hands-on experience on Oracle database, Webserver such as Apache, Java platform / J2EE and Java web container such as WebLogic, JBoss EAP, Tomcat
• Relevant working experience with good working knowledge in cards, loyalty, remote commerce, portals or digital payment domains.
• A good understanding of API frameworks will also be desired.
• Ability to multi-task and perform well under pressure

Responsibilities

• Administer, upgrade, maintain high availability, performance, and security of Linux, Windows, storage clusters, virtualization clusters (VMWare and Kubernetes), and critical middleware services.
• Oversee, monitor, improve infrastructure and critical services health through performance optimization, security hardening, patch management, service updates, and scalability assessments.
• Drive the adoption of automated practices such as Infrastructure as Code (IaC) for provisioning, configuration, and maintaining infrastructure.
• Develop, maintain, improve automation scripts and tools to streamline continuous integration (CI) pipelines and deployment processes for software development and IT operations.
• Design and implement monitoring solutions or observability tools to track infrastructure performance, logs, and application health.

Requirements

Educational Background:

• Diploma, Degree or higher in Computer Engineering, Computer Science, Engineering, Information Technology, or a related technical field. Advanced certifications are a plus.

Professional Experience:

• Minimum 6 years of hands-on, professional experience in IT operations, infrastructure management, software development, or a closely related field.

Technical Skills:

• Proven experience in managing and supporting critical services across Linux, Windows, and middleware platforms.
• Strong background in Linux administration and management.
• Strong expertise in Windows Server administration, including AD, GP, Windows-based infrastructure services.
• Extensive experience in virtualization platforms (ESXi) and container orchestration (Docker).
• Hands-on experience in network and software-defined storage technologies (Ceph, NAS, NFS).
• Proficiency in CI/CD processes, automation tools (GitLab CI, Jenkins), deployment workflows.
• Knowledge in infrastructure monitoring, alerting, logging tools (ELK Stack, Grafana, Loki, Prometheus).
• Experience in Infrastructure as Code (IaC) tools (Ansible, Chef, Puppet).
• Strong willingness to learn, collaborate, and contribute to continuous improvement.

Preferred Skills

• Proficiency in scripting and automation with Bash, Python, Shell, PowerShell, Go, YAML.
• Strong knowledge of security protocols and best practices in infrastructure management and DevOps.
• Familiarity with hardware storage technologies (DAS, FC, iSCSI, RAID, SAS, RAID).
• Experience with common IT integrations (LDAP, SIEM, SMTP, REST).
• Knowledge in CI/CD methodologies and tools.

What We Offer

• Competitive salary, bonuses, attractive benefits package.
• A flat hierarchy with minimal bureaucracy, where all technical leads are also hands-on.
• Freedom to pursue your interests within reason.
• Learning opportunities through courses, seminars and conferences.
• A stable working environment with flexible hours.
• A chance to make a meaningful impact on society through your work.

# Risk Management & Project Management

# Network Migrations - LAN & WAN, Network security

# Experience in Data Centre Project

Job Description:

• Plan and execute data centre migration
• Oversee procurement of new servers and network equipment
• Manage data migration and verification processes
• Set up new Server Room compliant with Green Book standard
• Other ad-hoc tasks assigned
• 
  
• Diploma/Degree Holder and above
• At least 5 years of experience of handling ICT projects such as DC relocation etc
• Relevant IT certifications (eg. ITIL, CISSP, PMP) preferred

Send your cv to [email protected]

As a Senior Package Design Engineering (PDE) Central Engineering System and Analytics (CESA) Engineer, you will develop integrated solutions to empower Backend Operations to make data-driven and heuristics-based decisions. You will work across Global Operations and sites to improve Cost, Scale, Quality, and Cycle Time by defining and designing data architecture and collaborating with key partners.

Responsibilities

• Yield Enhancement (YE) lots analysisLead YE lot analysis including reconstructing fuse identififaction (FID) for traceability, statistic comparison for different group
  
• Yield modelling / pareto benchmarkingIdentify actionable opportunities from YE lots
  Develop and improve Yield Models for HBM
  Periodically improve models based on actual performance
  
• Best Known Methods (BKM) DeploymentDevelop BKM’s for YE and drive implementation
  Identify/align BKMs and monitor implementation
  Works with different teams in the identification of critical metrics

Requirements:

• PhD/Masters/Bachelors in Statistics, Mathematics, or a related field; advanced degree preferred.
• Minimum of 3 years of experience in semiconductor manufacturing or related fields
• Preferably with experienced in Package Design Engineering and Yield Enhancement
• Strong understanding and knowledge of semiconductor manufacturing processes and technologies.
• Proficiency in statistical/machine learning and statistical techniques skills will be additional advantageous;
• Experience in MRDA will be a plus
• Proven ability to make decisions, multi-task, and solve problems and address root causes.
• Exhibit critical thinking to see opportunities.
• Effective communication skills in verbal/written.
• Self-motivated. Able to work independently with minimal supervision.
• Able to travel as required to support department and company objectives.

As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will be managing and optimizing your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor or master’s in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 4 or more years of experience with proven track record of technical leadership in semiconductor manufacturing in Metro Real-Time Defect Analysis Process & Equipment Engineering. Experience in other Front-End areas, in Post Wafer Fabrication & High Bandwidth Memory technology
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill
• Excellent communication skills

Keen on the role? Apply now!

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide alignment

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

Requirements

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

Keen on the role? Apply now!

Job Descriptions:

• Overseeing and directing construction projects from conception to completion
• In-depth reviewing of projects to schedule deliverables and cost estimation
• Ensure safety procedures are implemented and meet company’s standard and legislation
• Ensure safety and health are in place according to building and safety regulations
• Monitor, control, and coordinate site works
• Ensure projects meet customer’s quality standards
• Any d-hoc duties as require

Requirements:

• Degree in Civil Engineering or equivalent with at least 3 years relevant experiences at or equivalent managerial level in construction
• Knowledge in Design and Auto Cad (3D) for Civil Structure work.
• Good communication skills
• Able to communicate in English and Japanese language (to handle queries and feedback from Japanese speaking associates/ clients)

Job Descriptions:

• Overseeing and directing construction projects from conception to completion
• In-depth reviewing of projects to schedule deliverables and cost estimation
• Ensure safety procedures are implemented and meet company’s standard and legislation
• Ensure safety and health are in place according to building and safety regulations
• Monitor, control, and coordinate site works
• Ensure projects meet customer’s quality standards
• Any d-hoc duties as require

Requirements:

• Degree in Civil Engineering or equivalent with at least 5 years relevant experiences at or equivalent managerial level in construction
• Knowledge in Design and Auto Cad (3D) for Civil Structure work.
• Good communication skills
• Able to communicate in English and Japanese language (to handle queries and feedback from Japanese speaking associates/ clients)

Job Description

• Reporting to Global Category Microcontroller & Memories (MCM), strive to secure “Best in Class” consistent and sustainable supplier quality performance to reach the Continental Business and Quality targets.
• Maintenance of the defined Supplier Quality Management System (procedures, guidelines, and tools) to ensure the requested quality is in line with the defined supplier management strategies to meet the quality targets.
• Execution of supplier evaluations and assessments to support the cross-functional supplier selection team with the required quality data.
• Driving supplier development & improvement activities at supplier's site.
• Initiation and introduction of the preferred supplier and components strategy.
• Design, initiation, and control of preventive quality management measurements in the design and development phase for supplied parts and services to ensure that our products meet the quality requirements defined.
• Component introduction through robust APQP process which include Component sourcing, writing of specifications, handling of qualifications and risk management.
• Manage change requests (PCN) from component suppliers and assure comprehensive qualification of any change.
• Support of the data system to collect and evaluate supplier quality related key performance indicators (KPIs) for the regular reporting of quality performance.
• Support for the continuous improvement process of all supplier quality-related processes, guidelines, and tools by means of supplier audits, on-site assessments, and benchmarking and best practice sharing programs.

Qualifications

• Degree in Electronics/Electrical Engineering (or related) with minimum 5 years’ experience, preferably in the automotive industry
• Candidates with experience in semiconductor processes (e.g., wafer process technologies, back-end assembly, and testing), knowledge in electronic component & qualification requirements (e.g., AEC-Q, JEDEC, IP qualification) preferred. Candidate with more work experiences may be considered for Principal role.
• Strong experience in quality systems, process audits and part qualification.
• Understanding of automotive practices such as APQP/PPAP/VDA6.3/IATF16949.
• Able to lead suppliers' development and audit activities within Asia.
• Able to work independently and travel frequently (e.g. SE-Asia, China, Japan & S. Korea).
• Strong interpersonal and communication skills e.g. in collaborations, problem solving process, conveying technical details and presentation.

Job Scope

• Prepare schematic design, site installation layout, calculations, technical reports and specifications etc for automation equipment panel.
• Liaise with external consultant teams, contractors and suppliers to resolve project electrical design issues.
• Generate BOM and RFQ document.
• Communicate with contractor for automation equipment panel fabrication.
• Prepare factory acceptance test document for automation equipment panel.
• Responsible for liaising with Project Manager on automation equipment panel acceptance before ship to site.
• Provide support on site installation.
• Updating of Circuit diagram, Control device and Equipment Installation layout.

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We wish you all the best in your career search.

You are welcome to visit our website at http://www.rkgroup.sg/

RK Recruitment Pte Ltd | EA License No.: 20C0280

RAYMOND NG JUN HAN | EA Personnel No.: R1657009

Micron Packaging R&D group is looking for highly talented individual for Wire Bond Process to develop innovative solutions for the Multi Chip Memory IC Packages.

Job Responsibilities

• Provide leadership in wire bond technology, problem analysis and resolution
• Develop and Transfer wire bond process for IC Package process technology (Wire Bond) for multichip memory packages
• Process Development & Characterization, Qualification, and production pilot run
• Work with multi-functional team to characterize new Silicon technode and develop assembly packaging/recipe solution for products requirements
• Define, plan and implement technology roadmap to meet wire bond packaging roadmaps
• Qualify and transfer packaging technology to production site
• Collaborate with other functional groups both locally and globally to develop wire bond solutions to meet the packaging business needs
• Showcase and build organization reputation by publishing technical papers and submit invention disclosures.

Job Requirements

• PhD/Masters’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering
• At least 5 years of experience in semiconductor wire bond engineering
• Good analytical and problem-solving skills, such as using Design Of Experiment and structured problem solving tools
• Self-motivated, able to work independently and self-initiative personality
• Possesses good communication skills, interpersonal skills and ability to work with global multi-functional teams

Keen on the role? Apply with us now!

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Responsibilities:

• To lead and drive the requirements gathering process.
• To lead and manage a small team of developers to deliver the modules to develop web-based application systems.
• Participate in the design and development of web applications based on Ecquaria’s product (J2EE-based).
• Lead and manage the user acceptance testing process.
• Implement, customize, test, document and maintain software applications.
• Ensure that the modules delivered are according to the specifications and are of high quality.

Requirements:

• A Degree/Diploma in Computer Science with at least 3 years' software development experience in Internet technology in Win NT, UNIX or LINUX platform
• Those with leadership experience may be considered for the Project Lead position.
• Technical skills include proven object-oriented programming experience with Java and C++ together with extensive RDBMS through JDBC
• Experience in J2EE, Web Services and XML will be advantageous
• Experience in Elixir reporting solutions will be advantageous
• Very strong in SQL
• Data analysis skill will be an added advantage, although this is not compulsory to have.
• Good interpersonal skills

Toppan Ecquaria is an equal opportunity employer and values diversity within our company. We welcome all interested candidates to apply for this position, however, we regret to inform that only shortlisted candidates will be contacted by us for an interview.

Find us at www.topppanecquaria.com or www.linkedin.com/company/toppan-ecquaria

For more career opportunities, please visit our career site at:- https://toppanecquaria.com/careers/job-openings?utm_source=Jobstreet&utm_medium=Page&utm_campaign=2020

(Please copy & paste the above link onto your browser)

Job Responsibilities

• Lead, plan, and manage the project team while effectively communicating with internal and external stakeholders, including offshore development teams
• Provide regular progress reports to the Project Manager on assigned tasks and overall project status
• Actively engage in requirement clarification sessions with customers and create high-level system design documentation
• Take the lead in resolving issues, including investigation, fixing, testing, and releasing modules
• For any change requests, clarify customer expectations and collaborate with the (offshore) development team to define and implement the appropriate solution approach
• Conduct thorough reviews of project deliverables to ensure quality and accuracy
• Support the customer with any incidents or clarification needs related to the system

Job Requirements

• 8+ years of experience as system engineer in Application and Infrastructure projects
• Experience of leading development team
• Experience in full SDLC cycle with waterfall development model
• Ability to multi-task, organize, and prioritize work
• Experience and Knowledge of application development using Java or .NET
• Knowledge of Linux Server, Oracle DB Server, Application server(like WAS, JBoss, etc)
• Strong analytical and problem-solving skills
• Excellent Customers and offshore team management skills
• Familiar with core banking system
• Experience of coding from scratch
• Knowledge of MQ(IBM MQ) and File transfer(SFTP)
• Have prior experience of involvement in banking domain system development
• Good to have experience of working with Japanese banks
• Proficiency in Japanese language (JLPT N1) to liaise with Japan HQ and Japanese customer

We are seeking a highly skilled Senior Software Engineer with strong technical expertise in full-stack development and software architecture. The successful candidate will play a pivotal role in designing, developing, and maintaining complex software solutions while driving technical excellence across the team. This individual will work with leads to contribute to architectural decisions and implement best practices to ensure high-quality, secure, and scalable applications.

Project Coordination

Lead complex development initiatives and feature implementations, ensuring adherence to sprint timelines, technical scope, and product requirements. Collaborate with cross-functional teams, including product, QA, DevOps, and other developers to align on technical solutions and deliverables.

Technical Leadership:

Provide deep technical expertise in software development, helping solve complex coding challenges and ensuring engineering best practices. Act as a mentor for junior developers, leading code reviews, and fostering technical excellence through knowledge sharing.

Cybersecurity Oversight:

Implement secure coding practices and maintain security standards in development. Conduct security reviews of code, identify potential vulnerabilities, and ensure the implementation of security best practices across applications.

Stakeholder Management:

Serve as technical point of contact during sprint meetings and technical discussions, ensuring clear communication of technical constraints, possibilities, and updates to product managers and other stakeholders. Provide L3 support and serve as the escalation point for critical project issues.

Quality Assurance & Compliance:

Ensure code meets quality standards through comprehensive testing, code reviews, and adherence to coding standards. Drive quality control through implementation of unit tests, integration tests, and automated testing processes.

Problem Solving & Issue Resolution: Debug and resolve complex technical issues, optimize application performance, and provide solutions for technical challenges. Lead technical incident response for production issues and implement preventive measures.

Qualifications.

Minimum of 8+ years of experience in a technical leadership role.

Strong understanding and experience in software development lifecycle

proficiency in relevant programming languages (PHP, Typescript, Python)

Experience on Three.js/WebXR or other rendering & visualization libraries.

knowledge of security frameworks, protocols, and compliance standards (e.g., ISO 27001, NIST).

Proven experience in technical project delivery and implementation

Experience in AI/ML integration is an added plus.

Strong project management skills with experience working in cross-functional teams.

Strong team collaboration and interpersonal skills

Work Day: Mondays to Fridays (5 days)

Work Time: 9am to 6pm

Location: Toa Payoh