Job Description: Semiconductor Process Integration Engineer

Position Overview: We are seeking a highly-skilled Process Integration Engineer to join our team. The primary responsibility of this role is to develop and deliver advanced process modules with our partner foundry facilities for optoelectronic integrated circuits (ICs). The ideal candidate will have a strong background in semiconductor process technology and a proven track record of working effectively with external partners.

Key Responsibilities:

1. Process Development: You will join an existing team to design and develop semiconductor process flows to for a proprietary CMOS + III-V monolithic integration platform. You will integrate various process modules into a cohesive manufacturing process, optimizing for performance, yield, and reliability.

2. Collaboration with Fab Partners: You will be responsible for management of projects under your purview with one or more fab partners, including aspects such as budgeting, schedule and resource planning. You will work closely with fab partners to develop, optimize, and implement process modules for optoelectronic ICs, ensuring compatibility with fab partner manufacturing protocols. You will provide technical support and feedback to fab partners, troubleshooting process-related issues and implementing corrective actions. You may also be embedded within the fab partner’s team for specific durations during critical phases of the process development effort.

3. Data Analysis: You will analyze process data to identify trends, root causes of issues, and opportunities for process improvements. You will also design experiments and test plans to retire technical risks and resolve process issues. You will also be responsible for maintaining detailed documentation of process development activities, including process flows, specifications, and test results.

Responsibilities:

• Be a member of the Process Engineering Team for top quality servers & storage products, maintain and update end to end production process & value stream mapping, cover end to end production process for better efficiencies thru process optimization, layout/work station enhancement as well as smart factory / automation projects
• Cooperate with the NPI PM team, Test Engineers, Quality, Production, Planning, Logistic and other departments to support production, including audit
• Support NPI ramp with propose new equipment, manage equipment readiness to support LVO, Engineering Change and customer requirement
• Ability to perform first level process issue triage and resolve issues locally where possible, analyze and identify process issue and deficiencies with follow up actions for resolution and improvement to meet goal for cost, quality and delivery.
• Escalate any process issue found to have major impact on quality, process and or cycle time if not able to resolve locally

Skills and Requirements:

• Bachelor’s Degree in Electrical / Electronics Engineering
• 3+ years of relevant work experience is preferred
• Strong IT background, experience with SAP is an advantage
• Technically know-how on Kaizen, 6 Sigma, PFMEA, DOE and/or 8D is a plus
• Experience with server & storage product is an advantage

OTHER INFO:-

• Work Location: 452 Alexandra Road, Singapore 119961 [Near Labrador Park MRT]
• Working Days / Hours: 8am to 5.30pm / 8.30am to 6pm (Mondays to Fridays)

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Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).

At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.

COMPANY OVERVIEW:
Celestica (NYSE, TSX: CLS) enables the world’s best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud.

Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.

Celestica would like to thank all applicants, however, only qualified applicants will be contacted.

Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.

At SSMC, every career journey is unique and rewarding. We're looking for innovative, passionate, and talented people like you to join our team.

We’re searching for an Associate Engineer to be part of our Diffusion WET Process Department diverse team of talent.

What you will be working on:

• Perform shift duties (12-hour shift) to support the running of Production in the module and ensure that process integrity for machines is in place for production
• Assist Engineers in the qualification and fine tuning of processes for production
• Trouble-shoot process related issues and minimize the time lots are on hold
• Monitor and improve on the qualified process using SPC and other statistical tools
• Co-ordinate with Specialists to ensure that work is carried out efficiently to meet module objectives and that SOPs are strictly followed
• Assist in implementing process improvement projects
• Assist new Associate Engineers on their On-The-Job-Training (OJT) by acting as their buddy
• Participate in QIT programs to improve productivity and output quality of the module
• Work with QA on internal audit
• Create job-files for metrology tools for production set-up, and housekeeping of files
• Maintain good housekeeping in the production area, ensuring good safety practice and also safe custody of tools, equipment and other properties belonging to the Module

More about you:

• Diploma / ITC / NTC in Electrical / Electronics / Mechatronics / Mechanical/ Microelectronics / Chemical Process Technology
• Able to perform 12-hour rotating shift
• Team Player

SSMC is committed to equal employment opportunities and abides by the Tripartite Guidelines on Fair Employment Practices (TGFEP). All qualified applicants will receive non-discriminatory consideration for employment on the basis of merit and regardless of age, race, gender, religion, marital status and family responsibilities, or disability, or any other attributes as protected by the relevant laws.

Job requirement:

• Ability to perform first level investigation out of control situation and line excursions, abnormal lot/tool judgement due to inline OOC and OOS from SPC Chart.
• Process condition optimization.
• Work closely with equipment and production to ensure key module objectives are met.
• Evaluation to improve process margin.
• Cost reduction projects.
• Ensure safety, discipline and housekeeping compliance by all personnel.
• Analyze different types of defects and provide clear problem description with maintenance counterparts on troubleshooting.

Job requirement:

• Diploma in Electrical/Electronics/Chemistry/Microelectronics/Engineering or equivalent.
• Relevant working experience in Photo Process semiconductor front-end industry
• Willing to work in cleanroom environment.
• Able to perform 12-hour rotating shift
• An excellent team player with good interpersonal skill
• Strong logical thinking capability and good analytical skill
• Highly committed with good ownership and accountability
• Passion for the semiconductor / manufacturing industry
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications

Job Responsibilities :

• Communicate, coordinate, and integrate department resources to enhance efficiency and achieve departmental goals and objectives.

• Oversee team member assignments, manage project scheduling, and track project progress to ensure timely and successful completion.

• Implement cost control measures and optimize resource allocation to maximize department performance.

• Foster team development through targeted training and mentorship programs, ensuring the success and growth of team members.

Job Qualification

• Master’s degree in a related field, such as Chemistry, Chemical Engineering, or Material Science.

• Over 5 years of relevant work experience.

• Strong knowledge of 12-inch semiconductor diffusion processes, including furnace, ion implantation, and Wet Bench System.

• Proven ability to identify, assess and solve problems

• Analytical with good interpersonal skills

• Team leader with execellent communication/coordination skill.

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.

At SSMC, every career journey is unique and rewarding. We're looking for innovative, passionate, and talented people like you to join our team.

We’re searching for an Engineer to be part of our Etch diverse team of talent. You will be responsible to manage the integration of all modules' processes and the respective derivatives.

What you will be working on:

• Responsible for new Process Development and/or Process Transfer
• Process optimization for Yield and Productivity improvement
• Troubleshoot and resolve Process related issues
• Sustain and/or improve Process Capability, CpK
• Qualify and release tools for required MFG capacity
• Qualify alternate sources for Cost improvement
• Plan and execute Engineering Projects
• Continuous improvement through participation in 10k idea, LSS & BKM to create cost effective and robust processes with quality
• Setup, monitor and maintain SPC charts
• Adhere and complete necessary documentation

More about you:

• Bachelor Degree in Engineering / Science or equivalent
• 1-3 years relevant experience in Semiconductor manufacturing environment
• Basic engineering knowledge, which may include semiconductor devices theory, electronics, digital principle and wafer fabrication processes
• Good communication and presentation skills
• Proficient in Microsoft business applications
• Good problem solving skills
• Team Player
• Strong sense of responsibility
• Positive learning attitude
• Able to take pressure under time-constrained situations
• Detail-oriented

SSMC is committed to equal employment opportunities and abides by the Tripartite Guidelines on Fair Employment Practices (TGFEP). All qualified applicants will receive non-discriminatory consideration for employment on the basis of merit and regardless of age, race, gender, religion, marital status and family responsibilities, or disability, or any other attributes as protected by the relevant laws.

The New Product Introduction (NPI) process engineer will provide Dermcut Medical Pte Ltd with technical support and operating knowledge for our medical device operation. This role will conduct critical engineering functions such as product validation, troubleshooting, identifying and implementing process improvements.

The engineer will work closely with project manager and is in charge of taking the prototype from pilot scale into full scale manufacturing in support of commercial efforts. This position will focus on developing various processes and implementing those to support mass production.

Primary Responsibilities

• Establish processes based on product specifications.
• Develop control plans, gage repeatability & reproducibility, test method verification & validation, and pFMEA.
• Identify areas of process improvement to reduce and minimize process related nonconformance incidents and to maximize efficiency of the process.
• Co-ordinate the generation of dossier including but not limited to design files, technical files and project files to include design outputs, shelf-life studies, biocompatibility, sterilisation, risk analysis, validation master plans, IQ's, OQ's, PQ's and test regimes.
• Responsible for screening and optimization of process parameters to achieve robust and stable processes and maximize yields, efficiencies and process capabilities.
• Perform other related duties and responsibilities as assigned.

Education / Experience Requirements

• Bachelor’s degree in process engineering or similar qualification.
• A minimum of 2 years’ experience in the medical device industry.
• A strong understanding of validation strategy (IQ/OQ/PQ), support protocols and reports.
• Experience in root cause analysis of technical discrepancies/abnormalities.
• Familiar with FDA documentation requirements, ISO 13485 quality management system, lean manufacturing, and good manufacturing practice.
• Experience with SolidWorks and Microsoft Project preferred.

Job Responsibilities:

•Lots handling, WAT analysis and process optimization

•Device development, Yield trouble shooting and reliability improvement

•Fab transfer & Customers handling

•Customized structure process integration development

• To be responsible for helping to drive leading edge process/device development and optimization of devices in order to meet scaling, performance, reliability, and manufacturability requirements.

• Identify and solve IC process and device problems

Job Qualification

•Bachelor degree or above in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry or a related engineer discipline.

• 5+ Years Experienced Process Engineering

• Fab 12" knowledge is preferred

• Knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles

•Good communication skills, be able to work within cross-functional teams, including internal and external partners

About VSMC

VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) is a new joint-venture 300mm semiconductor wafer manufacturing facility to be built in Singapore. We are looking for committed, resilient and passionate talents to launch a promising future that power the next generation devices and systems. If you share the same passion to pursue excellence, join us to make an impact and be part of something special!

Role Summary

You will be responsible to deliver robust and efficient semiconductor manufacturing process with data driven analytics and systemic problem-solving skills in the respective modules: Etch (Dry Etch and Wet Etch); Photolithography; Diffusion; Chemical Mechanical Planarization (CMP); Chemical Vapor Deposition (CVD) or Physical Vapor Deposition (PVD)

Key Responsibilities

• Maintain smooth daily manufacturing operations and problem solve issues promptly
• Actively collaborate with equipment and material suppliers and partners to identify technology deficiencies; develop, evaluate, and validate corrective and preventive solutions
• Qualify and sustain manufacturing processes to scale up capacity swiftly and maintain with quality and urgency
• Continuously improve process stability and capability, enhance quality, reliability, yield, productivity, and safety standards
• Design and execute experiments, analyze complex data sets, and derive actionable insights to optimize manufacturing processes and precise controls
• Implement statistical process control methods to establish and uphold robust manufacturing processes

Education Qualification & Essential Experiences

• Bachelor’s or higher degree in Electrical and Electronics Engineering, Chemical Engineering, Material Science, Physics or STEM related fields
• Must be available to travel to Taiwan for a training period lasting 6 to 9 months
• Fresh graduates welcome to apply

Key Skills and Attributes

• Good interpersonal and communication skills to work effectively across functions and geographical teams with diverse background
• Strong analytical and problem-solving skills to achieve positive results and outcome
• Goal driven and an excellent team player that can work under pressure in a dynamic and fast-paced environment
• Has a growth mindset, prioritizing adaptability, resilience, innovation, and ongoing learning to support business needs

VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.

Job Overview

In today's information-centric world, the core of information technology lies in the semiconductor industry. UMC is a leading global semiconductor foundry company and we are sincerely inviting process engineers to join us. You have the opportunity to develop your expertise in the semiconductor industry and improve the conditions for advanced technologies through design and development experiments to provide a more stable process at lower cost and higher yield! Learn to establish a cooperative atmosphere with various manufacturers and engineers to jointly develop strategies and solutions to improve the company's efficiency.

Responsibilities

• Day to Day monitoring and ownership to timely address in-line SPC/defect/Equipment abnormality, handling and disposition
• Manage projects in productivity improvement, particularly for new processes, using process characteristic analytical tool to improve process condition and technology
• Establish process parameters for a variety of semiconductor equipment to ensure line stability
• Evaluation and development of new equipment/materials/process

Qualifications

• Minimum requirement of a Bachelor's Degree in Electronic Engineering , Electrical Electronic Engineering, Chemical Engineering, Materials Science, Mechanical Engineering and Physics
• Demonstrated experience of at least 2 years in semiconductor foundry module process
• 22/28 nanometer and below advance technology nodes experience is highly desirable
• Strong understanding of process development, optimization and troubleshooting.
• Proven leadership skills in leading cross-functional teams and managing projects related to process improvement or technology transfer
• Ability to analyze complex process issues, identify root causes, and implement effective solutions
• Experience skills including SPC, 8D reporting, DOE, FMEA and PMO is preferred
• Able to commit shift work

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

What you will do

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek:

• Scan chain insertion & ATPG pattern generation
• Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.)
• Diagnosis to help manufacture process improvement

2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC:

• PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation
• Develop & integrate DFT-related RTL design modules to test chip

What you will bring

1. Master's Degree in EEE/ EE/ CE
2. Expertise in Synopsys and/or Mentor DFT tools, and HDL simulators like Synopsys VCS
3. Fluency in script language including but not limited to TCL/Perl/Python
4. Experience about MBIST with state-of-the-art SRAM structure & EDA tools is big plus
5. Skill for RTL design & integration, and physical failure analysis(PFA) will also be plus
6. Ability to think and work independently with different teams
7. Interest in understanding more details in entire design flow
8. Ability to use English for discussing technical details
9. More than 4-year industrial work experience is preferred

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.

At SSMC, every career journey is unique and rewarding. We're looking for innovative, passionate, and talented people like you to join our team.

We’re searching for a Associate Engineer to be part of our Photolithography Equipment diverse team of talent.

What you will be working on:

• To assist the Engineers to sustain and improve process integrity and Cpk indices to meet operations goals
• Perform shift duties (12-hour shift) to support the running of production in the module module and ensure that process integrity for machines is in place for production
• Assist Engineers in the fine tuning of processes for production
• Assist in trouble-shooting process related issues and minimize the time lots are on hold
• Monitor qualified process using SPC and other statistical tools
• Assist Specialists to ensure that work is carried out efficiently to meet module objectives and that SOPs are strictly followed
• Assist in implementing process improvement projects
• Participate in QIT programs to improve productivity and output quality of the Module
• Maintain good housekeeping in the production area, ensuring good safety practice and also safe custody of tools, equipment and other properties belonging to the Module

More about you:

• ITC / NTC in Electrical / Electronics / Mechatronics / Mechanical/ Microelectronics / Chemical Process Technology
• 2 – 5 years working experience in electrical / electronics industry
• Fresh diploma holders will also be considered
• Able to perform 12-hour rotating shift
• Team Player

SSMC is committed to equal employment opportunities and abides by the Tripartite Guidelines on Fair Employment Practices (TGFEP). All qualified applicants will receive non-discriminatory consideration for employment on the basis of merit and regardless of age, race, gender, religion, marital status and family responsibilities, or disability, or any other attributes as protected by the relevant laws.

Process Engineer (Lithography) is responsible for development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.

Requirement

• Minimum bachelor’s degree in Materials Science, Microelectronics, Chemical Engineering or relevant disciplines
• Minimum 3 years hands-on process experience in Lithography process
• Experience working in Wafer-level Fanout packaging production line or LCD/FPD production line preferred
• Knowledge in process engineering, process control engineering and yield enhancement
• Experience in SPC, DOE, FEMA, and 8D reports

Role & Responsibilities:

• Responsibilities include diagnosing appropriate levels of metal/metal-alloy contaminations by oxygen and other contaminants; determining the root cause of contaminants, and establishing protocols for characterizations.
• Hands-on providing support for onsite metal PVD, including creating, running, and characterizing recipes to achieve the lowest resistances.
• Collaborates closely with equipment vendors and device engineers to optimize the metal-stack for device performances and robustness/reliability, from low to high temperatures.
• Lead data analysis related to implant-induced defects and cleaning issues on metal contacts with solutions development.
• Examines the work-functions of metal/metal-alloys suitable for Ohmic contact on SiC.
• Responsible for designing experiments for Ohmic contact on various SiC substrates with different doping types, determining their impact, and resolving issues to achieve the lowest specific contact resistances.
• Designing cleaning processes to obtain ideal Schottky diode using various metal/metal-alloys on SiC for high-performance applications.
• Work closely with cross-departmental and integration teams and in 3-5 years’ time develop a WBG backend process integration team of at least 4 persons.

Requirements:

• PhD Degree in Material Science, Physics, Electrical Engineering or related field.
• >8 years related industrial experience inclusing backend process module integration.
• Extensive hands-on experience in PVD (Physical Vapor Deposition) processing for metal depositions and interface tuning.
• Strong understanding of metal-semiconductor contact physics.
• Expertise in work-function tunings of metal and metal-alloy.
• Proficiency in modulating electron affinity through implantation or surface treatments of semiconductors.
• Familiarity with wide band-gap semiconductor materials and their interaction with metal/metal-alloys at various temperatures.
• Thorough fundamentals in Ohmic contact and Schottky diode physics, as well as the impact of defects and contaminations on electrical properties.
• Skilled at mentoring and transferring knowledge to junior staff members.
• Excellent communication skills to effectively address customers' needs, concerns, and solution requirements.

Role & Responsibilities:

• Responsibilities include diagnosing appropriate levels of metal/metal-alloy contaminations by oxygen and other contaminants; determining the root cause of contaminants, and establishing protocols for characterizations.
• Hands-on providing support for onsite metal PVD, including creating, running, and characterizing recipes to achieve the lowest resistances.
• Collaborates closely with equipment vendors and device engineers to optimize the metal-stack for device performances and robustness/reliability, from low to high temperatures.
• Lead data analysis related to implant-induced defects and cleaning issues on metal contacts with solutions development.
• Examines the work-functions of metal/metal-alloys suitable for Ohmic contact on SiC.
• Responsible for designing experiments for Ohmic contact on various SiC substrates with different doping types, determining their impact, and resolving issues to achieve the lowest specific contact resistances.
• Designing cleaning processes to obtain ideal Schottky diode using various metal/metal-alloys on SiC for high-performance applications.
• Work closely with cross-departmental and integration teams and in 3-5 years’ time develop a WBG backend process integration team of at least 4 persons.

Requirements:

• PhD Degree in Material Science, Physics, Electrical Engineering or related field.
• >8 years related industrial experience inclusing backend process module integration.
• Extensive hands-on experience in PVD (Physical Vapor Deposition) processing for metal depositions and interface tuning.
• Strong understanding of metal-semiconductor contact physics.
• Expertise in work-function tunings of metal and metal-alloy.
• Proficiency in modulating electron affinity through implantation or surface treatments of semiconductors.
• Familiarity with wide band-gap semiconductor materials and their interaction with metal/metal-alloys at various temperatures.
• Thorough fundamentals in Ohmic contact and Schottky diode physics, as well as the impact of defects and contaminations on electrical properties.
• Skilled at mentoring and transferring knowledge to junior staff members.
• Excellent communication skills to effectively address customers' needs, concerns, and solution requirements.

Job Description:

Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of IME to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in operations support in clean room to make sure projects are completed successfully and delivered on time.

This position is based in Singapore.

Responsibilities:

• Operate semiconductor equipment to perform processes, measurement, and inspection of wafers. (Include equipment setup, loading and unloading of wafers)
• Monitor basic equipment/process errors and perform recovery.
• Work with internal and external parties to align for tool time, execute process sequence and collect data to feedback to integration owner.
• Logistically transport wafer lots between equipment within cleanroom and between worksites.
• Identify and address potential areas for improvements such as cycle time, utilization, and cost.
• Perform chemical change/ top-up for equipment under supervision.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
• The candidate may be required to perform shift work (Mon-Fri).

Experience:

• NITEC/ Diploma in Electrical/Mechanical/Chemical Engineering
• Basic understanding on semiconductor process is preferred
• 1-3 years of experience in semiconductor processes (Litho, Etch, CVD, PVD, Plating, Metrology etc.) will be added advantages

Job Description:

Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of IME to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in operations support in clean room to make sure projects are completed successfully and delivered on time.

This position is based in Singapore.

Responsibilities:

• Operate semiconductor equipment to perform processes, measurement, and inspection of wafers. (Include equipment setup, loading and unloading of wafers)
• Monitor basic equipment/process errors and perform recovery.
• Work with internal and external parties to align for tool time, execute process sequence and collect data to feedback to integration owner.
• Logistically transport wafer lots between equipment within cleanroom and between worksites.
• Identify and address potential areas for improvements such as cycle time, utilization, and cost.
• Perform chemical change/ top-up for equipment under supervision.
• Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
• The candidate may be required to perform shift work (Mon-Fri).

Experience:

• NITEC/ Diploma in Electrical/Mechanical/Chemical Engineering
• Basic understanding on semiconductor process is preferred
• 1-3 years of experience in semiconductor processes (Litho, Etch, CVD, PVD, Plating, Metrology etc.) will be added advantages

As a University of Applied Learning, SIT works closely with industry in our research pursuits. Our research staff will have the opportunity to be equipped with applied research skill sets that are relevant to industry demands while working on research projects in SIT.

The primary responsibility of this role is to deliver on an industry innovation research project where you will be part of the research team to optimize the spray drying processes for collagen and gelatine powder production, ensuring high-quality and consistent output.

Key Responsibilities

• Manage research project with Principal Investigator (PI), Co-PI and team members to ensure all project deliverables are met
• Participate in brainstorming and ideation, conduct research and experiments, create functional models, and maintain documentation of design development
• Develop system from embodiment of concept to detailed design of parts and assemblies, including selection of standard components, through application studies, analyses and calculations
• Organise procurement of required electrical and mechanical components as well as commercial devices
• Guide students to carry out assembly of submodules, integration of system and testing of machines
• Coordinate maintenance of associated equipment with POD technical officers when required
• Perform risk assessment, and ensure compliance with workplace safety and health regulations

Job Requirements

• Bachelor's degree or higher in mechanical engineering, or related field.
• Professional-level competency in mechanical system and part design
• Strong prototyping skills
• Proficiency in CAD software, such as SolidWorks or Creo Parametric
• Mechanical engineering degree
• Minimum design experience of 5 years

Key Competencies

• Show strong initiative and take ownership of work.
• Demonstrates expertise in experimental design and execution, with good analytical thinking and problem-solving skills.
• Able to build and maintain strong working relationships with people within and external to the university.
• Good communication and interpersonal skills.

What you will do

1. DFT architecture exploration & evaluation for next-gen process node & package technology of MediaTek:

• Scan chain insertion & ATPG pattern generation
• Pattern validation through simulation & silicon analysis(pass/fail, shmoo, fail log, etc.)
• Diagnosis to help manufacture process improvement

2. Co-work with SoC architect, RTL designer, physical design engineer, and package engineer to define best architecture for 3D-IC:

• PPA(Performance/Power/Area) impact analysis & mitigation via DFT innovation
• Develop & integrate DFT-related RTL design modules to test chip

What you will bring

1. Master's Degree in EEE/ EE/ CE
2. Expertise in Synopsys and/or Mentor DFT tools, and HDL simulators like Synopsys VCS
3. Fluency in script language including but not limited to TCL/Perl/Python
4. Experience about MBIST with state-of-the-art SRAM structure & EDA tools is big plus
5. Skill for RTL design & integration, and physical failure analysis(PFA) will also be plus
6. Ability to think and work independently with different teams
7. Interest in understanding more details in entire design flow
8. Ability to use English for discussing technical details
9. With a minimum of 7 years relevant industrial work experience

About the company

MediaTek Incorporated (TWSE: 2454) is the world’s 5th largest global fabless semiconductor company. Joining MediaTek means becoming part of a team that powers over 2 billion ICs worldwide, enriching and enhancing everyday life. Our chipsets are integral to a wide range of products, from smartphones, mobile devices to home and IoT devices, in entertainment and multimedia products, and provide connectivity and communication solutions that keep people connected with friends and their families with access to online resources. Working at MediaTek offers you the opportunity to contribute to the world through the devices we use in our daily lives – it’s more than just a job, it’s a chance to make a meaningful impact.

Associate Financial Analyst (Process Solution)

12-month contract

Work Your Magic with us!

Ready to explore, break barriers, and discover more? We know you’ve got big plans – so do we! Our colleagues across the globe love innovating with science and technology to enrich people’s lives with our solutions in Healthcare, Life Science, and Electronics. Together, we dream big and are passionate about caring for our rich mix of people, customers, patients, and planet. That's why we are always looking for curious minds that see themselves imagining the unimaginable with us.

About This Role:

You will support and work hand in hand with the Financial Planning and Analysis team for the Southeast Asia region under the guidance of the Commercial controller. The Financial Planning & Analysis (FP&A) organization plays an important role as trusted business partners to businesses, supporting all analysis, reporting, and business planning needs. The team produce budgets, forecasts; create and analyze business metrics and identify cost savings opportunities; deliver economic insight into the relationships between costs and revenues to improve the financial success of the business going forward.

Key Responsibilities:

• Assist in handling day to day deliverables, weekly sales landing, monthly analysis & periodic forecasts exercises
• Assist in downloading, collecting, compiling, verifying information to provide controller with accurate and timely information for decision-making.
• Work with Client’s Business Services team to ensure accurate month end closing and follow up on clarifications.
• Drive & manage Capital expenditure (CapEx) reporting processes as well as collaborate with relevant teams for APAC CapEx projects.
• Any other ad hoc duties as required by APAC commercial controlling team

Requirement:

• Diploma or bachelor’s degree in finance or accounting or related fields
• Proficient in the use of MS Excel (Vlookup, Pivot) and MS Power-point.
• Understanding of management accounting with strong understanding of financial statements (P&L, Cash Flow, and Balance Sheet).
• A self-starter, curious, forward thinking and innovative.
• Possess strong, logical, and analytical thinking skills with attention to detail and accuracy.
• Hands-on team player who possesses a can-do attitude and is able to handle ambiguity.
• Good interpersonal skills with the ability to communicate effectively across all levels and build good working relationships.

Reg No: R22104540

EA License no: 94C3609

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

Job Description:

• To own, maintain and improve the following indices: Quality, Uptime and Cost.
• Sustain equipment KPI and make continuous improvements to enhance the performance.
• Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.
• Coordinate with both process and manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.
• Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.
• Manage the expenditure allocated for equipment maintenance without compromising on quality output.
• Continuous improvement of equipment KPI in terms of quality, uptime and costs.
• Plan and implement an effective Preventive Maintenance program on equipment.
• Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.
• Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.
• Participate in CIP programs to optimize equipment utilization and cost of maintenance.
• ecome the technical Expert for the respective machine specialization.
• ● Know how to use SPACE to monitor and analyze SPC charts. Know how to use JMP to analyze engineering experiments. Know how to use measurement instruments effectively in data collection.
• Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool weaknesses and derive the top 3 to 5 risk factors.
• Able to create PROMIS (SiView) DC OP and SPC charts.
• Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production.
• Wafer scrap reduction awareness and mindset.
• Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance to Junior Engineers.
• Self audit and update specifications to meet TS16949 Quality Standard requirements.
• Set Expectation and carry out performance appraisal for Technician or AE as instructed by Section Manager.

Job Requirements:

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
• Preferred 3 years of relevant work experience in Etch Equipment
• LAM & Oxide tools preferred
• An excellent team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications