Job Description

- Adopt innovative teaching methods and create an engaging learning experience for children/youths

- Create worksheets and lesson material

- Prepare and deliver lessons that facilitate active learning experiences
- Perform required classroom administration responsibilities

- Maintain a professional and proactive relationship with caseworkers

Job Requirements

- Bachelor's degree or equivalent

- Up-to-date with the latest MOE syllabus

- At least 2-3 years of relevant teaching experience

- Passion for teaching and nurturing students

- Able to travel

- Pleasant and friendly personality

- Lesson timings would be anytime between 2pm – 9pm on weekdays during school term, depending on the availability of clients

Rate:

Hourly rate of $30 to $75

• Perform general administrative duties related to the day-to-day operations of the school.
• Provide customer service to walk-in and call-in customers.
• Recommend music courses, enrolment, collect school fees.
• Sales of music books/instruments and inventory management.
• Preparation of music books/instruments/accessories order by the branches.
• Generation, Collation and Documentation of Reports.

Requirements

• Possess at least a GCE 'O' Level
• Proficiency in MS Office including MS Excel
• Meticulous, self-driven and resourceful
• Customer-oriented with good interpersonal and communication skills
• Able to work 4 days a week (Including Monday, Tuesday, Saturday) ; Duration : 6 to 9.5 hrs.
• We also open for the negotiation to work only 3 days part-time basis, compulsory working on Saturday
• Able to work at "retail hours" ( nights and weekends )

Responsibilities:

1. The primary role is to serve our salespersons or clients at the customer service counter or reception counter.

2. Process documents, collect commission (cash, cheque or online payments), sale of merchandise, use POS system, and handle office equipment (nets/credit card machines, copier machines, and computer terminals at the free seating area).

3. Data entry using our in-house systems (REMSPlus2, Admin module, e-submission) and using external systems (IRAS, HDB, CEA).

4. Manage walk-ins, emails, and telephone enquiries.

5. Frank mail and deposit at SingPost.

6. Collect and distribute mail.

7. Open and close the office, meeting rooms and training rooms.

8. Perform any other ad-hoc duties as and when assigned.

Requirements:

1. GCE ‘O’ Level and above.

2. Preferably someone who has work experience in customer service duties.

3. Excellent phone etiquette and possess good communication skills.

4. Ability to multitask and handle high volume of customers efficiently.

5. Computer literate in Microsoft Office.

6. Preference will be given to candidates who are available immediately or within short notice.

7. Need to be able to commit from 2 December 2024 to 30 April 2025.

Other Information

· Working Location : Toa Payoh, (HDB Hub near Toa Payoh MRT Station)

· Five (5) day work week, Monday and Friday : 8.30am to 5.30pm or 9.00am to 6.00pm. (With 1 Hour Break)

Interested candidates are invited to submit a comprehensive resume, stating the current and expected salary, date of availability via APPLY NOW button.

We regret that only shortlisted applicants will be notified.

As a Quality & Reliability Assurance Engineer in Global Quality, we are encouraged to conduct electrical failure analysis and data analysis of next-generation 3D NAND memory devices. To sustain and improve Micron's memory quality, and developing outgoing monitor strategies together with risk assessment and product disposition in deviation management in HVM (high volume manufacturing( environment.

Responsibilities and Tasks

• Develop outgoing quality and reliability monitor strategies of NAND products in production phase.
• Perform product failure analysis on rejects to identify the failure mode and mechanisms that will lead to successful corrective actions and/or preventive actions.
• Assist and consult on post qualification quality and reliability issues and assist in the analysis and disposition of these materials.
• Coordinate with Research and Development and Product Engineering teams to comprehend new reliability issues and how to test for and assess their impact to customer risk and reliability.

Requirements

• Excellent problem-solving and analytical skills with strong attention to details.
• Ability to communicate clearly and concisely both verbally and in writing is essential in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work optimally in cross-functional teams and handle pressure situations in a professional manner.
• Candidates with at least 2 years of experience in the semiconductor industry as QRA or Product Engineer are preferred but fresh graduates are welcomed to apply. Experience in flash memory debugging and failure analysis is a plus.
• Bachelor's or Master's degree Electrical Engineering, Electronics Engineering, or a related discipline.

• Participate in research and analysis to identify project requirements, conceptualizing plans, designing, and developing systems, establishing guidelines and goals, and creating strategy to optimize operational activities for new product introduction.
• Work with Engineering, Quality, Commodity and NPI to ensure success in new product development and launch.
• Manage and coordinate in earlier supplier involvement in new product introduction from part design phase through mass production, ensure critical timeline and target COSS are met.
• Ensures that Cost, Quality and Availability are achieved for product development phase and through their full life cycle.
• Manage supplier onboarding process and selection with integrity, alignment across value-chain and value engineering.
• Manage cost activities.
• Responsible in ensuring best-in-class cost, thru negotiation and/or tear down activities.
• Identifies cost drivers to influence design decision making towards target costing.
• Ensure product/module cost models and quotes are up to date at launch and effectively rolled out.
• Reviews and negotiates supplier terms and conditions exceptions to mitigate risk.
• Supports price negotiations with opportunities to drive short- and long-term cost reduction improvement.
• Builds strong, value-added relationships with suppliers, internal customers, and cross functional departments.
• Collaborates with Supplier Quality in the new supplier/component release process, including compliance and sustainability aspects.
• Partners Category team, ensuring BU product requirement and supplier technology alignment are included in building Commodity Strategy. Supporting and executing category strategy.
• Analyze lead times, identify critical paths, and prioritize demand requirements.
• Participates in project meetings/brainstorming sessions to identify solutions available.
• Performs other duties as assigned.

We are seeking a motivated and proactive Electrical & Electronics Engineering/ Electronics & Computer Engineering Intern to join our dynamic engineering team in Singapore. The intern will gain valuable hands-on experience in the design, development, testing, and troubleshooting of electrical and electronic systems. You will be working closely with experienced engineers and contribute to the ongoing development of projects that involve circuit design, hardware testing, and product development.

Role and Responsibiltities :

Circuit Design & Analysis: Assist in designing electrical and electronic circuits, including power supplies, analog and digital circuits.

Testing & Validation: Participate in testing prototypes, conducting experiments, and validating design specifications against real-world performance.

Hardware Prototyping: Help build and assemble prototype systems for various projects, ensuring accuracy and compliance with engineering standards.

Troubleshooting & Problem-Solving: Support the identification and resolution of issues in electrical/electronic systems, including testing components and sub-systems.

Documentation & Reporting: Assist in preparing technical documentation, test reports, and design specifications to support ongoing projects and future development efforts.

Collaboration: Work alongside with software developers/ engineer, and project managers, to develop integrated solutions.

Research & Development: Contribute to ongoing research in the field of electrical/electronics engineering, staying updated on emerging technologies and industry trends.

Ad-hoc Projects: Assist with various other engineering-related tasks, such as simulation work, software tools development, and equipment calibration.

Requirements:

Educational Background:

Currently pursuing a Diploma or a Bachelor’s degree in Electrical and Electronics Engineering, Electronics and Computer Engineering, or a related field.

Technical Skills:

Knowledge of circuit design and analysis.

Familiarity with Microsoft office e.g. Word, Excel, Powerpoint.

Basic understanding of microcontrollers (e.g., Arduino, Raspberry Pi).

Hands-on experience with oscilloscopes, multimeters, power supplies, and other lab equipment.

Understanding of embedded systems, PCB design, or power electronics.

Knowledge of industry standards and regulatory requirements for electrical systems.

Experience with CAD tools (e.g., AutoCAD ) for circuit board design is a plus.

Programming Skills:

Familiarity with programming languages (e.g., C ++, Python ).

Basic knowledge of embedded systems development is a plus.

Problem-Solving: Strong analytical and problem-solving abilities with attention to detail.

Communication Skills:

Good written and verbal communication skills to effectively collaborate within a team.

Team Player:

Ability to work in a team-oriented environment while also demonstrating initiative and independence.

Benefits:

Exposure to real-world engineering projects.

Mentorship and guidance from experienced professionals in the field.

Opportunity to develop skills in both hardware and software aspects of electrical/electronic systems.

Unified Communications (UC) Engineer/Analyst

Job Description:

• Primary handling voice incidents escalations
• Configuring and troubleshooting of CUCM, CME, Cisco Unity Connection, Cisco Unified CCX, Cisco IP Phones, Cisco IP Communicator, Cisco Jabber, Cisco Voice Gateways (SIP, H323, MGCP)
• Configuring Cisco IP Phones, Expansion Modules, Extension Mobility Profiles, Voicemail, Cisco Jabber, Cisco IP Communicator.
• Upgrading IP Phone firmware in CUCM and CME to fix vulnerabilities.
• Monitoring alerts, collecting traces and debugs for voice incidents involving call flow issues.
• Remediating all endpoints, gateways and servers and making sure all are 100% compliant.
• Engaging Cisco TAC and working along with them to resolve complex incidents.

Job Requirements:

• Degree / Diploma in computer or Electronics Engineering
• CCNP Cisco Collaboration certification
• Minimum of 14+ years of related IP telephony / Unified Collaboration /Telepresence implementation or Administration experience including some of the following:

-Knowledge with TELISCA Call Recording troubleshooting

-Setup & maintenance of Cisco Collaboration and meeting products such as CUCM, CUC, IMP, CMS, TMS.

-Capable to install, integrate, maintain, modify, improve, enhance and upgrade the hardware and software of the Cisco Collaboration products

-Experience in administration of Cisco UC servers in Cisco UCS platform

-Experience in setup & troubleshooting of H323, SIP Trunks, SCCP, MGCP Voice Gateways, etc

-Experience in Cisco IP Phones

-Experience in integration with AD, DNS, LDAP etc…

-Experience in Single Sign-On (SSO) setup and troubleshooting.

-Knowledge in Routing, Switching and Security

-Knowledge in Server, Local and Group Policy, User management, Services, etc

It would be appreciated if you can share with me your interest on the same.

Have a friend or family member who may be interested in taking the next step in their career? Help them out by referring them to Ennovatez.

You can email your resume to us at [email protected]

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide alignment

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

Requirements

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

Keen on the role? Apply now!

Benefits

1. Competitive Salary: Earn up to $3,000 basic per month plus variable bonuses and monthly incentives.
2. Work-Life: Flexible work schedule with office-in-lieu on public holidays and time-off for overtime.
3. Career Growth: Develop your skills with a fast-paced, dynamic team while gaining experience in customer service and operations.
4. Supportive Team Culture: Work in an inclusive, friendly, and collaborative environment where your contributions are valued.
5. Standby Perks: Receive a company phone for standby, with additional compensation (to be discussed during the interview).

Job Description

We are looking for a motivated and reliable Customer Service Officer to join our team! In this role, you will handle phone inquiries, manage data entries, and address customer complaints with the best solutions or alternatives. You will collaborate closely with the operations department to ensure smooth processes.

Roles & Responsibilities

• Handle phone inquiries and provide prompt and effective solutions.
• Perform data entries and maintain accurate records.
• Resolve customer complaints and provide alternative solutions when necessary.
• Work closely with the operations team to support service delivery.
• Take on other ad-hoc duties as assigned by the department.

Requirement

• Skills: Basic IT knowledge, good listening skills, and ability to work under pressure in a fast-paced environment.
• Personal Attributes: A good team player with strong interpersonal communication skills, meticulous attention to detail, and self-motivated.
• Work Schedule: Must be flexible to work shifts, on public holidays, and be willing to work overtime when required.

5) Additional Information

• Location: 88 Geylang Bahru, #01-2724, Singapore 339696.
• Salary: Up to $3,000 basic plus variable bonus and monthly incentives (company phone for standby).
• Working Hours: 8 am to 5 pm with varying schedules: Week 1 (6 working days), Week 2 (5 working days), Week 3 (6 working days), Week 4 (5 working days).
• Public Holiday: Work on public holidays will be compensated with office-in-lieu.
• Overtime: Overtime will be given time off.

Salary -

CNC Experience - ($4,000 - $4,500) + transport allowance

No Experience - ($3,800 - $4,000) + transport allowance

Mon - Fri, 8am - 5:15pm

Job Description:

● To repair & service CNC machines in the region

● To implement service programmes for customer service

● Machine Installation

● Documentation (Service report, Machine registration, filing and record)

Job Requirements:

● Minimum Diploma in Electrical / Mechanical / Mechatronics Engineering

● Possess valid Class 3 driving license

● Minimum 2 years experience in servicing CNC Turning or/and Milling Machines

● Singaporeans only

Daniel Wilson | Reg No.: R24125247

Recruit Now Singapore Pte Ltd | EA Licence No.: 21C0845

Responsibilities:

1. Responsible for packaging solutions and design, defining performance criteria for signal integrity (SI), power integrity (PI), and thermal performance.

2. Optimize power performance in packaging design, focusing on PI and SI parameters.

3. Manage collaboration and technical communication with packaging and testing vendors.

Requirements:

1. Bachelor’s degree or higher in Electronic Engineering, Microelectronics, Computer Science,

or a related field.

2. Minimum of 5 years of experience in packaging design and development, or experience in

project development at a design company.

3. Strong communication and coordination skills, teamwork spirit, and resilience under

pressure.

4. Proficiency in both written and spoken English and Chinese is a plus.

• Able to develop, plan and coordination of all M&E works
• Assis in implementation and review of plans specification
• Monitor Project status and submit progressive report to Project Manager
• Provide solutions for M&E technical issues
• Ensure control of engineering & technical documentation
• Ensure control of product delivery and corrective action implementation, construction machines are properly maintained and all testing/measuring/test equipment are calibrated and controlled
• Plan, orgnize the review and evaluate the work of consultants, contractors, and others.
• Able to perform value engineering
• Complicance with all necessary standards, code of practice and safety regulations

Requirements:

• Diploma/Degree/Bachelor Degree
• Minimum 2 years of relevant experience in construction work
• Able to work shift
• Able to works on Sunday(if necessary)
• 24 Hours on call

• Able to develop, plan and coordination of all M&E works
• Assis in implementation and review of plans specification
• Monitor Project status and submit progressive report to Project Manager
• Provide solutions for M&E technical issues
• Ensure control of engineering & technical documentation
• Ensure control of product delivery and corrective action implementation, construction machines are properly maintained and all testing/measuring/test equipment are calibrated and controlled
• Plan, orgnize the review and evaluate the work of consultants, contractors, and others.
• Able to perform value engineering
• Complicance with all necessary standards, code of practice and safety regulations

Requirements:

• Diploma/Degree/Bachelor Degree
• Minimum 3 years of relevant experience in construction work
• Able to work shift
• Able to works on Sunday(if necessary)
• 24 Hours on call

Responsibilities:

• Provide tier-3 technical support for robotic systems, including hardware, software, and firmware components.
• Diagnose and resolve technical issues reported by customers, collaborating with the technical team to escalate and address complex problems.
• Document and report recurring issues to the Technical team to support continuous improvement and product development.
• Facilitate knowledge transfer sessions, training, and technical briefings to empower the Customer Success team in providing top-tier support to customers.
• Participate in testing and validation of new robotic systems and updates, providing critical feedback to ensure customer needs and experiences are addressed.
• Maintain detailed records of technical issues, resolutions, and feedback from customers and the Customer Success team.
• Develop and update technical documentation, user manuals, and support guides to assist the Customer Success team and customers in effectively utilizing robotic systems.

Requirements:

• Bachelor’s degree in Robotics, Electrical Engineering, Mechanical Engineering, Computer Science, or a related field.
• 2+ years of experience in technical support
• Excellent problem-solving skills with the ability to diagnose and resolve complex technical issues.
• Strong communication and interpersonal skills, with the ability to effectively bridge gaps between technical and non-technical teams.
• This position may require occasional travel to customer sites.
• Good English communication skills (verbal and written).