The packaging technology office head will be a key team leader and an architect of advanced package pathfinding and technology development. The position will lead an technology office to be responsible for next generation technology roadmap and evolvement of wafer level and advanced packaging technologies including 2.5D and 3D structures. Candidate should have a passion of innovation and invention to create solutions and would be key IP contributor. Previous hands-on experiences in leading cross-functional teams by technical expertise to bring solutions to new products is required. Successful candidate should have experience with innovation incumbent, design, characterization, and volume production for high-performance, high-volume semiconductor devices. Candidate should have extensive direct experience in new process and material development for innovative packages. Close collaboration with customers and supply chain ecosystem is also required.
Key Qualifications:
- Ph.D. in mechanical, electrical or material engineering + 15 years is required
- Prior experience in advanced packaging (2.5D/3D, WLP, FC, SiP)
- Good understanding of chiplet architecture
- Experience in design, simulation (electrical, mechanical and thermal) of advanced package is preferred
- IC package or system product design experience is preferred though not required
Preferred Skills:
Strong communication skills, experience with global team members of different cultural backgrounds.
