Total 14 network engineer job vacancies in Singapore

Overall Job Objectives

This role is to support global business processes across sales, factories and business unit organizations.

We are looking for a resourceful candidate with a strong analytical capability, and able to utilize various systems for data evaluation. This position is based at our Regional Singapore office.

Core Responsibilities

• Build up cost models to provide package cost estimates and manufacturing readiness inputs to business unit, engineering and factory
• Support critical meetings with internal cross functional teams on product / package costing
• Develop relationships with factory, sales and business units to ensure alignment with industry and customer trends
• Responsible for production pricing maintenance duties, including approving pricing issues in SAP
• Assist global sales take-or-pay coordination and reconciliation
• Adhoc analysis of various revenue related items

Job Specifications

• BS degree in Engineering.
• Minimum 3 years of relevant experience in semiconductor industry.
• Direct experience and/or strong familiarity with semiconductor Substrate, wirebond or FlipChip opportunities is a plus.
• Demonstrated understanding of manufacturing processes and raw materials.
• Advanced Excel usage and large data set manipulations.
• Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
• Able to work independently and to multi-task, excellent communication and presentation skills and working across functional groups as well as cross-culturally.

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

This role is to support global business processes across sales, factories and business unit organizations, with a focus on assembly pricing activities.

We are looking for a resourceful teamplayer who is adept at utilizing and integrating data from multiple systems to put together pricing proposals. The candidate should be highly adaptable to changing business needs and possess strong analytical skills. This position is based at our Regional Singapore office.

Core Responsibilities

• Focus on OSAT pricing and costing activities for assembly packaging.
• Key responsibility for the initial 3 months will be on daily production price maintenance duties, and approving pricing issues in SAP
• Responsible on cost models preparation to provide cost estimates and manufacturing readiness inputs to business unit, engineering and factory.
• Respond timely to relevant pricing requests in RFQ systems through price benchmarking and profitability analysis.
• Oversee RFQ trend, win/loss effectiveness and RFQ cycle time efficiency
• Support critical meetings with internal cross functional teams on product costing
• Partner with Business Units, factories, and sales to assure integrated and profit maximizing approach.
• Adhoc analysis of various revenue related items

Job Specifications :

• BS degree in Engineering.
• Minimum 5 years of relevant experience in semiconductor industry.
• Knowledge in assembly packaging processes will be preferred.
• Familarity with SAP system.
• Advanced Excel skills and ability to manipulate large data set is a must.
• Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
• Excellent communication and presentation skills, both verbal and written
• Independent, able to multi-task, and collaborate with cross functional and cultural groups.

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Must-Have

• experience in Backend Semiconductor industry.

Core Responsibilities

• Build up cost models to provide package cost estimates and manufacturing readiness inputs to business unit, engineering and factory
• Support critical meetings with internal cross functional teams on product / package costing
• Develop relationships with factory, sales and business units to ensure alignment with industry and customer trends
• Responsible for production pricing maintenance duties, including approving pricing issues in SAP
• Assist global sales take-or-pay coordination and reconciliation
• Adhoc analysis of various revenue related items

Job Specifications

• BS degree in Engineering.
• Minimum 2 years of relevant experience in Backend semiconductor industry.
• Direct experience and/or strong familiarity with semiconductor Leadframe, Wirebond, Substrate or FlipChip opportunities is a plus.
• Demonstrated understanding of manufacturing processes and raw materials.
• Advanced Excel usage and large data set manipulations.
• Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
• Able to work independently and to multi-task, excellent communication and presentation skills and working across functional groups as well as cross-culturally.

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Substrate Engineer

This role is to support global business processes across sales, factories and business unit organizations, with a focus on assembly pricing activities.

Core Responsibilities

• Focus on OSAT pricing and costing activities for assembly packaging.
• Key responsibility for the initial 3 months will be on daily production price maintenance duties, and approving pricing issues in SAP
• Responsible on cost models preparation to provide cost estimates and manufacturing readiness inputs to business unit, engineering and factory.
• Respond timely to relevant pricing requests in RFQ systems through price benchmarking and profitability analysis.
• Oversee RFQ trend, win/loss effectiveness and RFQ cycle time efficiency
• Support critical meetings with internal cross functional teams on product costing
• Partner with Business Units, factories, and sales to assure integrated and profit maximizing approach.
• Adhoc analysis of various revenue related items

Job Specifications

• BS degree in Engineering.
• Minimum 5 years of relevant experience in semiconductor industry.
• Knowledge in assembly packaging processes will be preferred.
• Familarity with SAP system.
• Advanced Excel skills and ability to manipulate large data set is a must.
• Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
• Excellent communication and presentation skills, both verbal and written
• Independent, able to multi-task, and collaborate with cross functional and cultural groups.

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Staff Bumping R&D Engineer

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Leadframe, Laminates, or Flipchip, Bumping, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 2-5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Staff Leadframe R&D Engineer

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Leadframe, Laminates, or Flipchip, Bumping, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 4-10 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Staff Power Module R&D Engineer

Support process and efficiency improvement activities

• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Staff Lithography R&D Engineer

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Lithography, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Staff Flipchip Engineer, BGA

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Flipchip or Leadframe, Laminates, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Power Module R&D Engineer

Job Responsibilities:

• Support process and efficiency improvement activities
• Responsible to source new material for internal R&D activities
• Align with factories on product improvement and enhancement
• Initiate new product prototype with new innovative process, material and methodology
• Responsible for conducting & optimising advanced packaging processes (small scale, pre-research), e.g. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.;
• Contribute to developing advanced power module processes, output process files;
• Support product development team to transfer advanced packaging processes to HQ;
• Support process experts for advanced process technologies scouting, contribute to technical cooperation with universities and research institutes.
• Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process

Qualifications:

• Minimum of 2-5 years working experience in the same leadership capacity with similar semiconductor manufacturing
• Preferably with experience in bringing a product from R&D to low volume manufacturing
• Able to perform independently with minimal supervision and equipped with basic knowledge of the overall semiconductor assembly process as well as an understanding of automotive requirement
• A team player with strong analytical abilities, problem-solving skills in SPC, familiarity with 8 Discipline, Why-Why Analysis and Fault Tree Analysis and DOE will be an added advantage
• Knowledge and experience in Lean Manufacturing, Six Sigma and ISO/TS standards
• Candidate should possess at least a Degree or Master’s in Engineering (Mechanical, Electronics, Manufacturing, or Materials Engineering) or similar disciplines

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Overall Job Objectives

This role is to support global business processes across sales, factories and business unit organizations.

We are looking for a resourceful candidate with a strong analytical capability, and able to utilize various systems for data evaluation. This position is based at our Regional Singapore office.

Core Responsibilities

• Build up cost models to provide package cost estimates and manufacturing readiness inputs to business unit, engineering and factory
• Support critical meetings with internal cross functional teams on product / package costing
• Develop relationships with factory, sales and business units to ensure alignment with industry and customer trends
• Responsible for production pricing maintenance duties, including approving pricing issues in SAP
• Assist global sales take-or-pay coordination and reconciliation
• Adhoc analysis of various revenue related items

Job Specifications:

• BS degree in Engineering.
• Minimum 3 years of relevant experience in semiconductor industry.
• Direct experience and/or strong familiarity with semiconductor FlipChip opportunities is a plus.
• Demonstrated understanding of manufacturing processes and raw materials.
• Advanced Excel usage and large data set manipulations.
• Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
• Able to work independently and to multi-task, excellent communication and presentation skills and working across functional groups as well as cross-culturally.

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Overall Job Objectives

This role is to support global business processes across sales, factories and business unit organizations.

We are looking for a resourceful candidate with a strong analytical capability, and able to utilize various systems for data evaluation. This position is based at our Regional Singapore office.

Core Responsibilities

• Build up cost models to provide package cost estimates and manufacturing readiness inputs to business unit, engineering and factory
• Support critical meetings with internal cross functional teams on product / package costing
• Develop relationships with factory, sales and business units to ensure alignment with industry and customer trends
• Responsible for production pricing maintenance duties, including approving pricing issues in SAP
• Assist global sales take-or-pay coordination and reconciliation
• Adhoc analysis of various revenue related items

Job Specifications

• BS degree in Engineering.
• Minimum 6 years of relevant experience in semiconductor industry.
• Direct experience and/or strong familiarity with semiconductor BGA or CSP opportunities is a plus.
• Demonstrated understanding of manufacturing processes and raw materials.
• Advanced Excel usage and large data set manipulations.
• Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
• Able to work independently and to multi-task, excellent communication and presentation skills and working across functional groups as well as cross-culturally

• Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Project Data Engineer, R&D

Reports to: Project Management Leader

Overall Job Objectives

This position is responsible for tracking and managing WW R&D projects to ensure they are running efficiently in order to maintain Company’s leadership in packaging technologies. Key roles include managing master database, monitoring projects development status, resource uasage, generating monthly progress reports and development of Web platform to improve efficiency of data management and presentation.

Core Roles and Responsibilities

• Manage R&D program database. Enter new projects, update projects in progress, and remove from database once completed.
• Lead monthly project status meetings to collect the updated status on all projects run by R&D WW.
• Summarize R&D key metrics such as schedule, expense, etc. and submit a monthly report to Head of ATSH R&D for review.
• Improve reports and analysis upon request from R&D executives.
• Work with the relevant team to implement better project management flow in Company.
• Web platform development to improve efficiency of data management, analysis and presentation.
• Support Global R&D System team (in Korea) in web platform development if required.

Job Specifications:

• Bachelor Degree in Engineering, Computing or equivalent field
• 3+ years of working experience in data management
• Familiarity with semiconductor packaging industry is an added advantage
• Proficient with MS Office (Excel, Powerpoint). Familiarity with SAP, PLM preferred.
• Experience in using Python is required
• Understanding of multinational culture and interpersonal skills to work with R&D teams worldwide (Korea, Japan, Portugal, others)

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.

Reports to : Director, Business Operations

Must-Have knowlegde on Substrate - fcCSP or fcBGA

Overall Job Objectives

This role is to support global business processes across sales, factories and business unit organizations.

We are looking for a resourceful candidate with a strong analytical capability, and able to utilize various systems for data evaluation. This position is based at our Regional Singapore office.

Core Responsibilities

• Build up cost models to provide package cost estimates and manufacturing readiness inputs to business unit, engineering and factory
• Support critical meetings with internal cross functional teams on product / package costing
• Develop relationships with factory, sales and business units to ensure alignment with industry and customer trends
• Responsible for production pricing maintenance duties, including approving pricing issues in SAP
• Assist global sales take-or-pay coordination and reconciliation
• Adhoc analysis of various revenue related items

Job Specifications

• BS degree in Engineering.
• Minimum 3 years of relevant experience in semiconductor industry.
• Direct experience and/or strong familiarity with semiconductor FlipChip opportunities is a plus.
• Demonstrated understanding of manufacturing processes and raw materials.
• Advanced Excel usage and large data set manipulations.
• Strategic thinker with a proven ability to translate technical requirements/issues into the business context or vice versa.
• Able to work independently and to multi-task, excellent communication and presentation skills and working across functional groups as well as cross-culturally.

Interested applicants, please kindly email your update resume to [email protected]. We regret to inform that only shortlisted candidates will be notified.