Total 300 quality control engineer job vacancies in Singapore

As a Package Development Engineering Key Equipment Group (PDE KEG) engineer, you will be primarily responsible for identifying, selecting, evaluating new equipment (highly automated and computerized) / new technology to support current and future requirement for advantage packaging technology. You will also be responsible for installation and qualification of new equipment platform and handover to production group (Equipment Maturity Index, EMI). In addition, tasks include maintaining a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new equipment platform, collaborating with production group on upgrades of existing production equipment through continuous improvement projects

JOB RESPONSIBILITIES:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements

• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
• Create decision matrix for equipment and material selection

Evaluate and qualify new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

• Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

• Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
• Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
• Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support

Supplier Management & Engagement Program

• Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
• Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
• Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication (verbal & written) and presentation skills
• Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines

As an Manufacturing Central Team Assembly and Test Automation Project Engineer Automation Project Engineer, you are member of the Global Operations Team responsible for the worldwide portfolio of Automation projects aligned to Assembly and Test Operations objectives and corporate strategies and initiatives. You will develop, facilitate, and/or lead data-driven program management capabilities during Initiation, planning, and execution phases. You will identify risks early, manage issues, and drive initiatives to closure.

Job Responsibilities

• Collaborate with network teams - site automation, central/ site Process and Equipment Engineering, procurement, safety EHS in managing the automation projects
• Identify Project partners and manage expectations
• Identify and manage program projects dependencies
• Collect and document partner requirements
• Identify and resolve issues and conflicts
• Control project scope
• Communicate project expectations to team members and partners
• Coach, mentor, motivate, supervise, and provide recognition for projects
• Maintain project support through interaction with senior leaders
• Promote Program Management value and business practices to the organization
• Develop and deliver progress reports, proposals, requirements documentation, and presentations
• Identify potential crises, and develop and implement resolution plans
• Facilitate transition of system and business processes from project closure to long term sustainment
• Follows Company/Department Policies and Group expectations.
• Maintains a clean and safe working environment by proactively assessing the work (and surrounding) area and submitting work orders as needed.
• Recognizes and reacts to safety alarms (EES, fire alarm, MDA, etc.)
  Remains within Micron’s attendance policy.
• Displays a positive attitude toward Micron and its policies
  Holds self and other team members accountable for adherence to all company-wide safety procedures (PPE, EIPS).
• Observe all established EHS policies, requirements, and procedures.
• Understand and follow EHS guidelines included in work instructions.

Requirements:

- Bachelor's in Engineering or Science in fields such as mechanical, electrical, industrial, computer or automation.

- Minimum 3 years working experience in engineering semiconductor project management field

- Strong verbal and written communication skills

- Capability to lead teams and manage project team members

- Project Management Certifications are preferred

- Knowledge in automation, semiconductor process and systems are beneficial

- Experiences in supporting and leading global teams/projects

As a Package Development Engineering Key Equipment Group (PDE KEG) engineer, you will be primarily responsible for identifying, selecting, evaluating new equipment (highly automated and computerized) / new technology to support current and future requirement for advantage packaging technology. You will also be responsible for installation and qualification of new equipment platform and handover to production group (Equipment Maturity Index, EMI). In addition, tasks include maintaining a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new equipment platform, collaborating with production group on upgrades of existing production equipment through continuous improvement projects

JOB RESPONSIBILITIES:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements

• Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Engage in active participation in Package Development Engineering activities
• Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need
• Create decision matrix for equipment and material selection

Evaluate and qualify new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create and owner of purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional teams
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives
• Feedback loop for Continuous Improvement after mass volume production via collaborate with production and HVM team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

• Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyze the requirements to advance tool maturity level
• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

• Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
• Working with PCS, IT & Automation team to enable tool control system such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, IOT, ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
• Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory AMHS readiness and deployment from equipment perspective follow by working with IT & automation team to delivery full automation solution for production running support

Supplier Management & Engagement Program

• Working on several engagement forum from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
• Manage all the key and critical engagement activities between Micron and supplier to prioritize and enable quality and tool performance improvement
• Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques
• Minimum 3 years’ experience in related semiconductor industry or related manufacturing environment with technical knowledge on assembly and/or wafer bumping and/ or advanced packaging technology
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication (verbal & written) and presentation skills
• Understanding of business needs and customers’ requirement, able to participate in cross functional team environment
• Strong project management skills to ensure execution to timelines

As a Metrology/ Real-Time Defect Analysis (RDA) Engineer in MSB, you have the opportunity to work with a multi-functional team from different areas of the plant/ process areas to understand their tools and processes so as to create measurement recipes that can provide quick and accurate feedback on the product integrity, thus ensuring quality output. As technology advances, you will be constantly challenged with the need to innovate for newer, faster and better modes of monitoring. You will collaborate closely with vendors to explore best known methods to maintain high tool performance and embark on possible ways of cost reduction to ensure our product retains its competitiveness in the market. Additionally, you are required to work in both clean/non-clean room environment

Enable production Metro/RDA needs.

• Provide first level of support for engineering requests, recipe maintenance, tool recovery and basic troubleshooting of tool issues
• Set daily priorities and enable efficient communication.
• Schedule and perform preventive maintenance on assigned tool sets
• Ensure all Special Work Requests (SWRs) are processed correctly and in a timely manner
• Optimize tool maintenance schedules and utilization
• Resolve sampling strategy to meet business requirement

Ensure all Metro/RDA tool meet measurement and inspection standards.

• Set up tool qualification criteria, implement, supervising through SPC.
• Make decisions on how to address tools and products that are out of control for established SPC rules for both process and defect related issues
• Develop and handle projects designed to reduce cost, reduce tool measurement variability, improve availability, and find solutions to ongoing problems
• Partner with Process, Equipment Owners and vendors for equipment upgrades/enhancements to improve tool performance
• Perform periodic assessment, tool-to-tool matching and GR&R, etc. to ensure tool measurement accuracy.
• Evaluation and enable next generation tool to close metrology gaps.
• Partner with the metrology/inspection tool vendors to develop new hardware, software, and technologies.
• Perform tool evaluation and buy-off

Seek and drive methodology breakthrough to improve efficiency in metro/RDA function.

• Drive process improvement through new recipe creation that helps to provide accurate and faster feedback to the line, thereby improving the confidence level of the product.
• Participate in world-wide discussions for continuous improvement on the toolset(s) assigned across Micron sites.
• Set up processes, design and implement process monitoring, control methodologies.
• Establish business process standards, specifications and documents.
• Work with peer groups to test and vet new or continuously improve the Reaction Mechanisms and Procedures based on feedback from the end users.
• Write and publish reports that summarize projects, detection capability improvements, manufacturing productivity and cost reduction work.

Requirements:

• Bachelors in engineering/science/Statistics
• More than 2 years’ experience in Metrology/RDA in Semiconductor industry
• Knowledge of semiconductor Metrology/RDA equipment and understanding of Statistical Process Control (SPC), process control and its reaction mechanism
• Strong problem solving and critical thinking skills and able to identify root causes
• Ability to facilitate meetings and achieve cross area engagement /empower a group of people toward a common goal / work and lead team project.
• Good documentation skills with strong attention to details
• Validated strong analytical and data summary skills
• Experience in MSA (Measurement System Analysis) is an added advantage
• Experience in Python and Tableau is an added advantage
• Good communication skills

Keen on the role? Apply now!

Oversees the installation, modification, upgrade and maintenance of manufacturing equipment. Maintains current records on equipment manufacturers’ technical notices, upgrades and safety issues. Studies equipment performance and reliability. Establishes programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process. Provides technical support to the manufacturing equipment repair and process engineering organizations. Defines and writes preventative maintenance schedules.

As a Central PIE Yield Engineer / Senior Engineer / Principal Engineer at Micron Technology, Inc., you will be responsible for providing leadership to the global Micron network to drive yield, product quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

This role needs to centralize the project information, including achievements, design requirements and testing difficulties from multiple departments located in Japan, Taiwan, Singapore, US; and drive the project to meet specs within defined tight schedule.

Responsibilities and Tasks

• Promote worldwide alignment for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
• Drives yield breakthroughs by understanding the comprehensive test flow across steps, testing conditions, product design/operation and propose an effective solution for yield versus reliability requirements.
• Foster innovation to solve yield issues with the help of generating ideas from characterizing the device fail-modes using the deeper expertise in device architecture, physics, and available testing knobs.
• Lead a multi-functional team to build frontiers in the areas of yield improvement by demonstrating the knowledge of test flow, device, bench characterization, fab process and technologies.
• Strong collaboration with Product, Test, Quality and Fab Engineering to develop best in class process, BKMs and work towards alignment across fabs, tech-nodes and technologies to achieve benchmark yield performance.
• Maintain and improve knowledge and technical expertise, explore innovation opportunities with critical thinking and detailed approach.
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, Technology and Development, Product, Test and Quality Engineering.
• Communicate and respond to issues in a timely manner.
• Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.
• Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.
• Travel to Micron Fab locations as necessary for face-to-face work.

Requirements

• Bachelor’s / Masters / PhD in Electrical Engineering, Microelectronics, Physics, or related field of study.
• Knowledge in Semiconductor Device Physics, DRAM/NAND/Logic product operations, parametric/electrical test, and probe yield.
• Experience in Product, Test, Yield, Design Engineering will be added advantage.
• Experience on DRAM High Bandwidth Memory will be a plus to this job position.
• Good data analysis, debugging, problem solving, reporting and presentation skills.
• Good multi-tasking, verbal, and written communication skills.
• Strong interpersonal skills and customer/co-worker relationships. Validated teamwork skills with a strong focus on developing good team dynamics.
• Good organizational capabilities and ability to work effectively with minimal direction.
• Intermediate to advanced PC skills including Microsoft Office.
• Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.

Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will be managing and optimizing your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor or master’s in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 4 or more years of experience with proven track record of technical leadership in semiconductor manufacturing in Metro Real-Time Defect Analysis Process & Equipment Engineering. Experience in other Front-End areas, in Post Wafer Fabrication & High Bandwidth Memory technology
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill
• Excellent communication skills

Keen on the role? Apply now!

This is an exciting and fast-paced position! Our team Application Development & Support(ADS) delivers software solutions to leadership and engineers throughout Micron's global manufacturing network. As Operations Central Team (OCT) Software Development Engineer at Micron Technology, Inc., we have the chance to create and improve Micron systems and processes on a global scale.

We will collaborate with customers across departments and geographical sites to design, develop, innovate and support software throughout the development life cycle. Be part of the team to support efficient business processes by maintaining a focus on global alignment, and participating in efforts to research and influence technology roadmaps.

Responsibilities include, but not limited to:

• Demonstrate Micron core values People, Innovation, Tenacity, Collaboration, and Customer Focus
• Collecting requirements from customer requests
• Designing, developing, debugging, documenting, testing, and deploying applications
• Collaborating with other developers on the team
• Working closely with Business Operation Teams, Product and Application Development teams, and other internal customers during application development and deployment
• Training users on the use and maintenance of new applications

Project Description

• Join an agile team as one of the developers to develop a web solution for Micron globally including, but not limited to, API, ETL, and database
• Can be a new or existing running projects

Learning Outcomes

• Gain hands-on development experience in modern tools and pioneering tech stacks (Angular, OpenShift, Azure)
• Learn to work effectively in the IT agile development team to develop successful product with timely delivery
• Gain domain knowledge on semiconductor industry
• Learn problem-solving and analytical skills and good software engineering practices
• Develop communications, interpersonal, and other critical skills in the professional environments

Pre-requisites

• Proficient in Angular, .NET Core, C#, and SQL
• Knowledge of containerized deployment with Docker, Kubernetes, and OpenShift a plus.

Traits

• Strong analytical, problem solving, and interpersonal skills
• Motivated to work in dynamic and fast-paced environment
• Ambitious and driven to complete tasks independently while recognizing ways to improve processes
• Active team participation, partnership, and consensus-building skills
• Good verbal and written communication skills

Responsibilities

• Implements full software development process
• Collaborates multi-functionally with business users, project managers and other engineers to achieve elegant solutions.
• Develops high quality and innovative software design and solutions.
• Provides ongoing documentation, maintenance, support and improvements in existing systems and platforms.
• Provides 24x7 Support

Education Required

Bachelors Degree or equivalent experience in Computer Science or related field of study

Experience Required

3 years experience in 3 or more of the following:

• Experience in front-end web development (preferably Angular, ASP.NET)
• Proficiency in C# and Object Oriented Programming
• Proficiency in HTML, CSS, JavaScript
• Experience in RESTful Web API development (preferably ASP.NET Core, Node.js)
• Experience with Agile development methodologies
• Good understanding of one or more database technologies (MSSQL, ORACLE, Snowflake, MongoDB, CouchDB)
• Experience in SSIS, SSRS, Tableau, PowerBI or any Business Intelligence technologies Bonus if you have experience in Python and cloud programming, CICD (Azure), NiFi
• Knowledge of source code repositories (Git)
• Knowledge of SQA is a bonus

Working Location

1, North Coast Drive, Singpaore 757432

As Satellite Planning Engineer, you are responsible to work with the various central and site stakeholders to conduct strategic scenario and capital planning analysis. You will be closely involved in the Fab Scenario Optimization Study, Business Plan, Supply Chain and key processes such as Supply & Operation Planning (SnOP) and Model of Record (MOR).

This role requires flexibility and ability to maintain global relationship; good communication and presentation skills; and ability to provide clear and qualitative data analysis for the upper management to support decision making. You should possess detailed understanding on capacity planning, business process, and identifying opportunities to support scenario optimization.

Responsibilities and Tasks:

[Scenario]

• Apply optimization concept and technique to ensure optimal loading volume across horizon able to meet target bit (GB) and market share while considering new technode qual milestone and ramp planning.
• Apply industrial engineering concepts to model the capacity thresholds to support existing and future technology
• Ensure all the required scenario options are well analyzed. Call out opportunity and propose options for better return scenario
• Collaborate with Central teams to plan capacity requirements of future products and to quantify the impact on existing and future capital spend
• Using qualitative and quantitative analysis to explain scenario cause – effect relationship for tooling purchase and capital impact differences
• Provide yellow field cost of transition (CoT) for each technode and understand the correlation between theoretical CoT vs actual CoT
• Defining new technode CoT and understand the gap between budget vs actual technode capex
• Adhere to calendar requirements and agreements with respect to Business Planning Process
• Flexible and agile to changes in Business Planning
• Coordinate with all relevant stakeholders to ensure all the parameters updates are in-place so that can be utilized correctly for quarterly business plan study
• Create, Maintain and update Satellite Sharepoint
• Strive to streamline business efficiency and eliminate manual errors
• Manage complex projects across several different departments and sites
• Manage databases, scenario ownership and change control
• Analyze data to support financial decisions

​

[Capital]

• Perform baseline capital spend analysis to ensure overall cashflow across FY is kept neutral (unless driven by Scenario change)
• Improve capital spend forecast accuracy with site Planning/Procurement/Facilities
• Monitor actual spend performance vs projection for current and upcoming quarter with target variance of < +- 5%
• Monitor and understand with site stakeholders on the reasons for unexpected capital spend changes across fiscal year
• Work with site stakeholders to ensure accurate planning and supplier delivery date data inside Capital Asset Lifecycle Management (CALM
• Highlight any potential cashflow reduction or savings opportunities
• Keep track of the technode capex
• Work with site stakeholders to ensure actual scenario change bottoms up and eventual itemization is as per approved executive review targets
• Coordinate the CALM simulations with site stakeholders and ensure the simulations are able achieve net neutral and completed within committed timeline

Requirements:

• Master/Bachelor's degree in industrial engineering, manufacturing engineering, mechanical engineering, chemical engineering, computer Science
• Strong ability to perform data analysis and problem solving
• Strong data validation skills and reporting skills
• Ability to map relevant conclusions to support decisions making
• Ability to work closely and effectively with others in a team environment
• Strong verbal communication and presentation skills
• Exceptional customer focus
• Knowledge and practical application of statistics, data analysis and problem solving
• Independence and high determination to complete tasks in a timely manner

Probe Test Solutions Engineer will develop and maintain wafer level test programs to test functionality of NAND Flash products.

As a Probe Test Solutions Engineer, you will develop and maintain wafer level test programs to test functionality of NAND Flash products.

The general responsibilities of the position include but are not limited to the following:

• Develop and maintain wafer level functional test strategies and programs for semiconductor NAND Flash products
• Collaborate with various engineering and production groups to ensure test program, infrastructure and system readiness for new product introduction as well as high volume manufacturing
• Improve device yield, reliability and quality through test condition optimization, advanced redundancy analysis schemes, data analysis and test equipment hardware optimization
• Provide cost effective and innovative solutions for production test flow optimization with cutting-edge test time reduction methodologies
• Develop and release test programs to production in a timely manner
• Assist process and production teams by providing necessary engineering expertise to ensure smooth manufacturing operations

Requirement:

• Bachelors/ Masters in Electrical/Electronics/Computer Engineering or equivalent
• Showcases good programming skills and experience; Python/C/C++ knowledge
• Solid analytical problem-solving skills
• Excellent verbal and written communication skills
• Good understanding of semiconductor industry and semiconductor device physics
• Knowledge of Unix/Linux environment will be an added advantage
• Keen on semiconductor industry

Directs and coordinates engineering activities concerned with development, procurement, installation, and calibration of instruments, equipment and control devices. Determines conditions under which tests are to be conducted, and phases of test operations. Coordinates operational, functional and performance phases of tests. Analyzes and interprets test data. Prepares technical reports of for use by engineering personnel.

This role is within Package and Development Engineering (PDE) group of Micron. This is a global department with teams located in USA, Singapore, Malaysia, Taiwan, and India. As a PDPE (Package Device Product Engineer) in PDE, you will be responsible to prepare for new DRAM, NAND or MNAND products and coordinate resources, testing, and analysis over the lifecycle of the product. You will run data analysis and modelling, create, and maintain root cause analysis documentation, analyze parametric, probe level (Front End) and electrical test (Back End) data and respond to failures. In this role, you will work with various Technology Development (TD) & New Product Introduction (NPI) Engineering (Electrical Failure Analysis (EFA), Physical Failure Analysis (PFA), Assembly) and Manufacturing groups to find the root causes of the failed units.

Responsibilities and Tasks

• Enable new test signals in BE which would capture assembly related failures.
• Work with Test Solution Engineering (TSE) & Product Engineering (PE) to ensure standardize test coverages & chars. Define Char limits, and approval of any test related changes.
• Development of new out-of-control-action-plan (OCAP) and its sustenance
• Provide Lot disposition based on parametric data observation in case of out-of-control (OOC) trigger.
• Ensure that Silicon & assembly process meets Product expectations by extracting and analyzing Probe and BE test data.
• Participate in Phase Gate review meetings, presenting the data analysis and deciding on Phase Gate exits related to electrical Test data.
• Analyze test failures, coordinating EFA & PFA to identify the root cause. Implement fixes for fails (Fab process or Design or Assembly Process)
• Finding out the correlation of test failures to assembly process and updating the database with the signatures observed
• Support Global and Local material review board (MRB) in case of excursions and RMA related to package intrinsic design. This includes analyzing electrical test data for root cause analysis (RCA) and assessing the health of the contained material.

Requirements

• Bachelors/ Masters in Electronics, Device Physics, Applied Physics, Electrical
• Sound knowledge of device physics
• Knowledge in Engineering Statistics
• Experience in data (electrical) analysis and modelling (JMP, Spotfire is a plus)
• Experience in programming (Python or Perl)
• Effective communication skills in written and spoken English
• Good multitasking and organizational skills, able to make decisions in complex situations
• Excellent problem solving and analytical skills
• Experience in NAND / DRAM memory or related field
• Knowledge in semiconductor packaging assembly processes
• Experience in fabrication processes, electrical characterization techniques, metrology techniques

Job Description

As a Senior / Principle Engineer in PDE (Package Development Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will be managing and optimizing your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor / masters in electrical engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
• 4 or more years of experience in Semiconductor Manufacturing with proven track record of technical leadership in semiconductor manufacturing, preferably in MRDA Process & Equipment Engineering. Experience in other Front-End areas, in PWF & HBM technology is of greater advantage.
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill

Job Description:
As Frontend Central Product Integration Engineering (CPIE) team at Micron Technology, Inc., you will be responsible for leading new initiatives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with the highest quality and fastest speed through innovation and collaboration with mutli-functional teams. Your primary focuses include but not limited to:

• Initiate new data solutions and methodologies to:
1) identify process, test, and design improvement opportunities;
2) modeling, monitoring and aiming for tool performance benchmarking;
3) Process equipment prognostics and process integration optimization;
4) Identity test optimization opportunities for high product grade yield improvement.
• Collaborate with site Process & Equipment Engineering, Manufacturing(MFG), Product Integration Engineering (PIE) and Data Science (DS) team to establish feasibility of new initiatives, demonstrate business values, and prototype solution mock-ups;
• Partner with Global Quality (GQ), Product Engineering (PE), Central PEE(CPEE), Smart Mfg Artificial Intelligent (SMAI), Technology Development (TD), and Suppliers to deliver end to end solutions, implement BKM development and deployment to production.

Collaboration

• Partner closely with multi-functional teams to ensure successful communication and collaboration for project implementation.
• Detail oriented with the ability to work independently
• Dependability and able to work effectively in multi-functional teams.
• Facilitate and lead activities in redefining and optimizing current system, methods, tool, skill to be Best In industry.
• Manage priorities and enhancements to improve business processes and existing systems that are global in nature.
• Willingness to work during non-standard hours when needed to provide support to engineering teams at any Micron site.
• Strong growth mindset and willing to continue to learn, unlearn, relearn.

Communication

• Effective communication skills in verbal/written.
• Self-motivated. Able to work independently with minimal supervision.
• Able to travel as required to support department and company objectives.

Requirement and Technical Competency:

• Experience in PIE, Process & Equipment Engineering and Data Science. Understanding of Process/Product Integration will be advantageous;
• In depth knowledge of processes, equipment and control system;
• Proficiency in data analytical tools such as Y3, JMP, Python to perform numerical experiment. Proficiency in Statistical/Machine Learning will be additional advantageous;
• Proven track record to make decisions, multi-task, and solve problems and address root causes.
• Exhibit critical thinking to find opportunities.
• PhD/Masters/Bachelors with relevant course of study and experience

Global Facilities Quality Senior Program Manager

Description

As a Global Facilities Quality Senior Program Manager, you will work closely with all the major functional organizations within Global Facilities, & with the world-wide site Facilities, Global Quality and other major corporate organizations to drive Quality systems projects/programs from initiation to completion. These projects/programs are critical to the success of Facilities and the overall network.

Your responsibilities will include, but are not limited to, the following:

• Collaborate with Global & Site Facilities team to proactively manage projects/programs, such as Management of Change (MOC), Failure Mode and Effect Analysis (FMEA), Calibration, Effective Problem Solving (EPS), Global Deviation Management System (GDMS), Risk-Based Thinking (RBT) Risk & Opportunity (R&O) depository, etc. to enhance “Manage Facilities” Quality Management System (QMS) Business Process (BP).
• Creating, leading, driving & maintaining Projects/Programs, including project definition, work breakdown structures, schedules, communication plans, scope documents, and stakeholder analysis; organizing and coordinating project meetings; developing meeting presentations, agendas, minutes, tracking and following up on action items and early identification and resolution of project risks, establishing of metrics, training, software and measuring and monitoring of program status.
• Supporting the Global Facilities Quality Core Team meetings to drive alignment and continuous improvement to support Manage Facilities QMS BP. This includes:Creating and monitoring metrics to measure, monitor and drive continuous improvement of the BP.
  Maintenance of Central Governance repository platform to support Manage Facilities QMS process and all Quality roadmap
  Implementation of critical new business processes that support continuous manufacturing improvement
  Participating and leading Business Process improvement projects on Reliability and Cost projects/programs which contributes directly to Effectiveness & Efficiency KPIs. This includes the implementation of project management within Facilities organization.
  Managing external audits including setup, coordination and successful follow up with the Global Facilities organization. This includes the identification and implementation of QMS processes and tools to enable continued success with customers.
  Enhancing and driving a proactive process based on internal audit program and tracking and supporting any NC follow up through close out. And incorporating lessons learned to continually improve the QMO business processes.
  Managing the communications and access to information from the QMS program and projects through various tools and approaches such as SharePoint web pages, reports and other means
  
• Supporting Global Fac Work-Force Development (WFD) to establish and maintain Global Fac training plans, training assignment, Training Needs Analysis (TNA), establishing to Learning Items, quizzes, and tracking of assigned training status across Global Fac network. Supporting Global Fac Documentation to maintain Global Fac Controlled Document Library, including enforcing documentation control, publishing of ECNs notifications, & conducting Periodic Document Review (PDR).

Qualifications

The successful candidate for this position will have:

• Excellent skills for leading or facilitating multi-organizational teams to success on complex multidimensional projects/programs
• Excellent communication skills to build teams comprised of key skills, to drive progress to plan and to get management support and buy-in for complex projects/programs
• Ability to develop and maintain positive, cooperative, team-oriented relationships with peers, coworkers, management, customers, and auditors
• 2 or more years of Facilities Semiconductor industry engineering experience
• Skills in the creation and management of projects/programs (TABLEAU reports, Sharepoint Online (SPMO), etc)
• Working knowledge and drive quality programs such as MOC, FMEA, Calibration, GDMS, Error-Proofing, etc

Senior Quality Management Systems EngineerEducation

• Bachelor’s degree in engineering or equivalent
• Project/Program management experiences are preferable
• ISO or IATF Audit experience including training and certification are preferable

Workplace

• Travel Required : Yes – Domestic and International travel as required by business needs
• Environment : Office
• Shift : Normal shift (8+ hour)
• GJS : E2 to E3, or P2 to P3

Leads people who are responsible for internal business projects and programs involving department or cross-functional teams of subject matter experts, delivering products through the design process to completion. Plans and directs schedules as well as project budgets. Monitors the project from inception through delivery. May engage and oversee the work of external vendors. Assigns, directs and monitors system analysis and program staff. These positions' primary focus is project/program management, rather than the application of expertise in a specialized functional field of knowledge although they may have technical team members.

As a Senior Package Design Engineering (PDE) Central Engineering System and Analytics (CESA) Engineer, you will develop integrated solutions to empower Backend Operations to make data-driven and heuristics-based decisions. You will work across Global Operations and sites to improve Cost, Scale, Quality, and Cycle Time by defining and designing data architecture and collaborating with key partners.

Responsibilities

• Yield Enhancement (YE) lots analysisLead YE lot analysis including reconstructing fuse identififaction (FID) for traceability, statistic comparison for different group
  
• Yield modelling / pareto benchmarkingIdentify actionable opportunities from YE lots
  Develop and improve Yield Models for HBM
  Periodically improve models based on actual performance
  
• Best Known Methods (BKM) DeploymentDevelop BKM’s for YE and drive implementation
  Identify/align BKMs and monitor implementation
  Works with different teams in the identification of critical metrics

Requirements:

• PhD/Masters/Bachelors in Statistics, Mathematics, or a related field; advanced degree preferred.
• Minimum of 3 years of experience in semiconductor manufacturing or related fields
• Preferably with experienced in Package Design Engineering and Yield Enhancement
• Strong understanding and knowledge of semiconductor manufacturing processes and technologies.
• Proficiency in statistical/machine learning and statistical techniques skills will be additional advantageous;
• Experience in MRDA will be a plus
• Proven ability to make decisions, multi-task, and solve problems and address root causes.
• Exhibit critical thinking to see opportunities.
• Effective communication skills in verbal/written.
• Self-motivated. Able to work independently with minimal supervision.
• Able to travel as required to support department and company objectives.

Responsibilities include, but not limited to:

• Responsible for in-depth data analysis to look for sighting that is detected from reliability testing on certain cell marginality.
• To work closely with cross functional team to drive for cause, cell mechanism understandings and mitigation plan (device and process) when sightings of cell marginality are noted.
• Look into volume reliability data to probe data correlation to look for signals for cell metrics/kill limit recommendation to guardband intrinsic reliability capability.
• Enable proactive methodology for cell reliability analytic study on both die and wafer level assessment using advanced product-dispo techniques.
• Enable proactive methodology for defectivity (DPM) reduction at wafer level using advanced product-dispo techniques.
• Develop state-of-art and advanced algorithms, encompassing advanced models to boost and enhance data-mining and pattern recognition for quality and yield improvement.
• Work with Product/Fab/Engineering teams on product issues (yield/cell/qualification/defectivity/RMA/deviations) in problem analysis, data-mining and modeling, to provide optimal disposition solution.
• Implement and validate product-dispo solution with minimal yield impact and to track effectiveness of solutions.
• Develop understanding of test flows and product-dispo framework and make use of big Data to highlight strength and weaknesses in production process and improve quality of material produced with lower cost and faster cycle time.

Minimum Qualifications:

• Bachelor in Electrical Engineering.
• Strong drive and excellent written and verbal communication skills, including ability to effectively communicate complex technical ideas/concepts.
• Knowledge of Python/MySQL/ C programming will be an added advantage.
• Strong analytical and problem-solving skills, with the ability to find creative solutions to difficult problems
• Effective communication skills in written and spoken English
• Good multitasking skills and ability to set priorities in a fast moving, dynamic environment
• Self-motivation and enthusiasm

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS Front end/interconnect module. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

Product Integration Engineering team strives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with highest quality and fastest speed through innovation and collaboration with multi-functional team. With the diversity of technology in DRAM/NAND and geography (TD development sites – Boise/Japan, 5 manufacturing sites – US (F6), Taiwan (F11/F16), Japan (F15) and Singapore (F10)), Frontend Central PIE team will be responsible to identify best-known-method holistically, align best-known-method timely and implement improvement systematically across the network. As FE Central PIE Standardization & Metrics Senior Engineer you will be responsible to lead the the team on:

• Drive for alignment and standardization across various fabs on Best-Know-Methods (BKMs)
• Develop Metrics to measure the standardization, sustainability, scalability and synchronization of the BKMs.
• Identify gaps in current programs and use SMART metrics to drive effectiveness and efficiency on program deliverables.
• Transform yield SEAL and SWATs to achieve cPIE missions, improving network resource/talent leverage.
• Constantly drive productivity and eliminate inefficiency / ineffectiveness through metrics and reports automation, drive data to be accurate, accessible and comprehensive.
• Collaborate with various multi-functional teams on yield reports, develop business process to optimize current system with clear roles and responsibility.
• Promotes cPIE teams alignment and collaboration with crtical metrics /metrics definition.
• Collaborate with WFD to standardize network PIE training curriculum, connect with cPIE and network PIE to build training courses.
• Develop human resource strategies to attract, retain and reward talent and effectively deploy them to enhance every individual’s potential
• Engage team members and drive accountability, performance driven culture through clear communication, formal and informal feedback, goals and critical metric
• Drive diversity, equality, and inclusive working environment and foster teamwork and trust in the organization
• Effectively manage team’s internal and worldwide meeting structure. Ensure meetings are efficient, effective and targeted to achieve required outcomes.
• Maintain knowledge of equipment and materials safety concerns. Take a proactive approach to safety, and apply corporate and site safety resources for partner concern issues as appropriate.
• Maintain a strong and open relationship with peer group and managers in other functional areas within CPIE and outside organizations such as Fab, FE PMO/SIC/OCT and Global Quality.
• Travel to Micron sites as necessary for face to face collaboration.

Requirements:

• Bachelor’s Degree in Engineering and related field of study
• 2 years experience in engineering field
• Applicants must have a proven ability to collaborate globally and influence by indirect leadership to drive resourcing to critical projects across Micron
• Applicants must have a proven capability in dealing with complexity and an ability to use resources effectively to bring clarity to required actions
• Applicants must hold a record of performance excellence for current area of responsibility; and are recognized as having demonstrated successful leadership characteristics both in present and past jobs
• Applicants must have demonstrated the ability to solve problems across multi-functional groups, both within and outside their department/Site

Description

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Diffusion team on the key technology issues that need Technology Development (TD) breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise TD Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.
• Ownership of module business process

Requirements

• PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Physics are welcomed to apply.
• Minimum 4 years of relevant experience in Diffusion process development.
• A deep understanding of flow dynamics , thermodynamics, physical phenomena and their direct application to Diffusion deposition in various deposition methods.
• An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects.
• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 2 - 4 months at a stretch to work on technology development.

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide alignment

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

Requirements

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

Keen on the role? Apply now!

As a Senior Industry 4.0 (I4.0) Analyst at Micron Technology, Inc., you will report to the Smart Manufacturing and Artificial Intelligence organization. The team defines, drives and delivers end to end smart manufacturing solution, integrated across functions of the business. The team will investigate applying industry-leading the best methodologies in automation, AI and machine learning to enhance Micron’s product development, business, and administrative processes across the company.

Responsibilities and Tasks

• Lead the analysist for complex business problems and issues using data from internal and external sources to provide insight to decision-makers. Identifies and interprets trends and patterns in datasets to locate influences.
• Constructs forecasts, recommendations and strategic/tactical plans based on business data and market knowledge.
• Creates specifications for reports and analysis based on business needs and required or available data elements.
• May provide consultation to users and lead cross-functional teams to address business issues.
• May directly produce datasets and reports for analysis using system reporting tools
• Understands business problem and translates user requirements into technical language and vice versa for data science / technical solution / IT teams.
• I4.0 Analyst with strong domain knowledge is preferred and will bridge the gap between users and developer team
• Accountable to ensure modules / functionalities address current metrics gaps and new business opportunity
• Translating project expected project metrics gain into dollar values, partnering with Finance
• Defining priority for projects for strategic pillar roadmap provided by Strategy Pillar Leader
• Conduct diagnostic and understand gaps and areas of improvement in current IIoT solutions and ways of working
• Work with PDE, Data Scientist, System Architect and IIoT end users to design & define requirements and analyze information, production interdiction that related to the adoption of IIoT for Smart Manufacturing
• Ensure optimization and standardization of tools and processes leveraging central team business partners to allow I4.0 solutions to be scaled sustainably across Micron Backend sites
• Develop business case, including impact validation approach, ROI of potential solutions and prioritize & propose projects for implementation
• Lead projects and activities that will require the coordination, support, and management of resources from global teams
• Provide expert functional and process guidance on system interfaces and capabilities

Qualifications

• Master/Bachelor's Degree in Electrical Engineering, Specialized in Data Analytic.
• At least 5-7 years of work experience in Assembly & Test and Post Wafer Fab (PwF) Process & Equipment Engineering or similar operations functions, good knowledge in High Bandwidth Memory (HBM) production is preferred
  
• Familiar with Composite Metro solution development, systems and solutions for high volume and high mix production environment
• Good interpersonal skills with demonstrable ability to effectively lead and present to small and large groups
• Proven ability to work multi-functionally with peers, senior and mid-level management
• Peer leadership and relationship management skills
• Strong analytical and problem-solving skills
• Highly organized and ability to remain flexible to the changing business needs

About Micron
As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and High Bandwidth Memory. Our solutions are purpose built to demonstrate the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

Analyzes complex business problems and issues using data from internal and external sources to provide insight to decision-makers. Identifies and interprets trends and patterns in datasets to locate influences. Constructs forecasts, recommendations and strategic/tactical plans based on business data and market knowledge. Creates specifications for reports and analysis based on business needs and required or available data elements. May provide consultation to users and lead cross-functional teams to address business issues. May directly produce datasets and reports for analysis using system reporting tools.

As a Quality & Reliability Assurance Engineer in Global Quality, we are encouraged to conduct electrical failure analysis and data analysis of next-generation 3D NAND memory devices. To sustain and improve Micron's memory quality, and developing outgoing monitor strategies together with risk assessment and product disposition in deviation management in HVM (high volume manufacturing( environment.

Responsibilities and Tasks

• Develop outgoing quality and reliability monitor strategies of NAND products in production phase.
• Perform product failure analysis on rejects to identify the failure mode and mechanisms that will lead to successful corrective actions and/or preventive actions.
• Assist and consult on post qualification quality and reliability issues and assist in the analysis and disposition of these materials.
• Coordinate with Research and Development and Product Engineering teams to comprehend new reliability issues and how to test for and assess their impact to customer risk and reliability.

Requirements

• Excellent problem-solving and analytical skills with strong attention to details.
• Ability to communicate clearly and concisely both verbally and in writing is essential in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work optimally in cross-functional teams and handle pressure situations in a professional manner.
• Candidates with at least 2 years of experience in the semiconductor industry as QRA or Product Engineer are preferred but fresh graduates are welcomed to apply. Experience in flash memory debugging and failure analysis is a plus.
• Bachelor's or Master's degree Electrical Engineering, Electronics Engineering, or a related discipline.

As the Equipment Supplier Quality Principal Engineer, you will lead a global team to ensure the highest quality standards for equipment supplied to our company. You will be responsible for establishing and maintaining strong relationships with critical suppliers, managing supplier quality governance processes, and driving continuous improvement programs. This role requires collaboration with various departments, including development, engineering, manufacturing, and procurement, to meet the business needs and ensure supplier compliance with quality management systems.

Key Responsibilities:

• Lead and manage a global team of Supplier Quality Engineers to achieve best-in-class supplier quality performance.
• Establish and maintain close relationships with critical suppliers' management teams and internal stakeholders.
• Ensure consistent management and deployment of quality requirements and supplier quality governance processes.
• Drive continuous improvement programs with critical suppliers to enhance quality performance.
• Ensure suppliers deliver the highest possible quality materials and comply with Quality Management System (QMS) requirements, standards, and other quality safeguard programs.
• Conduct regular audits and assessments of supplier processes and quality systems.
• Develop and implement supplier quality metrics and performance monitoring systems.
• Collaborate with development, engineering, manufacturing, and procurement teams to resolve quality issues and implement corrective actions.
• Provide training and support to suppliers on quality standards and requirements.

Qualifications:

• Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, or a related field.
• Minimum of 8-10 years of experience in supplier quality management, preferably in the semiconductor or electronics industry.
• Strong knowledge of quality management systems, standards, and methodologies.
• Proven experience in leading and managing a global team.
• Excellent communication and interpersonal skills.
• Strong analytical and problem-solving abilities.
• Ability to work effectively in a fast-paced and dynamic environment.

Preferred Qualifications:

• Master's degree in a related field.
• Certification in quality management (e.g., Six Sigma, ISO 9001).
• Experience with supplier quality management in a multinational corporation.

This is an exciting and fast-paced position! Our team Application Development & Support(ADS) delivers software solutions to leadership and engineers throughout Micron's global manufacturing network. As Operations Central Team (OCT) Software Development Engineer at Micron Technology, Inc., we have the chance to create and improve Micron systems and processes on a global scale.

We will collaborate with customers across departments and geographical sites to design, develop, innovate and support software throughout the development life cycle. Be part of the team to support efficient business processes by maintaining a focus on global alignment, and participating in efforts to research and influence technology roadmaps.

Responsibilities include, but not limited to:

• Demonstrate Micron core values People, Innovation, Tenacity, Collaboration, and Customer Focus
• Collecting requirements from customer requests
• Designing, developing, debugging, documenting, testing, and deploying applications
• Collaborating with other developers on the team
• Working closely with Business Operation Teams, Product and Application Development teams, and other internal customers during application development and deployment
• Training users on the use and maintenance of new applications

Project Description

• Join an agile team as one of the developers to develop a web solution for Micron globally including, but not limited to, API, ETL, and database
• Can be a new or existing running projects

Learning Outcomes

• Gain hands-on development experience in modern tools and pioneering tech stacks (Angular, OpenShift, Azure)
• Learn to work effectively in the IT agile development team to develop successful product with timely delivery
• Gain domain knowledge on semiconductor industry
• Learn problem-solving and analytical skills and good software engineering practices
• Develop communications, interpersonal, and other critical skills in the professional environments

Pre-requisites

• Proficient in Angular, .NET Core, C#, and SQL
• Knowledge of containerized deployment with Docker, Kubernetes, and OpenShift a plus.

Traits

• Strong analytical, problem solving, and interpersonal skills
• Motivated to work in dynamic and fast-paced environment
• Ambitious and driven to complete tasks independently while recognizing ways to improve processes
• Active team participation, partnership, and consensus-building skills
• Good verbal and written communication skills

Responsibilities

• Implements full software development process
• Collaborates multi-functionally with business users, project managers and other engineers to achieve elegant solutions.
• Develops high quality and innovative software design and solutions.
• Provides ongoing documentation, maintenance, support and improvements in existing systems and platforms.
• Provides 24x7 Support

Education Required

Bachelors Degree or equivalent experience in Computer Science or related field of study

Experience Required

3 years experience in 3 or more of the following:

• Experience in front-end web development (preferably Angular, ASP.NET)
• Proficiency in C# and Object Oriented Programming
• Proficiency in HTML, CSS, JavaScript
• Experience in RESTful Web API development (preferably ASP.NET Core, Node.js)
• Experience with Agile development methodologies
• Good understanding of one or more database technologies (MSSQL, ORACLE, Snowflake, MongoDB, CouchDB)
• Experience in SSIS, SSRS, Tableau, PowerBI or any Business Intelligence technologies Bonus if you have experience in Python and cloud programming, CICD (Azure), NiFi
• Knowledge of source code repositories (Git)
• Knowledge of SQA is a bonus

Working Location

1, North Coast Drive, Singpaore 757432

Project Description

• Join an agile team as one of the developers to develop a web solution for Micron globally including, but not limited to, API, ETL, and database
• Can be a new or existing running projects

Learning Outcomes

• Gain hands-on development experience in modern tools and cutting-edge tech stacks (Angular, OpenShift, Azure)
• Learn to work effectively in the IT agile development team to develop successful product with timely delivery
• Gain domain knowledge on semiconductor industry
• Learn problem-solving and analytical skills and good software engineering practices
• Develop communications, interpersonal, and other critical skills in the professional environments

Pre-requisites

• Proficient in Angular, .NET Core, C#, and SQL
• Knowledge of containerized deployment with Docker, Kubernetes, and OpenShift a plus.

Traits

• Strong analytical, problem solving, and interpersonal skills
• Motivated to work in dynamic and fast-paced environment
• Ambitious and driven to complete tasks independently while recognizing ways to improve processes
• Active team participation, partnership, and consensus-building skills
• Good verbal and written communication skills

As a Facilities Mechanical Engineer, you will be leading engineering and maintenance works in the fields of Mechanical equipment and system on site, to achieve continual improvement to system robustness, reliability and efficiency with the necessary guidance and direction from Facilities organization, to achieve facilities department, site, facilities corporate and company goals.

Job Responsibilities

• Plan and implement preventive and corrective maintenance programs for Facilities mechanical systems including HVAC, exhaust systems, scrubbers, process cooling water, chillers, boilers, cooling towers, compressed air systems, Fire protection system and cleanroom air systems to ensure maximum equipment uptime and reliability.
• Plan, design and lead mechanical system expansion projects to facilitate tool utilities demand of future technology of manufacturing equipment.
• Plan, design and lead mechanical engineering projects includes new construction, system upgrading and quality improvement.
• Respond and problem solving of system issues and production interruptions to mechanical related systems.
• Perform capacity tracking and planning for mechanical systems.
• Enforce to company’s environmental safety health policy and procedure, standard operating procedure with risk assessment, good housekeeping standard and quality policy when performing work.
• Apply computer base software to document and analyses records of maintenance work order, equipment history and project tracking.
• Maintain maintenance record for system fault history traceability.
• Proficient in quality tool such as 8D & 5 WHY analysis for troubleshooting or incidents.
• Initiate and lead energy savings & sustainability projects.

Job Requirements

• Bachelor’s degree in Mechanical engineering.
• Design and Engineering background of mechanical system such as HVAC system and Exhaust system will be of good advantage.
• Ability to understand and use schematic, single-line drawing and related equipment and system documentation.
• Ability to work in a team environment with various professional level.
• Considerable knowledge and application of problem solving and data analysis methodology.
• Considerable knowledge of maintenance practices and procedure and installation work.